A light-emitting device includes a light diffusing member that diffuses light emitted from a light source so that an object to be measured is irradiated with the light; and a holding unit that holds the light diffusing member and is provided on a wire connected to the light source so as to be located in an uncoated region of the wire.

A time of flight (TOF) assembly includes a laser light source, one or more photo detectors and a detection circuit. The one or more photo detectors are configured to receive light and convert the received light into an electric signal. The detection circuit is configured to send a turning-off control signal to turn off the laser light source in response to the electric signal indicating that a time length, in which the laser light source is in an effective working state within a first duration, is greater than a preset time length threshold value or the electric signal indicating that energy of light emitted from the laser light source within a second duration is greater than a preset energy threshold. The disclosure also provides a terminal device and a control method for a TOF assembly.

A method of manufacturing an optical member includes: providing a conversion member and a holding member connected to the conversion member; removing a portion of the conversion member and a portion of the holding member to obtain a first surface of the conversion member and a second surface of the holding member; and heat-treating the first surface of the conversion member and the second surface of the holding member.

The present invention provides methods and an apparatus for monitoring the optical output power of a laser diode (LD) having an associated photodiode (PD), and a particle sensor apparatus. The photodiode (PD) is operable together with the laser diode (LD), wherein it detects the light (LS) of the laser diode (LD) and converts it into an electrical current, and is thermally coupled to the laser diode (LD). Monitoring of the optical output power P is effected during the operation of the laser diode (LD) and is based on current measurements and/or voltage measurements at the laser diode (LD) and at the photodiode (PD).

A light emitting device includes: a lens member having at least one lens surface; a submount; and a plurality of light emitting elements arranged in a row on an upper face of the submount, including a first light emitting element configured to emit first light having an emission peak at a first wavelength and a second light emitting element configured to emit second light having an emission peak at a second wavelength from a second light emission point, the second wavelength being different from the first wavelength, and the second light emission point being located farther from the lens member than a first plane that is perpendicular to an optical axis of the lens surface and that passes through the first light emission point.

A wiring board includes: an insulating member having a first upper surface, and a second upper surface located higher than the first upper surface; and a first wiring layer located on the first upper surface. The first upper surface has a wiring region that does not overlap with the second upper surface in a top view, and that is located in an exposed region. The first wiring layer extends from the wiring region to a connecting region that is connected to the wiring region, that overlaps with the second upper surface in a top view, and that is not exposed. The first wiring layer comprises a first pad portion located in the wiring region, and a first pattern portion located in the connecting region.

Carrier module (1) for at least one semiconductor element (3) having a passively and/or actively cooled carrier (4) which has a positive carrier contact (5) and a negative carrier contact (6), with a device (2) for bridging the at least one semiconductor element (3) arranged on the carrier (4), comprising at least one first printed circuit board (7) with at least one bridging element (8), wherein at least one positive contact (9) which is electrically conductively connected to the positive carrier contact (5) and at least one negative contact (11) which is electrically conductively connected to the negative carrier contact (6) are provided on a first printed circuit board (7) and the bridging element (8) is electrically conductively connected to the positive contact (9) and to the negative contact (11) of the first printed circuit board (7), wherein the first printed circuit board (7) is thermally conductively and releasably connected to the carrier (4).

The light source control apparatus controls drive of multiple light sources included in a light source unit to be used in a state where the multiple light sources are lit. The multiple light sources each include multiple light-emitting elements. The light source control apparatus includes an acquirer acquiring temporal information relating to a temporal change of each of the light sources, an estimator acquiring an estimated lifetime of each of the multiple light sources by using the temporal information, and a controller decreasing, when the multiple light sources include a first light source whose estimated lifetime is shorter than a target lifetime set for the light source unit, a light emission amount of the first light source.

The invention relates to a light module including a laser source capable of emitting a coherent light beam of given wavelength, a first sensor capable of picking up a first light signal of a wavelength lying in a first band of wavelengths centered around the given wavelength and a second sensor capable of picking up a second light signal of a wavelength lying in a second band of wavelengths centered around a wavelength distinct from the given wavelength. In particular, the light module includes a detection module capable of comparing at least one value that is a function of the signals to a threshold value and of commanding the stopping of the laser source as a function of the comparison.

A VCSEL illuminator module includes a module forming a physical cavity having electrical contacts positioned on an inner surface of the module that feed through the module to electrical contacts positioned on an outer surface of the module. A VCSEL device is positioned on the inner surface module and includes electrical contacts that are electrically connected to the electrical contacts on the inner surface of the module. The VCSEL device generates an optical beam when current is applied to the electrical contacts. An optical element is positioned adjacent to an emitting surface of the VCSEL device and is configured to modify the optical beam generated by the VCSEL device.