Absolute temperature measurements of integrated photonic devices can be accomplished with integrated bandgap temperature sensors located adjacent the photonic devices. In various embodiments, the temperature of the active region within a diode structure of a photonic device is measured with an integrated bandgap temperature sensor that includes one or more diode junctions either in the semiconductor device layer beneath the active region or laterally adjacent to the photonic device, or in a diode structure formed above the semiconductor device layer and adjacent the diode structure of the photonic device.

The present disclosure discloses an optical module including a circuit board and a light-emitting assembly. In the light-emitting assembly, a wavelength tuning mechanism is formed of a semiconductor optical amplification chip, a silicon optical chip and a semiconductor refrigerator. The semiconductor optical amplification chip may provide a plurality of wavelengths, and a wavelength selection is carried out by an optical filter in the silicon optical chip; a temperature adjustment for the optical filter is achieved by the semiconductor refrigerator, so as to further adjust a performance of the filter for wavelength selection. The above device is provided in a housing to facilitate packaging of the devices.

A semiconductor light emitter includes a substrate, a semiconductor multilayer structure including a light emission unit that emits light in an oblique direction with respect to the substrate, a base on which the substrate is disposed, a holding member that holds the substrate at an angle set in advance with respect to the base, a temperature control unit disposed parallel to the substrate to adjust a temperature of the substrate, and a shaping optical system held against the substrate to shape a luminous flux emitted from the semiconductor multilayer structure.

An optical scanning device includes: a light source; a light source driver that provides the light source with a drive current, on which a bias current that fluctuates according to temperature change is superimposed, for emitting light from the light source; and a bias current adjuster that provides the light source driver with a bias control signal for adjusting a magnitude of the bias current, wherein the bias current adjuster includes a current value adjusting member that is capable of changing the magnitude of the bias control signal according to temperature change, and wherein the bias control signal that has automatically changed according to temperature change of the current value adjusting member is provided to the light source driver, so that the light source driver makes the magnitude of the bias current to be superimposed fluctuate, based on the provided bias control signal.

Provided is a reservoir computing system including a reservoir having a random laser for emitting a non-linear optical signal with respect to an input signal. The reservoir computing system also includes a converter for converting the non-linear optical signal into an output signal by applying a conversion function. The conversion function is trained by using a training input signal and a target output signal.

A laser apparatus includes: a laser unit including: a laser element unit including a phase adjusting portion configured to adjust an optical length of a laser resonator and enable frequency of laser light to be tuned; and a monitor unit configured to obtain a monitored value corresponding to the frequency of the laser light; a temperature controller configured to control temperature of the laser unit; and a control unit configured to execute: controlling the phase adjusting portion such that the monitored value is adjusted to a target monitored value corresponding to a target frequency set as the frequency of the laser light, while maintaining temperature set for the temperature controller constant; and controlling the temperature controller such that the frequency of the laser light is adjusted to the target frequency in a case where continuous fine adjustment control of the frequency of the laser light has been instructed.

A computer adapted to convert images into raw data can provide the raw data to a control interface adapted to transmit the raw data with timing information to an electronic driver circuit. The electronic driver circuit can convert the raw data with the timing information provided by a control interface into regulated current signals provided to the semiconductor laser array at 300 dpi and higher. The semiconductor array can convert the current signals into light to illuminate an imaging member. The laser array can comprise vertical cavity surface emitting lasers providing imaging greater than 300 dpi. Each semiconductor laser can operate at 50 mW or greater.

A method of transferring a semiconductor epi layer onto a metal host substrate is described. An epi layer of a semiconductor chip (e.g., semiconductor laser array) including a substrate can be mounted onto a planar handle wafer with an adhesive, wherein a backside of the substrate faces upward and away from the epi layer and the planar handle wafer. The backside of the substrate can be treated to substantially remove the substrate, while leaving the epi layer undamaged (e.g., by polishing to where no more than 20 micrometers of the substrate remains). Metal can be formed on the treated backside resulting in a metalized backside. The planar handle wafer can then be removed from the epi layer by dissolving the adhesive with a solvent, wherein a modified semiconductor chip remains. The semiconductor chip can be annealed to form a backside ohmic contact interface. The semiconductor chip can then be attached to a mechanical block by the ohmic contact interface.

A method and apparatus provide for determining a temperature at a junction of a laser diode when the laser diode is operated in a lasing state that facilitates heat-assisted magnetic recording, comparing the junction temperature and an injection current supplied during the lasing state to stored combinations of junction temperature and injection current, and determining a likelihood of mode hopping occurring for the laser diode during the lasing state based on the comparison to stored combinations of junction temperature and injection current.

There is provided a method of operating a laser. The method comprises receiving a target power and calculating an operating power of a lasing module of the laser. The operating power may be calculated based on the target power and a minimum lasing power of the lasing module. The method also comprises determining an operating current for the lasing module based on the operating power, and driving the lasing module at the operating current to produce an output light having the operating power. In addition, the method comprises providing the output light to an optical modulator of the laser, and operating the optical modulator to modulate the output light to have an output power corresponding to the target power.