A light emitter device (100) comprises a substrate (10) and a photonic crystal (20), which is arranged on the substrate (10) and comprises pillar- and/or wall-shaped semiconductor elements (21), which are arranged periodically standing out from the substrate (10), wherein the photonic crystal (20) forms a resonator, in which the semiconductor elements (21) are arranged in a first resonator section (22) with a first period (d.sub.1), in a second resonator section (23) with a second period (d.sub.2) and in a third resonator section (24) with a third period (d.sub.3), wherein on the substrate (10) the second resonator section (23) and the third resonator section (24) are arranged on two mutually opposing sides of the first resonator section (22) and the second period (d.sub.2) and the third period (d.sub.3) differ from the first period (d1), the first resonator section (22) forms a light-emitting medium and the third resonator section (24) forms a coupling-out region, through which a part of the light field in the first resonator section (22) can be coupled out of the resonator in a light outcoupling direction parallel to a substrate surface (11) of the substrate (10). Methods for operating and producing the light emitter device (100) are also described.

An ambient light rejecting screen used in a laser light source projector, which generates a light with a first wavelength and a light with a second wavelength, is provided. The screen includes a base, a light absorbing layer, a first filter layer and a second filter layer. The light absorbing layer is disposed on the base. The first filter layer is disposed on the light absorbing layer. The crystallization characteristic of the first filter layer corresponds to the light with the first wavelength and generates a reflective light with the first wavelength, and allows the light with remaining wavelengths to pass through. The second filter layer is disposed on the light absorbing layer. The crystallization characteristic of the second filter layer corresponds to the light with the second wavelength used to generate the reflective light with the second wavelength and allows the light with remaining wavelengths to pass through.

A Dense Wavelength Division Multiplexing (DWDM) photonic integration circuit (PIC) that implements a DWDM system, such as a transceiver, is described. The DWDM PIC architecture includes photonic devices fully integrating on a single manufacturing platform. The DWDM PIC has a multi-wavelength optical laser, a quantum dot (QD) laser with integrated heterogeneous metal oxide semiconductor (H-MOS) capacitor, integrated on-chip. The multi-wavelength optical laser can be a symmetric comb laser that generates two equal outputs of multi-wavelength light. Alternatively, the DWDM PIC can be designed to interface with a stand-alone multi-wavelength optical laser that is off-chip. In some implementations, the DWDM PIC integrates multiple optimally designed photonic devices, such as a silicon geranium (SiGe) avalanche photodetector (APD), an athermal H-MOS wavelength splitter, a QD photodetector, and a heterogenous grating coupler. Accordingly, fabricating the DWDM PIC includes a unique III-V to silicon bonding process, which is adapted for its use of SiGe APDs.

A light emitting device includes: a substrate; a laminated structure that is provided on the substrate and that includes a plurality of columnar portions; and an electrode provided at an opposite side of the laminated structure from the substrate. The columnar portion includes a first semiconductor layer, a second semiconductor layer of a conductivity type different from that of the first semiconductor layer, and a light emitting layer located between the first semiconductor layer and the second semiconductor layer. The electrode is connected to the second semiconductor layers in the plurality of columnar portions, and includes a first electrode layer formed of a material that has a work function smaller than that of the second semiconductor layer, and a second electrode layer that is connected to the first electrode layer and that has a work function smaller than that of the first electrode layer. An interface between the first electrode layer and the second electrode layer has an uneven shape.

The light emitting device includes a substrate, and a laminated structure provided to the substrate, and including a plurality of columnar parts, wherein the columnar part includes a first semiconductor layer, a second semiconductor layer different in conductivity type from the first semiconductor layer, and a light emitting layer disposed between the first semiconductor layer and the second semiconductor layer, the laminated structure includes a third semiconductor layer which is connected to an opposite side to the substrate of the second semiconductor layer, and is same in conductivity type as the second semiconductor layer, the second semiconductor layer is disposed between the light emitting layer and the third semiconductor layer, the third semiconductor layer is provided with a recessed part, an opening of the recessed part is provided to a surface at an opposite side to the substrate side of the third semiconductor layer, and a diametrical size in a bottom of the recessed part is smaller than a diametrical size in the opening of the recessed part.

An all-epitaxial, electrically injected surface-emitting green laser operates in a range of about 520-560 nanometers (nm). At 523 nm, for example, the device exhibits a threshold current density of approximately 0.4 kilo-amperes per square centimeter (kA/cm.sup.2), which is over one order of magnitude lower than that of previously reported blue laser diodes.

A vertical-cavity surface-emitting laser (VCSEL) has at least a substrate, electrical contacts, a first mirror region, a second mirror region and an active region between the mirror regions; where the mirror regions comprise distributed Bragg reflectors formed of a plurality of layers; laser emission is from at least one gallium arsenide antimonide nanostructure in the active region; and each said nanostructure contains more antimony atoms than arsenic atoms.

A semiconductor light-emitting device includes an active layer including quantum dots, a diffraction grating, a low-reflectance film disposed at a light-emitting end of the active layer, and a high-reflectance film disposed at another end of the active layer and having an optical reflectance higher than an optical reflectance of the low-reflectance film.

A buried typed semiconductor optical device includes a semiconductor substrate having a pair of grooves extending in a first direction. An upper surface of a buried layer has a first region that is adjacent to a mesa stripe structure, overlaps with a corresponding one of the pair of grooves, is inclined so as to be higher in a second direction from the mesa stripe structure, and on which a passivation film is not formed. The upper surface of the buried layer has a second region that does not overlap with any of the pair of grooves, is flat, and is higher than a lower end of the first region, and on which the passivation film is formed. The upper surface of the buried layer has a connection region between the first region and the second region at a same height as the second region.

A light emitting device includes a substrate, a laminated structure provided to the substrate, and including a plurality of columnar parts, and a covering part configured to cover the laminated structure, wherein the columnar parts have a light emitting layer, and the covering part is provided with a through hole penetrating the covering part.