The invention relates to a semiconductor laser including a carrier, an edge-emitting laser diode which is arranged on the carrier and which has an active zone for generating laser radiation and a facet with a radiation exit area, an optical element which covers the facet, a connecting material which is arranged between the optical element and the facet, a molded body which covers the laser diode and the optical element at least in places, wherein the optical element is at least partially transparent to the laser radiation emitted by the laser diode during operation, and the optical element is designed to change the main propagation direction of the laser radiation entering the optical element during operation.

Apparatus, systems and methods to spectrally beam combine a group of diode lasers in an external cavity arrangement. A dichroic beam combiner or volume Bragg grating beam combiner is placed in an external cavity to force each of the diode lasers or groups of diode lasers to oscillate at a wavelength determined by the passband of the beam combiner. In embodiments the combination of a large number of laser diodes in a sufficiently narrow bandwidth to produce a high brightness laser source that has many applications including as to pump a Raman laser or Raman amplifier.

The present disclosure relates to a three-dimensional cylindrical cavity-type laser system capable of supporting circumferential radial emission. A cylindrical ring waveguide provides optical confinement in the radial and axial dimensions thereby supporting a plurality of radial modes, one of a plurality of axial modes and a plurality of degenerate azimuthal modes. These modes constitute a set of traveling wave modes which propagate around the cylindrical ring waveguide possessing various degrees of optical confinement as quantified by their respective Q-factors. Index tailoring is used to tailor the radial refractive index profile and geometry of the waveguide to support radial modes possessing Q-factors capable of producing efficient radial emission, while gain tailoring is used to define a gain confining region which offsets modal gain factors of the modal constituency to favor a preferred set of modes supporting efficient radial emission out of the total modal constituency supported by the resonator. Under appropriate pump actuation the selected modes produce circumferential laser radiation with the output surface comprising of the entire outer perimeter of the cylindrical ring waveguide. The design is applicable toward both micro-resonators and resonators much larger than the optical wavelength, enabling high output powers and scalability. The circumferential radial laser emission can be concentrated by positioning the cylindrical ring laser inside a three-dimensional conical mirror thereby forming a laser ring of light propagating in the axial dimension away from the surface of the laser, which can be subsequently collimated for focused using conventional optics.

A structured phosphor device includes a frame member that includes wall regions separating multiple openings of window regions. Further, the structured phosphor device includes a phosphor material filled in each of the multiple openings with a first surface thereof being exposed to an excitation light from one or more laser sources to generate an emitted light out of each window region. Additionally, the structured phosphor device includes an anti-reflective film overlying the first surface of the phosphor material. Furthermore, the structured phosphor device includes a substrate attached to a second surface of the phosphor material in each of the multiple openings. Alternatively, the structured phosphor device includes an array of phosphor pixels dividing a plate of single-crystalline or poly-crystalline phosphor material separated by optically reflective and thermally conductive walls. A dynamic lighting system based on the arrays of phosphor pixels for single or full color image projection is also disclosed.

The disclosed diode laser packages include a carrier having an optics-mounting surface to which first and second sets of collimating and turning optics are mounted. The carrier includes a heatsink receptacle medially located between the first and second sets. A cooling plenum has a diode-mounting surface and includes heatsink material disposed in the heatsink receptacle. The cooling plenum further has an inlet, an outlet, and a coolant passageway defined between the inlet and the outlet. The coolant passageway is sized to receive the heatsink material disposed in heatsink receptacle. Multiple semiconductor laser diode devices are each mounted atop the diode-mounting surface and positioned for bidirectional emission toward the first and second sets of collimating and turning optics. The multiple semiconductor laser diode devices are thermally coupled to the heatsink material through which coolant is deliverable by the coolant passageway.

A photonic integrated circuit (PIC) assembly comprising a semiconductor optical amplifier (SOA) array and a U-turn chip. The SOA array includes an input SOA and a plurality of SOAs. The input SOA and the plurality of SOAs are arranged parallel to one another. The U-turn chip includes an optical splitter and a waveguide assembly. The optical splitter is configured to receive amplified input light propagating in a first direction from the input SOA, and divide the amplified light into beams. The waveguide assembly guides the beams to a corresponding SOA of the plurality of SOAs, and adjusts a direction of prorogation of each of the guided beams to be substantially parallel to a second direction that is substantially opposite the first direction.

Embodiments describe a solid state electronic scanning LIDAR system that includes a scanning focal plane transmitting element and a scanning focal plane receiving element whose operations are synchronized so that the firing sequence of an emitter array in the transmitting element corresponds to a capturing sequence of a photosensor array in the receiving element. During operation, the emitter array can sequentially fire one or more light emitters into a scene and the reflected light can be received by a corresponding set of one or more photosensors through an aperture layer positioned in front of the photosensors. Each light emitter can correspond with an aperture in the aperture layer, and each aperture can correspond to a photosensor in the receiving element such that each light emitter corresponds with a specific photosensor in the receiving element.

Laser diode packages include a rigid thermally conductive base member that includes a base member surface situated to support at least one laser diode assembly, at least one electrode standoff secured to the base member surface that has at least one electrical lead having a first end and a second end with the first end secured to a lead surface of the electrode standoff, and a lid member that includes a lid portion and a plurality of side portions extending from the lid portion and situated to be secured to the base member so as to define sides of the laser diode package, wherein at least one of the side portions includes a lead aperture situated to receive the second end of the secured electrical lead that is insertable through the lead aperture so that the lid member extends over the base member to enclose the laser diode package.

A light emitting device includes: a semiconductor laser element configured to emit light in a first direction; a light-reflecting part having a light-reflecting surface; and a base member including: a recess, an upper surface surrounding the recess, and a first wiring part and a second wiring part provided on the upper surface. The semiconductor laser element and the light-reflecting part are located in the recess, the light-reflecting part positioned separated from the semiconductor laser element in the first direction in a top view. The first wiring part and the second wiring part are disposed at a position separated from the semiconductor laser element in a direction opposite to the first direction, the first wiring part and the second wiring part being arranged in a second direction perpendicular to the first direction.

A photon source may be composed of a substrate defining a planar surface, an optical shell having an annular base surface disposed above the substrate, and a plurality of optical sources. Each optical source may be composed of a mirror and an optical emitter aligned with the mirror along an optical axis. The mirror may be configured to reflect a collimated optical beam emitted by the optical emitter onto the annular base surface. The mirrors of the plurality of optical sources may be arranged in a first ring-like configuration. The annular base surface may be disposed above the first ring-like configuration. The optical emitters of the plurality of optical sources may be arranged in a second ring-like configuration. In one aspect, the optical shell may be a hollow frustum. In another aspect, a focus lens may be disposed between the substrate and the optical shell.