Systems and methods include a modular attachment mounted in a vent of a roof for electronic communication between devices interior to and external to a structure. The vent covers a slot in a roof of the structure to provide ventilation and includes a housing having a length, a width and a height that are sized to fit through the slot of the roof, and includes a top a top portion proximal to the vent, a bottom portion proximal to the interior of the structure and opposite to the top portion, and at least one wall extending between the top portion and the bottom portion. A securing mechanism is connected to the top portion of the housing to secure the housing within the slot. An electronics bus is positioned within the housing and has an interface that enables operation of modular electronic devices that are removably positioned within the housing.