According to one embodiment, an illumination device includes a light guide including an upper surface, a lower surface and a light entering surface, a first light emitting portion, a second light emitting portion, and a third light emitting portion. A first surface, a second surface, a third surface and a fourth surface of the upper surface are arranged in this order in a first direction. A width of the first surface is less than a width of the second surface, and the width of the second surface is less than a width of the third surface. An angle between the light entering surface and the first surface is an acute angle. The first light emitting portion, the second light emitting portion and the third light emitting portion face the light entering surface.

A light source unit includes: a first light emission point from which a first beam is emitted; a second light emission point from which a second beam is emitted and which is disposed apart from the first light emission point in a second direction perpendicular to a first direction; a deflection element that deflects the first and/or second beam; and a first condensing optical element that focuses, on a light collection surface, the first and second beams. The first beam at the first light emission point overlaps the second beam at the second light emission point in a third direction, and on the light collection surface, the first and second beams overlap each other in the second direction and are separate from each other in the third direction.

In various embodiments, laser devices include a thermal bonding layer featuring an array of carbon nanotubes and at least one metallic thermal bonding material.

Provided in a method of fabricating an optical element array including providing a silicon substrate, providing a first element layer on the silicon substrate, the first element layer including a plurality of passive optical elements, providing a plurality of semiconductor blocks on a compound semiconductor wafer, providing semiconductor dies by dicing the compound semiconductor wafer by the plurality of semiconductor blocks, and providing a second element layer by providing the semiconductor dies on the first element layer, each of the plurality of semiconductor blocks contacting at least one corresponding passive optical element from among the plurality of passive optical elements.

Device for shaping laser radiation (10a, 10c), comprising a component (1) having an entrance face (2) and an exit face (3), a first lens array (4) on the entrance face (2) with a plurality of lenses (5a, 5c, 5e) juxtaposed in the X-direction, and a second lens array (6) on the exit face (3) with a plurality of lenses (7a, 7c, 7e) juxtaposed in the Y-direction, wherein the laser radiation (10a, 10c) is deflected by a first one of the lenses (5a, 5c, 5e) of the first lens array (4) with respect to the X- and Y-direction by a different angle than from a second one of the lenses (5a, 5c, 5e) of the first lens array (4), and/or wherein the laser radiation (10a, 10c) is deflected by a first of the lenses (7a, 7c, 7e) of the second lens array (6) with respect to the X- and Y-direction by a different angle than by a second one of the lenses (7a, 7c, 7e) of the second lens array (6).

Described herein are optical sensing devices for photonic integrated circuits (PICs). A PIC may comprise a plurality of waveguides formed in a silicon on insulator (SOI) substrate, and a plurality of heterogeneous lasers, each laser formed from a silicon material of the SOI substrate and to emit an output wavelength comprising an infrared wavelength. Each of these lasers may comprise a resonant cavity included in one of the plurality of waveguides, and a gain material comprising a non-silicon material and adiabatically coupled to the respective waveguide. A light directing element may direct outputs of the plurality of heterogeneous lasers from the PIC towards an object, and one or more detectors may detect light from the plurality of heterogeneous lasers reflected from or transmitted through the object.

A light emitting device includes: a base member; a first semiconductor laser element disposed on an upper surface of the base member, wherein the first semiconductor laser element is configured to emit laser light from a first light emitting surface; a first light-reflecting member disposed on the upper surface of the base member, wherein the first light-reflecting member has a first light-reflecting surface configured to reflect the first laser light; a second semiconductor laser element disposed on the upper surface of the base member, wherein the second semiconductor laser element is configured to emit laser light from a second light emitting surface; and a second light-reflecting member disposed on the upper surface of the base member, wherein the second light-reflecting member has a second light-reflecting surface configured to reflect the second light.

A circuit conductor is provided on a base. A semiconductor laser is connected to the circuit conductor. Cutout parts on which the circuit conductor is not formed are provided at, for example, the vicinity of the four corners of the base, and a hole is provided at each of the said portions. The holes penetrate the base. Fixing members are inserted through the holes. The fixing members are, for example, male threads. Since the head part of the fixing members is located in the cutout part, the fixing members and the circuit conductor are not in contact with each other. A platform has holes formed at portions corresponding to the holes in the optical unit and female threads formed on the inner surface. The fixing members and the platform are therefore joined. As a result, the optical unit is fixed to the platform.

A laser element includes a photonic crystal layer on which laser light is incident. The photonic crystal layer includes a base layer formed of a first refractive index medium; and a plurality of different refractive index regions formed of a second refractive index medium having a refractive index different from that of the first refractive index medium and disposed in the base layer. The plurality of different refractive index regions includes a first different refractive index region of which a planar shape is an approximate circle, an approximate square, or an approximate polygon having a rotational symmetry of 90° and a first area perpendicular to a thickness direction; and a second different refractive index region having a second area perpendicular to a thickness direction.

A laser projection display device (1) includes a laser source (5), a laser driver (4) that drives the laser source, a scanning unit (7) that scans and projects laser light generated by the laser source, a liquid crystal element (14) that transmits the laser light at a predetermined transmittance, and a liquid crystal driver (17) that changes the transmittance by applying a voltage to the liquid crystal element. When a light quantity of the laser light generated by the laser source corresponds to a case in which the laser source operates in a nonlinear area, the laser driver shifts an operation point to an area other than the nonlinear area by increasing a driving level of the laser source by a predetermined amount G, and the liquid crystal driver decreases the transmittance of the liquid crystal element by a predetermined amount 1/G.