An ultrasonic motor is provided that includes a stator including first and second piezoelectric elements provided on a first main surface of a vibrator having a plate shape, a rotor in direct or indirect contact with a second main surface of the vibrator, and a wiring member connected to the first and second piezoelectric elements. Moreover, the wiring member includes first and second connection members connected to the first and second piezoelectric elements, a central wiring portion connected to the first and second connection members and provided in a region including a center of an axial direction, and an extended wiring portion connected to the central wiring portion. The central wiring portion is fixed to the first main surface of the vibrator and the extended wiring portion is lifted from the first main surface of the vibrator.

A piezoelectric driving device includes a substrate, a plurality of piezoelectric elements disposed on the substrate, a first groove section provided between the plurality of piezoelectric elements, and a first wire provided in at least a part of a side surface and a bottom section of the first groove section.

A device and method using the electromechanical properties of piezoelectric materials to generate and deliver electrical power to a high speed electrically powered rotatable shaft. The device has a stationary module that is connected to an electrical source; and has a rotatable module, which is mechanically connected to the electrically powered rotatable shaft. The rotatable module rotates relative to the stationary module. When the stationary module is electrically energized, the stationary piezoelectric component expands and causes the rotatable piezoelectric component to compress. When the rotatable piezoelectric component compresses, it generates electrical power transferred to the electrically powered rotatable shaft. Thus, electrical energy can be delivered to the electrically powered rotatable shaft without a direct electrical connection. The present invention is particularly useful in applications requiring large diameter through-hole dimensions.

A piezoelectric device (an actuator unit) includes the following: a first substrate (a pressure chamber forming substrate, a diaphragm) having a piezoelectric layer and a first wiring conductor (a top electrode layer) that is at least partially stacked on the piezoelectric layer; and a second substrate (a sealing substrate) having a second wiring conductor (a bottom wiring conductor) that faces and is separated from the first wiring conductor (a top electrode layer) and to which an electrical signal different from an electrical signal that is applied to the first wiring conductor (a top electrode layer) is applied. At least one of the first wiring conductor (a top electrode layer) and the second wiring conductor (a bottom wiring conductor) is at least partially covered with an electrically insulating protective layer.

An electrical connection structure for connecting a piezoelectric element and an electrical circuit to each other with a conductive adhesive is described. The electrical connection structure includes an epoxy, a conductive component surrounded by the epoxy, and a trace feature implemented on top of the electrical connection structure.

A light deflector includes a reflector having a reflecting surface; a first movable unit having one end coupled to the reflector; a second movable unit having one end coupled to the reflector, the reflector disposed between the first movable unit and the second movable unit; a first piezoelectric element on the first movable unit; a second piezoelectric element on the second movable unit; a first supporting part coupled to the other end of the first movable unit; a second supporting part coupled to the other end of the second movable unit; an input part configured to receive voltage to be applied to at least the second piezoelectric element; and a wire electrically connecting the second piezoelectric element and the input part through the reflector configured to transmit the voltage to the second piezoelectric element. A passage area is provided through which light reflected by the reflector passes.

A vibration type actuator includes a vibrating body including an elastic body and an electro-mechanical energy conversion element, a contact body contacting the vibrating body, a flexible printed board provided with a concave portion on a surface opposite to a surface contacting the electro-mechanical energy conversion element and configured to supply electric power to the electro-mechanical energy conversion element, and a holding member provided with a projection portion engaging with the concave portion.

A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.

A piezoelectric MEMS scanning mirror system is provided. In particular, the efficiency and life of the system are improved by use of new bonding methods. Mechanical and electrical connections between the actuator frame of a piezoelectric MEMS scanning mirror system and the piezoelectric actuators in the system may be created using an anisotropic conductive adhesive. An anisotropic conductive adhesive only conducts electricity across the bond line between a lower portion of the piezoelectric actuator and a top of the metal frame. One way this is done is to provide a sparse loading of conductive particles. When the piezoelectric element is compressed against the frame, the conductive particles only form a conductive path across the bond line. Grit blasting, sanding, or chemical etching may be used to roughen the metal surface prior to bonding. A surface roughness between 2 RMS and 6 RMS may be created on the metal frame.

A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.