Provided is a laser light source device stably operating, stably emitting laser light having a predetermined wavelength, and ensuring lower power consumption than that of the related art. The laser light source device includes a semiconductor laser element, a heat radiation part provided on one surface side of the semiconductor laser element, a heat conductive part having heat conductive characteristics, provided in contact with the one surface of the semiconductor laser element and the heat radiation part, configured to conduct heat generated in the semiconductor laser element to the heat radiation part, a wavelength measuring part configured to measure a wavelength of laser light, and a heat conductive characteristic control part configured to change the heat conductive characteristics of the heat conductive part based on the wavelength of the laser light, and control the wavelength of the laser light to fall within a predetermined wavelength range.

A laser light source unit configured to be able to irradiate, as combined light, laser light emitted from plural laser diodes toward front of the laser light source unit. The laser light source unit includes: plural first condensing lenses configured to condense the laser light emitted from each of the plural laser diodes; a microlens array disposed on a front side of the laser light source unit with respect to the plural first condensing lenses; and a second condensing lens disposed on the front side of the laser light source unit with respect to the microlens array. The microlens array and the second condensing lens are supported on a common lens holder. The microlens array is supported on the lens holder via an array holder. Plural through-holes through which light emitted from the plural first condensing lenses passes is formed in the array holder.

An apparatus comprises a first electrical contact, a second electrical contact, and a semiconductor device disposed between the first and second electrical contacts. The semiconductor device comprises a laser diode and a temperature control unit. The laser diode comprises p-type semiconductor material and n-type semiconductor material. The temperature control unit comprises p-type semiconductor material, n-type semiconductor material, and a resistor coupled to the laser diode. One of the p-type semiconductor material and the n-type semiconductor material is shared by the laser diode and the temperature control unit.

An assembly (14) for analyzing a sample (15) includes a detector assembly (18); a tunable laser assembly (10); and (iii) a laser controller (10F). The detector assembly (18) has a linear response range (232) with an upper bound (232A) and a lower bound (232B). The tunable laser assembly (10) is tunable over a tunable range, and includes a gain medium (10B) that generates an illumination beam (12) that is directed at the detector assembly (18). The laser controller (10F) dynamically adjusts a laser drive to the gain medium (10B) so that the illumination beam (12) has a substantially constant optical power at the detector assembly (18) while the tunable laser assembly (10) is tuned over at least a portion of the tunable range.

An LD module cooling device includes, in a cooling plate, common flow paths that supply/drain a cooling medium in parallel to/from a plurality of cooling portion flow paths that correspond to a plurality of LD modules, in which the cooling portion flow path is a thin layer flow path having a flow path height and a flow path width that are constant in at least a majority of a flow path length, a rectangular shape of the cooling portion flow path defined by the dimensions flow path lengthflow path width overlaps with at least the majority of a main contact surface between the cooling plate and the LD modules as viewed from a front surface of the cooling plate, the flow path height of the cooling portion flow path satisfies at least either one of a condition that flow path height is 1/20 or less of the flow path length and the flow path width, and a condition that the flow path height is 0.5 mm or less, and pressure loss of a cooling medium in the cooling portion flow path is greater than pressure loss of a cooling medium in the common flow paths.

To prevent a decrease in oscillation efficiency of laser light and a decrease in conversion efficiency of an optical wavelength due to thermal interference. A laser element includes: a laminated semiconductor layer including a first reflection layer with respect to a first wavelength and an active layer that performs surface emission at the first wavelength; a laser medium disposed on a rear side of an optical axis of the laminated semiconductor layer and including a second reflection layer with respect to a second wavelength on a first surface facing the laminated semiconductor layer and a third reflection layer with respect to the first wavelength on a second surface on a side opposite to the first surface; a fourth reflection layer with respect to the second wavelength disposed on the second surface or disposed on a rear side of the optical axis with respect to the second surface; a first resonator that causes light of the first wavelength to resonate between the first reflection layer and the third reflection layer; a second resonator that causes light of the second wavelength to resonate between the second reflection layer and the fourth reflection layer; and a heat exhaust unit that is disposed between the laminated semiconductor layer and the laser medium and exhausts heat generated in at least one of the laminated semiconductor layer or the laser medium.

A light source module includes a light source with a light emitting device and a terminal electrically connected to the light emitting device; a wiring board to electrically connect another end side of the terminal to an external power supply terminal; a thermal diffusion member between the light source and the wiring board; and a temperature detector mounted on the wiring board to detect a temperature of the light source. The thermal diffusion member has a recessed portion facing the wiring board, the temperature detector is accommodated in the recessed portion.

An LD module cooling device includes, in a cooling plate, common flow paths that supply/drain a cooling medium in parallel to/from a plurality of cooling portion flow paths that correspond to a plurality of LD modules, in which the cooling portion flow path is a thin layer flow path having a flow path height and a flow path width that are constant in at least a majority of a flow path length, a rectangular shape of the cooling portion flow path defined by the dimensions flow path lengthflow path width overlaps with at least the majority of a main contact surface between the cooling plate and the LD modules as viewed from a front surface of the cooling plate, the flow path height of the cooling portion flow path satisfies at least either one of a condition that flow path height is 1/20 or less of the flow path length and the flow path width, and a condition that the flow path height is 0.5 mm or less, and pressure loss of a cooling medium in the cooling portion flow path is greater than pressure loss of a cooling medium in the common flow paths.

To provide an optical module whose power consumption in an ambient temperature range is reduced, and an optical transmission equipment. The optical module includes: a housing; a box type optical subassembly including a bottom portion serving as a heat dissipation face; and a heat conductive member disposed between the bottom portion of the optical subassembly and a bottom portion of the housing. The optical subassembly includes one or a plurality of optical semiconductor devices, and a temperature controller on which the one or plurality of optical semiconductor devices are mounted and which is placed on an inner bottom portion of the optical subassembly. The heat conductive member is disposed only at a portion of the bottom portion of the optical subassembly.

In a laser apparatus, transmission of vibration, which is generated in a portion that generates a cooling gas flow, to a laser unit is suppressed, and heat generated from the laser unit is efficiently dissipated. A laser unit is housed inside a box-shaped housing having a plurality of faces. A frame supports a laser unit with a first mount interposed therebetween inside the housing. The frame has a through-hole penetrating from one face side to the other face side. A blower fan generates a flow of cooling gas for cooling the laser unit. The blower fan is attached to, for example, a second housing so as to face the laser unit. The cooling gas moves through the through-hole of the frame between the blower fan and the laser unit.