Patent classifications
H01S5/0239
OPTICAL APPARATUS
An optical apparatus includes: an optical component opposed to and spaced apart from a light-emitting surface through which laser light is emitted; a case that houses a semiconductor laser element and the optical component and includes an introduction port for introducing gas and an exhaust port for exhausting the gas; and a flow passage section (i.e., a tubular body) including a spray port for spraying the semiconductor laser element with the gas introduced from the introduction port.
OPTICAL APPARATUS
An optical apparatus includes: an optical component opposed to and spaced apart from a light-emitting surface through which laser light is emitted; a case that houses a semiconductor laser element and the optical component and includes an introduction port for introducing gas and an exhaust port for exhausting the gas; and a flow passage section (i.e., a tubular body) including a spray port for spraying the semiconductor laser element with the gas introduced from the introduction port.
OPTOELECTRONIC SEMICONDUCTOR COMPONENT WITH INDIVIDUALLY CONTROLLABLE CONTACT ELEMENTS, AND METHOD FOR PRODUCING THE OPTOELECTRONIC SEMICONDUCTOR COMPONENT
A laser light source may include an arrangement of surface-emitting semiconductor lasers to which a voltage is applied such that an operating current is below the threshold current and an intrinsic emission of the surface-emitting semiconductor laser is prevented. The laser light source also comprises a first semiconductor laser which emits radiation that enters the surface-emitting semiconductor laser such that induced emission takes place via the injection locking mechanism and the individual surface-emitting semiconductor lasers emit laser light having the same wavelength and polarisation direction as the irradiated radiation. The emission frequency of the first semiconductor laser can be changed by changing the operating current.
SOLID-STATE DEVICE
A solid-state device, and use and formation thereof. The device includes a light emitter (102) that emits light with abeam propagation direction and includes an emitter epitaxial layer stack (940); a light routing medium (103) in optical communication with the light emitter; and a light detector (104) in optical communication with the light routing medium, which detects light emitted by the light emitter and includes a detector epitaxial stack (945). The light emitter and detector are monolithically formed on a semiconductor substrate. The emitter and detector epitaxial layer stacks include different pluralities of layers of a single epitaxial layer stack. The beam propagation direction is either in-plane with the single epitaxial layer stack and the light detector detects light out of plane with the single epitaxial layer stack, or out of plane with the single epitaxial layer stack and the light detector detects light in plane with the single epitaxial layer stack.
LIGHT-EMITTING DEVICE
A light-emitting device includes: a plurality of semiconductor laser elements; a package having a hermetically sealed space, with the plurality of semiconductor laser elements arranged in the space; an optical member fixed to the package; and a plurality of adhesives including a first adhesive and a second adhesive fixing the optical member to the package. The plurality of adhesives are bonded to the optical member between an emission surface of the package and an incidence surface or a lower surface of the optical member. In the optical member, one or more first bonding regions to which the first adhesive is bonded and one or more second bonding regions to which the second adhesive is bonded are located at positions that are closer to the incidence surface of the optical member than to an emission surface of the optical member.
VERTICAL CAVITY SURFACE EMITTING LASER ELEMENT, VERTICAL CAVITY SURFACE EMITTING LASER ELEMENT ARRAY, VERTICAL CAVITY SURFACE EMITTING LASER MODULE, AND METHOD OF PRODUCING VERTICAL CAVITY SURFACE EMITTING LASER ELEMENT
[Object] To provide a vertical cavity surface emitting laser element having a structure whose pitch can be narrowed, a vertical cavity surface emitting laser element array, a vertical cavity surface emitting laser module, and a method of producing a vertical cavity surface emitting laser element.
[Solving Means] A vertical cavity surface emitting laser element according to the present technology includes: a first substrate; and a second substrate. The first substrate is provided with a semiconductor layer including an active layer and a first distributed Bragg reflector (DBR) layer. The second substrate is provided with a constriction layer and a second DBR layer, the constriction layer having a constriction region and an injection region having conductivity higher than that of the constriction region, the second substrate being bonded to the first substrate such that the constriction layer is adjacent to the semiconductor layer.
Apparatus for Cooling Electronic Circuitry Components and Photonic Components
An apparatus for cooling electronic circuitry components and photonic components. In examples of the disclosure at least one photonic component is positioned overlaying at least one electronic circuitry component. In examples of the disclosure there is also provided a spacer for spacing the at least one electronic circuitry component and the at least one photonic component, wherein the spacer for spacing are thermally insulating. In examples of the disclosure there is also provided a first heat transfer configured to remove heat from the at least one electronic circuitry component, and a second heat transfer configured to remove heat from the at least one photonic component.
OPTICAL ASSEMBLY WITH A MICROLENS COMPONENT AND CONTACTS ON A SAME SURFACE OF A VERTICAL CAVITY SURFACE EMITTING LASER DEVICE
In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.
LIGHT SOURCE UNIT, PROJECTION DISPLAY DEVICE, AND METHOD FOR MANUFACTURING LIGHT SOURCE UNIT
The light source unit includes a base provided with an opening, a support member fixed to the base at the opening, and a light source assembly fixed to the support member at the opening. The light source assembly includes a light source emitting laser light, a lens disposed on an optical axis of the laser light, and a holding member holding the light source and the lens. The support member has a convex receiving surface extending along the spherical surface so as to surround the optical axis when viewed from a direction parallel to the optical axis. The light source assembly is fixed to the support member by coupling the holding member to the receiving surface at a contact portion with the receiving surface. The receiving surface has a portion located on a side away from the optical axis with respect to a coupling part with the holding member.
LIGHT SOURCE UNIT, PROJECTION DISPLAY DEVICE, AND METHOD FOR MANUFACTURING LIGHT SOURCE UNIT
The light source unit includes a base provided with an opening, a support member fixed to the base at the opening, and a light source assembly fixed to the support member at the opening. The light source assembly includes a light source emitting laser light, a lens disposed on an optical axis of the laser light, and a holding member holding the light source and the lens. The support member has a convex receiving surface extending along the spherical surface so as to surround the optical axis when viewed from a direction parallel to the optical axis. The light source assembly is fixed to the support member by coupling the holding member to the receiving surface at a contact portion with the receiving surface. The receiving surface has a portion located on a side away from the optical axis with respect to a coupling part with the holding member.