A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.

A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.

To improve both of the mechanical reliability and electrical reliability of an electronic apparatus including a piezoelectric body, a vibrator, and a vibration wave motor. The piezoelectric body is configured by bonding a piezoelectric element and a flexible printed circuit substrate FPC, a coverlay has an end N made up of a first outline part and a second outline part that intersect with wiring layers, the first outline part coming in contact with an electrode F1 of electrodes F, and the second outline part coming in contact with another electrode of the electrodes F. Length L1 from an outer-shape line M of the piezoelectric element that intersects with the FPC to the first outline part is shorter than length L2 from the outer-shape line M to the second outline part, and the electrode F1 is located closer to the outer-shape line than the other electrode of the electrodes F.

A piezoelectric driving device includes a vibrating plate, and a piezoelectric vibrating body including a substrate, and piezoelectric elements provided on the substrate. The piezoelectric element includes a first electrode, a second electrode, and a piezoelectric body, and the first electrode, the piezoelectric body, and the second electrode are laminated in this order on the substrate. The piezoelectric vibrating body is installed on the vibrating plate so that the piezoelectric element is interposed between the substrate and the vibrating plate. A wiring pattern including a first wiring corresponding to the first electrode and a second wiring corresponding to the second electrode is formed on the vibrating plate, the first electrode and the first wiring are connected to each other through a first laminated conducting portion, and the second electrode and the second wiring are connected to each other through a second laminated conducting portion.

A light deflector includes a reflector having a reflecting surface; a first movable unit having one end coupled to the reflector; a second movable unit having one end coupled to the reflector, the reflector disposed between the first movable unit and the second movable unit; a first piezoelectric element on the first movable unit; a second piezoelectric element on the second movable unit; a first supporting part coupled to the other end of the first movable unit; a second supporting part coupled to the other end of the second movable unit; an input part configured to receive voltage to be applied to at least the second piezoelectric element; and a wire electrically connecting the second piezoelectric element and the input part through the reflector configured to transmit the voltage to the second piezoelectric element. A passage area is provided through which light reflected by the reflector passes.

A drive element is a drive element for rotating a movable part about a rotation axis, the drive element including: a fixation part rotatably supporting the movable part; and a drive part configured to rotate the movable part, wherein the drive part includes a piezoelectric layer, an upper electrode and a lower electrode placed with the piezoelectric layer interposed therebetween, and an insulating layer covering the piezoelectric layer, the upper electrode, and the lower electrode, and a wiring part composed of a single conductive layer connected to the upper electrode via a contact hole formed in the insulating layer is installed up to the fixation part.

An image pickup apparatus is capable of decreasing a space capacity occupied by component elements and being downsized compared to a case where an actuator is arranged independently of a supporting unit. The image pickup apparatus has an image pickup unit driven by the actuator, a base unit, and the supporting unit provided in a standing manner from the base unit and rotatably supports the image pickup unit. The actuator has a piezoelectric element and an oscillator including a transmission unit which transmits driving force caused by vibration excited by the piezoelectric element. The transmission unit is arranged in the supporting unit so that it is in pressure contact with the image pickup unit. The image pickup unit has a transmitted plane with which the transmission unit is brought into pressure contact, and the vibration excited by the oscillator causes the transmitted plane to move relatively to the oscillator.

In a piezoelectric driving device, a load due to flection deformation of a flexible substrate can be prevented from being applied to a piezoelectric element and decrease in driving efficiency of the driving device can be prevented. The flexible substrate of the driving device includes a first fixing portion fixed to the piezoelectric element, a second fixing portion fixed to a holding member, and a bending portion in which the flection deformation is formed with movement of a vibrating plate. The second fixing portion is provided between the first fixing portion and the bending portion along the flexible substrate.

A piezoelectric device (an actuator unit) includes the following: a first substrate (a pressure chamber forming substrate, a diaphragm) having a piezoelectric layer and a first wiring conductor (a top electrode layer) that is at least partially stacked on the piezoelectric layer; and a second substrate (a sealing substrate) having a second wiring conductor (a bottom wiring conductor) that faces and is separated from the first wiring conductor (a top electrode layer) and to which an electrical signal different from an electrical signal that is applied to the first wiring conductor (a top electrode layer) is applied. At least one of the first wiring conductor (a top electrode layer) and the second wiring conductor (a bottom wiring conductor) is at least partially covered with an electrically insulating protective layer.

The harvester comprises a pendular unit comprising a beam that is elastically deformable in bending, a mount clamping a proximal end of the beam, and an inertial mass mounted at a free, distal end of the beam. The beam converts into an oscillating electric signal a mechanical energy produced by pendular unit oscillations. The beam comprises a flexible structure including a central core, a piezoelectric layer on at least one face of the central core, and at least one surface electrode on an external face of the piezoelectric layer. The central core of the flexible structure is made of a semiconductor material adapted to form an integrated circuit substrate. The substrate made of a semiconductor material of the central core includes monolithic integrated structures, and the arrangement, over the extend of the central core substrate, of said integrated structures forms in the longitudinal direction a plurality of successive areas having different bending stiffness coefficients from an area to another.