The invention relates to a microelectromechanical system (10) comprising a drive module (200) comprising: a fixed drive portion (210), a movable drive portion (220), and a suspension (230),
the movable drive portion (220) being able to be moved relative to the fixed drive portion (210) in a first direction (A), as a result of an electrostatic force, which causes an elastic deformation of the suspension (230), and the movable drive portion (220) being able to be moved relative to the fixed drive portion (210) in a second direction (B), opposite to the first direction (A), as a result of an elastic return force generated by the suspension (230),
the actuator (11) also comprising a stop (24) limiting the movement of the first movable portion (220) in the second direction (B) so that the elastic force generated by the suspension (230) is not cancelled.

In one embodiment, a device is provided that includes: a plurality of actuators arranged into a plurality of rows and a plurality of columns; a plurality of row conductors corresponding to the plurality of rows; a plurality of column conductors corresponding to the plurality of columns; and a controller configured to select at least one of the actuators in a row by raising a voltage on the corresponding row conductor to couple each selected actuator to its corresponding column conductor.

An optical module includes a semiconductor substrate, an electrostatic actuator including a fixed portion fixed to the semiconductor substrate and a movable portion moved with respect to the fixed portion by an electrostatic force generated between the movable portion and the fixed portion, a first spring portion connected to the movable portion and having a first spring constant K1, a second spring portion connected between the first spring portion and the semiconductor substrate and having a second spring constant K2 greater than the first spring constant K1, and a movable mirror which is an optical component connected to a connection portion between the first spring portion and the second spring portion.

An apparatus is provided. The apparatus includes a bidirectional comb drive actuator. The apparatus may also include a cantilever. The cantilever includes a first end connected to the bidirectional comb drive actuator and a second end connected to an inner frame. In addition, the cantilever may include first and second conductive layers for routing electrical signals. Embodiments of the disclosed apparatuses, which may include multi-dimensional actuators, allow for an increased number of electrical signals to be routed to the actuators. Moreover, the disclosed apparatuses allow for actuation multiple directions, which may provide for increased control, precision, and flexibility of movement. Accordingly, the disclosed embodiments provide significant benefits with regard to optical image stabilization and auto-focus capabilities, for example in size- and power-constrained environments.

A micro machine may be in or less than the micrometer domain. The micro machine may include a micro actuator and a micro shaft coupled to the micro actuator. The micro shaft is operable to be driven by the micro actuator. A tool is coupled to the micro shaft and is operable to perform work in response to at least motion of the micro shaft.

A multiple silicon trenches forming method and an etching mask structure, the method comprises: step S11, providing a MEMS sealing cap silicon substrate (100); step S12, forming n stacked mask layers (101, 102, 103) on the MEMS sealing cap silicon substrate (100), after forming each mask layer, photolithographing and etching the mask layer and all other mask layers beneath the same to form a plurality of etching windows (D1, D2, D3); step S13, etching the MEMS sealing cap silicon substrate by using the current uppermost mask layer and a layer of mask material beneath the same as a mask; step S14, removing the current uppermost mask layer; step S15, repeating the step S13 and the step S14 until all the n mask layers are removed. The present invention can form a plurality of deep trenches with high aspect ratio on the MEMS sealing cap silicon substrate using conventional semiconductor processes, avoiding the problem that the conventional spin coating cannot be conducted on a sealing cap wafer with deep trenches using photoresist.

Disclosed are an electrostatically driven comb structure of an MEMS (Micro Electro Mechanical System), a micro-mirror using the same, and a preparation method therefor. The surface of a comb of the electrostatically driven comb structure of the MEMS has an insulating layer, and the insulating layers on the surfaces of adjacent combs are the same type of insulating layers or different insulating layers; the micro-mirror with the electrostatically driven comb structure of the MEMS successively includes a substrate, an isolating layer and a device layer from bottom to top; the method for manufacturing the micro-mirror prepares the insulating layers by high temperature oxidization, plasma enhanced chemical vapor deposition, low pressure chemical vapor deposition, atmospheric pressure chemical vapor deposition, physical deposition, atomic layer deposition or stepwise heterogeneous deposition; same or different insulating layers are obtained on the surfaces of the driving comb and the ground comb; when the driving comb and the ground comb adsorb each other, the insulating layers on the surfaces of the two contact without forming a short circuit, so that a good insulating effect is achieved. The electrostatically driven MEMS micro-mirror capable of preventing adsorptive damage provided by the present invention features compact structure and simple process.

A MEMS includes a substrate with a substrate extension that rises above a substrate plane. The MEMS includes a movable structural element, a first spring element that mechanically connects the movable structural element to the substrate extension, and a second spring element that mechanically connects the movable structural element to the substrate extension. The first spring element and the second spring element form a parallelogram guide of the movable structural element in relation to the substrate extension.

Disclosed are an electrostatically driven comb structure of an MEMS (Micro Electro Mechanical System), a micro-mirror using the same, and a preparation method therefor. The surface of a comb of the electrostatically driven comb structure of the MEMS has an insulating layer, and the insulating layers on the surfaces of adjacent combs are the same type of insulating layers or different insulating layers; the micro-mirror with the electrostatically driven comb structure of the MEMS successively includes a substrate, an isolating layer and a device layer from bottom to top; the method for manufacturing the micro-mirror prepares the insulating layers by high temperature oxidization, plasma enhanced chemical vapor deposition, low pressure chemical vapor deposition, atmospheric pressure chemical vapor deposition, physical deposition, atomic layer deposition or stepwise heterogeneous deposition; same or different insulating layers are obtained on the surfaces of the driving comb and the ground comb; when the driving comb and the ground comb adsorb each other, the insulating layers on the surfaces of the two contact without forming a short circuit, so that a good insulating effect is achieved. The electrostatically driven MEMS micro-mirror capable of preventing adsorptive damage provided by the present invention features compact structure and simple process.

A near-eye light field display for use with a head mounted display unit with enhanced resolution and color depth. A display for each eye is connected to one or more actuators to scan each display, increasing the resolution of each display by a factor proportional to the number of scan points utilized. In this way, the resolution of near-eye light field displays is enhanced without increasing the size of the displays.