Patent classifications
H02M1/096
Power transistor with distributed gate
An electronic circuit is disclosed. The electronic circuit includes a distributed power switch. In some embodiments, the electronic circuit also includes one or more of a distributed gate driver, a distributed gate pulldown device, a distributed diode, and a low resistance gate and/or source connection structure. An electronic component comprising the circuit, and methods of manufacturing the circuit are also disclosed.
Power transistor with distributed gate
An electronic circuit is disclosed. The electronic circuit includes a distributed power switch. In some embodiments, the electronic circuit also includes one or more of a distributed gate driver, a distributed gate pulldown device, a distributed diode, and a low resistance gate and/or source connection structure. An electronic component comprising the circuit, and methods of manufacturing the circuit are also disclosed.
Circuit arrangement and power converter module having semiconductor switches connected in series
A circuit arrangement has an even number of semiconductor switches, which are connected in series and contain in each case two load terminals and a control terminal and are associated with one another in pairs. The circuit arrangement also contains, for each semiconductor switch, a driver for actuating the semiconductor switch via the control terminal thereof and, for every two semiconductor switches that form a switch pair, contains a switching power supply which is supplied with energy from an electrical voltage between the two load terminals of a first semiconductor switch of the switch pair and supplies both the driver of the first semiconductor switch and the driver of the second semiconductor switch of the switch pair with energy.
Circuit arrangement and power converter module having semiconductor switches connected in series
A circuit arrangement has an even number of semiconductor switches, which are connected in series and contain in each case two load terminals and a control terminal and are associated with one another in pairs. The circuit arrangement also contains, for each semiconductor switch, a driver for actuating the semiconductor switch via the control terminal thereof and, for every two semiconductor switches that form a switch pair, contains a switching power supply which is supplied with energy from an electrical voltage between the two load terminals of a first semiconductor switch of the switch pair and supplies both the driver of the first semiconductor switch and the driver of the second semiconductor switch of the switch pair with energy.
Intelligent circuit breakers with air-gap and solid-state switches
A circuit breaker comprises a solid-state switch, an air-gap electromagnetic switch, switch control circuitry, a zero-crossing detection circuit, and a current sensor. The solid-state and air-gap switches are connected in series in an electrical path between line input and load output terminals of the circuit breaker. The switch control circuitry controls the solid-state and air-gap switches. The zero-crossing detection circuit detects zero crossings of an AC waveform on the electrical path. The current sensor senses current flow in the electrical path to detect a fault condition based on the sensed current flow. In response to a detected fault condition, the switch control circuitry generates control signals to place the solid-state switch into a switched-off state and place the air-gap switch into a switched-open state after the solid-state switch is placed into the switched-off state. The switch control circuitry utilizes zero-crossing detection signals output from the zero-crossing detection circuit to determine when to place the air-gap switch into the switched-open state.
SELF-POWER FEED CIRCUIT AND POWER CONVERSION DEVICE
A master converter and a plurality of slave converters each have an input connected to an associated one of a plurality of power storage elements, respectively, and an output connected to an output terminal in parallel. The master converter converts the voltage of the associated capacitor based on a duty ratio for matching an output voltage to a voltage command value, outputs the converted voltage to the output terminal, and transmits a control signal indicative of the duty ratio to the plurality of slave converters via a signal insulation unit. Each of the plurality of slave converters converts the voltage of the associated capacitor in response to the control signal transmitted via the signal insulation unit and outputs the converted voltage to the output terminal. A correction means is configured to correct at least the duty ratio in the master converter such that the duty ratio in the master converter matches the duty ratio in each of the plurality of slave converters.
Modular power supply system
A modular power supply system includes: a main controller, configured to output a main control signal; N local controllers, wherein each of the local controllers is configured to receive the main control signal to output at least one local control signal; and N power units, in one-to-one correspondence with the N local controllers, wherein each of the power units includes a first end and a second end, and the second end of each of the power units is connected to the first end of an adjacent one of the power units, each of the power units is configured to include M power converters, wherein each of the power converters includes a third end and a fourth end, the fourth end of each of the power converters is connected to the third end of an adjacent one of the power converters.
AUXILIARY POWER SUPPLY CIRCUIT AND POWER SUPPLY DEVICE
An auxiliary power supply circuit configured to receive power from an auxiliary power supply in which a negative electrode is connected to a switch node; and supply power to a capacitor in which a negative electrode is connected to a high potential node, the auxiliary power supply circuit comprises a switch element connected between the high potential node and the switch node; and a diode in which an anode is connected to a positive electrode of the auxiliary power supply and a cathode is connected to a positive electrode of the capacitor, wherein a voltage at the switch node is alternately switched to (i) a first voltage that is substantially the same as a voltage at the high potential node, and (ii) a second voltage that is lower than the first voltage.
HALF-BRIDGE MODULE OF A TRACTION INVERTER OF POWER ELECTRONICS OF AN ELECTRIC OR HYBRID VEHICLE
The invention relates to a half bridge module in a traction inverter for a power electronics unit in an electric or hybrid vehicle, comprising a substrate, semiconductor switching elements on a first side of the substrate, power connections, to which power lines that conduct electrical traction energy can be connected, signal connections, to which signal lines can be connected for switching the semiconductor switching elements, and a casting compound, which encompasses the substrate and the semiconductor switching elements on the first side of the substrate, wherein the power connections and the signal connections can all be accessed from the first side of the substrate, such that the power connections and the signal connections extend through the casting compound, seen from the first side of the substrate, and are located within a base area spanning the substrate, seen from the direction they pass through the casting compound.
HALF-BRIDGE MODULE OF A TRACTION INVERTER OF POWER ELECTRONICS OF AN ELECTRIC OR HYBRID VEHICLE
The invention relates to a half bridge module in a traction inverter for a power electronics unit in an electric or hybrid vehicle, comprising a substrate, semiconductor switching elements on a first side of the substrate, power connections, to which power lines that conduct electrical traction energy can be connected, signal connections, to which signal lines can be connected for switching the semiconductor switching elements, and a casting compound, which encompasses the substrate and the semiconductor switching elements on the first side of the substrate, wherein the power connections and the signal connections can all be accessed from the first side of the substrate, such that the power connections and the signal connections extend through the casting compound, seen from the first side of the substrate, and are located within a base area spanning the substrate, seen from the direction they pass through the casting compound.