Disclosed are systems, devices, apparatus, tools, coaxial cables, materials, methods, and other implementations that include a method comprising controllably stripping, through one or more applications of energy directed at a micro coaxial cable, a conductive shield layer of the micro coaxial cable to expose a portion of a core conductive wire of the micro coaxial wire, and controllably deforming the exposed portion of the core conductive wire of the micro coaxial wire through the one or more applications of energy.

An exposed terminal for a wire conductor, and a process for preparing the exposed terminal includes executing, via a mechanical device, a mechanical ablation process to remove the insulative material from an outer surface of the plurality of square edges along a predefined length of the portion of the wire conductor. The process also includes executing, via a laser tool, a laser ablation process to remove the insulative material from the first pair of opposed faces along the predefined length of the portion of the wire conductor; and executing, via the laser tool, the laser ablation process to remove the insulative material from the second pair of opposed faces along the predefined length of the portion of the wire conductor.

Disclosed is a method and apparatus for automated removal of a segment of a braided metal shield from an electric cable. A segment of a braided metal shield protruding from a holder is pulled back over a heat absorbing ring. The ring is inserted over the braided metal shield. Laser radiation of sufficient power is applied to the segment of the braided metal shield located over the ring to cut the braided metal shield located over the ring.

A cable such as a server cable may have a tapered termination portion that when connected to other information handling system components reduces the loss of signal between the cable and the information handling system component. A method of making a cable with a tapered termination portion comprising heating a wire having an end and a body portion, the body portion having a first diameter; pulling the end relative to the body portion, for example with a clamp coupled to the end under tension, to obtain a location between the end and the body portion having a second diameter smaller than the first diameter; and cutting the wire at the location.

In a method for stripping a cable having a multi-layered sheath, first, an initial layer of the sheath of the cable is cut in a stripping device using at least one stripping blade. This is followed by cutting an inner layer of the sheath located opposite the first layer using a laser beam of a laser cutting device. The stripping process is completed by removal of the sheath that was cut using the stripping blade and the laser beam.

A cable such as a server cable may have a tapered termination portion that when connected to other information handling system components reduces the loss of signal between the cable and the information handling system component. A method of making a cable with a tapered termination portion comprising heating a wire having an end and a body portion, the body portion having a first diameter; pulling the end relative to the body portion, for example with a clamp coupled to the end under tension, to obtain a location between the end and the body portion having a second diameter smaller than the first diameter; and cutting the wire at the location.

The invention concerns a device for stripping electric cables, comprising at least one stripping beam (10, 11; 110, 111; 209) emitted by a LASER source (1; 101; 201) and focused by an optical assembly (2-4; 102, 103; 203-208) into a focusing point (12, 13), called cutting point, and at least one track (6; 106) for receiving a portion of cable to be stripped, characterised in that each LASER source comprises a LASER diode (1; 101; 201) emitting a stripping beam of which the wavelength is between 400 nm and 460 nm, and preferably of the order of 445 nm.

A wire guide and a laser wire-processing device that includes a wire guide are provided. The laser wire-processing device includes a housing and an aperture in a side of the housing, wherein the aperture defines a longitudinal axis that is substantially perpendicular to the aperture. The laser wire-processing device also includes a backstop arranged in the housing and aligned with the longitudinal axis, the backstop defining a wire-contact surface in a facing relationship with the aperture. The laser wire-processing device also includes a wire guide arranged in the housing to manipulate a wire inserted through the aperture into a desired position relative to the longitudinal axis between the aperture and the backstop. The laser wire-processing device also includes a laser operable to direct a laser beam toward an insulation layer of the wire. The wire guide could be a tube arranged in the device or a backstop guide.

A simplified process for producing a shield layer-cut electric wire that does not damage an insulating layer and a core wire and when cutting a shield layer.

A method of manufacturing a rectangular conducting wire wherein insulating coating of rectangular conducting wire is removed by applying laser light the insulating coating, four planar portions on exterior of rectangular conducting wire are sequentially defined as a first, second, third, and fourth face portion, second corner portion is defined between second and third face portions, and fourth corner portion is defined between fourth and first face portions.