Patent classifications
H02M7/48
Capacitor unit, and electric compressor
A capacitor unit (20) includes: a harness side terminal (23) provided in a housing (22) for accommodating a capacitor main body therein and connectable to an electric power harness for supplying DC power from an outside; and a board side terminal (24) connectable to a circuit board from which the DC power is output via the capacitor main body. The board side terminal (24) extends in a plate shape from a base portion (24b) held in the housing (22) toward a distal end portion (24a) connected to the circuit board, and has a notch portion (40) recessed inward of the board side terminal (24) in a width direction between the base portion (24b) and the distal end portion (24a).
Reduced power consumption for LLC resonant converter under light load
This disclosure provides a resonant LLC power converter unit to provide a plurality of power outputs. The power converter unit includes multiple transformers arranged such that at least one primary winding of each transformer is connected in parallel and configured to provide a power output to a secondary that powers one of the plurality of outputs. One of these transformers, or a parallel choke across an output bus, can be used to provide lower power to the output bus during a standby state (i.e., during a light- or no-load condition). The power converter unit includes a first switching section for providing a first power input during normal operation and a second switching section for providing a second power input during no- or light-load conditions.
Power Converter, Charging Post and Vehicle
A power converter, includes: a first terminal, a second terminal, a third terminal and a fourth terminal; stored-energy-source terminals, to which a stored energy source can be connected; four inverter bridge branches, which are formed from semiconductor switching devices, the inverter bridge branches each having a center tap, each center tap being assigned to one of the terminals, and the inverter bridge branches being interconnected and controllable such that electrical energy can be transferred bidirectionally between the stored-energy-source terminals and the first terminal, the second terminal, the third terminal and/or the fourth terminal; and a control unit, which is designed to control the semiconductor switching devices of the inverter bridge branches.
POWER CONVERTER
A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.
POWER CONVERTER
A power converter includes semiconductor modules, a capacitor, a circuit board, a casing, a busbar and a shield layer. The capacitor is electrically connected to the semiconductor modules. The casing accommodates the circuit board, the semiconductor modules and the capacitor. The busbar has an input terminal portion, an output terminal portion and an electric pathway connecting the input terminal portion and the output terminal portion. The electric pathway is connected to at least one of electronic components including the semiconductor modules and the capacitor. The busbar has a built-in portion incorporated into the casing. The shield layer is electrically conductive and provided on an inner surface or an outer surface of the casing such that the shield layer covers the built-in portion.
Method for operating an inverter and inverter for carrying out the method
In a method for operating an inverter for converting DC voltage into AC voltage, having at least one DC/DC step-up converter for converting a DC input voltage applied at the step-up converter DC input into an output voltage higher by a voltage stroke, an intermediate circuit, a DC/AC converter and an AC output for connection to a supply network and/or consumers, a voltage ripple is superimposed on the intermediate circuit voltage and in each step-up converter a switch is switched on/off with a specific switching frequency and a specific duty cycle, for measuring the output voltage of each step-up converter and the intermediate circuit voltage including the voltage ripple. A minimum voltage stroke of each step-up converter is dynamically calculated as a function of the respective measured step-up converter input voltage and the measured intermediate circuit voltage ripple, which minimizes the intermediate circuit voltage setpoint.
POWER CONVERTER AND POWER CONVERSION METHOD USING THE SAME
A power converter includes a voltage control unit, a current control unit and a hysteresis control unit. The voltage control unit generates a first current command. The hysteresis control unit couples the voltage control unit with the current control unit and is configured to: in the first mode, decouple the voltage control unit and the current control unit and generate a second current command to be transmitted to the current control unit when the detection current reaches the first threshold value, and couple the voltage control unit with the current control unit and transmit the first current command generated by the voltage control unit to the current control unit when the first current command reaches a second threshold value for switching to a second mode from the first mode. The current control unit outputs a mode control signal according to the first current command and the second current command.
Semiconductor device
A semiconductor device includes, a semiconductor element, a wiring member arranged to sandwich the semiconductor element, a sealing resin body. The semiconductor element has an SBD formed thereon with a base material of SiC which is a wide band gap semiconductor. The semiconductor element has two main electrodes on both surfaces. The wiring member includes (i) a heat sink electrically connected to a first main electrode and (ii) a heat sink and a terminal electrically connected to a second main electrode. The semiconductor device further includes an insulator. The insulator has a non-conducting element made of silicon. The insulator has joints on both of two surfaces for mechanical connection of the heat sinks.
Power conversion device
Obtained is a power conversion device that suppresses size increase thereof while improving cooling performance for a smoothing capacitor. The power conversion device includes: a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power. A thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected.
Power conversion device
Obtained is a power conversion device that suppresses size increase thereof while improving cooling performance for a smoothing capacitor. The power conversion device includes: a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power. A thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected.