A laser diode chip is described. In an embodiment the laser diode chip includes an n-type semiconductor region, a p-type semiconductor region and an active layer arranged between the n-type semiconductor region and the p-type semiconductor region, wherein the active layer is in the form of a single quantum well structure. The single quantum well structure includes a quantum well layer, which is arranged between a first barrier layer and a second barrier layer, wherein the first barrier layer faces the n-type semiconductor region, and the second barrier layer faces the p-type semiconductor region. An electronic bandgap E.sub.QW of the quantum well layer is smaller than an electronic bandgap E.sub.B1 of the first barrier layer and smaller than an electronic bandgap E.sub.B2 of the second barrier layer, and the electronic bandgap E.sub.B1 of the first barrier layer is larger than the electronic bandgap E.sub.B2 of the second barrier layer.

A laser structure includes a substrate and a first dielectric layer formed on the substrate. A multi-quantum well is formed on the first dielectric layer and has a plurality of alternating layers. The alternating layers include a dielectric layer having a sub-wavelength thickness and a monolayer of a two dimensional material.

A semiconductor stack includes a first-conductivity-type layer, a quantum well structure, and a second-conductivity-type layer. The first-conductivity-type layer, the quantum well structure, and the second-conductivity-type layer are stacked in this order. The quantum well structure includes a first semiconductor layer, a second semiconductor layer, and a third semiconductor layer. In the first semiconductor layer and the third semiconductor layer, compositions of the first semiconductor layer and the third semiconductor layer are changed such that a bandgap decreases toward the second semiconductor layer. Transition of an electron is possible between a conduction band of each of the first semiconductor layer and the third semiconductor layer and a valence band of the second semiconductor layer.

A quantum cascade laser includes a substrate having a group III-V compound semiconductor and a core region that is provided on the substrate and that includes a group III-V compound semiconductor. The core region includes a plurality of unit structures that are stacked on top of one another. Each of the plurality of unit structures includes an active layer and an injection layer. The injection layer includes at least one strain-compensated layer including a first well layer and a first barrier layer and at least one lattice-matched layer including a second well layer and a second barrier layer. The first well layer has a lattice constant larger than a lattice constant of the substrate. The first barrier layer has a lattice constant smaller than the lattice constant of the substrate. The second well layer and the second barrier layer each have a lattice constant that is lattice-matched to the substrate.

A semiconductor layer structure may include a substrate, a blocking layer disposed over the substrate, and one or more epitaxial layers disposed over the blocking layer. The blocking layer may have a thickness of between 50 nanometers (nm) and 4000 nm. The blocking layer may be configured to suppress defects from the substrate propagating to the one or more epitaxial layers. The one or more epitaxial layers may include a quantum-well layer that includes a quantum-well intermixing region formed using a high temperature treatment.

The invention relates to a semiconductor device, e.g. for the emission or absorption of light, preferably in the deep ultraviolet (DUV) range. The device, e.g. a resonant cavity light emitting diode (RCLED) or a laser diode, is formed from: a substrate layer (302), preferably comprising a distributed Bragg reflector (DBR); a graphitic layer (304); and at least one semiconductor structure (310), preferably a wire or a pyramid, grown on the graphitic layer, with or without the use of a mask layer (306). The semiconductor structure is constructed from at least one III-V semiconductor n-type doped region (316) and a hexagonal boron-nitride (hBN) region (312), preferably being p-type doped hBN.

The methods of manufacture of GeSiSn heterojunction bipolar transistors, which include light emitting transistors and transistor lasers and photo-transistors and their related structures are described herein. Other embodiments are also disclosed herein.

The present invention proposes an O-band silicon-based high-speed semiconductor laser diode for optical communication and its manufacturing method, by using different buffer layers to form the growth surface of InP material with low dislocation density; N—InAlGaAs is used instead of conventional N—InAlAs electron-blocking layer in the epi-structure to reduce the barrier for electrons to enter the quantum wells from N-type and lower the threshold; a superlattice structure quantum barrier is used instead of a single layer barrier structure to improve the transport of heavy holes in the quantum wells; and the material structure is adjusted to achieve a reliable O-band high direct modulation speed semiconductor laser diode for optical communication on silicon substrate.

A semiconductor layer structure may include a substrate, a blocking layer disposed over the substrate, and one or more epitaxial layers disposed over the blocking layer. The blocking layer may have a thickness of between 50 nanometers (nm) and 4000 nm. The blocking layer may be configured to suppress defects from the substrate propagating to the one or more epitaxial layers. The one or more epitaxial layers may include a quantum-well layer that includes a quantum-well intermixing region formed using a high temperature treatment.

An embodiment relates to a surface emitting laser device and a light emitting device including the same. A surface emitting laser device according to the embodiment may include a first reflective layer; an active layer disposed on the first reflective layer; an aperture area disposed on the active layer and including an aperture and an insulating region; and a second reflective layer disposed in the aperture area. The active layer may comprise a plurality of quantum wells, quantum barriers, and intermediate layers disposed between the quantum wells and the quantum barriers. The quantum wells and the quantum barriers may include a ternary material, and the intermediate layers may comprise a binary material.