A piezoelectric driving apparatus including a substrate; a piezoelectric element which has a first electrode provided on the substrate, a piezoelectric body layer provided on the first electrode, and a second electrode provided on the first piezoelectric body layer, a layer including copper provided along an outer periphery of the substrate in plan view and electrically connected to the first electrode; and a conductive layer including nickel and phosphorus provided so as to cover the layer including copper.

A light-emitting module structure comprises a support substrate and a micro-module disposed on or in the support substrate that extends over only a portion of the support substrate. The micro-module comprises a rigid module substrate, an inorganic light-emitting diode, a power source, and a control circuit. The inorganic light-emitting diode, the power source, and the control circuit are disposed on or in the module substrate and the control circuit receives power from the power source to control the inorganic light-emitting diode to emit light. A light conductor is disposed on or in the support substrate and in alignment with the micro-module so that the inorganic light-emitting diode is disposed to emit light into the light conductor and the light conductor conducts the light beyond the micro-module to emit the light from the light conductor.

The harvester comprises a pendular unit comprising a beam that is elastically deformable in bending, a mount clamping a proximal end of the beam, and an inertial mass mounted at a free, distal end of the beam. The beam converts into an oscillating electric signal a mechanical energy produced by pendular unit oscillations. The beam comprises a flexible structure including a central core, a piezoelectric layer on at least one face of the central core, and at least one surface electrode on an external face of the piezoelectric layer. The central core of the flexible structure is made of a semiconductor material adapted to form an integrated circuit substrate. The substrate made of a semiconductor material of the central core includes monolithic integrated structures, and the arrangement, over the extend of the central core substrate, of said integrated structures forms in the longitudinal direction a plurality of successive areas having different bending stiffness coefficients from an area to another.

An apparatus includes a hollow piezoelectric stator of symmetrical cross-section about two orthogonal axes. The stator includes first outer and inner faces, wherein the first outer face includes a first contact tip; second outer and inner faces; third outer and inner faces; fourth outer and inner faces; and eight electrode portions, wherein one of the eight electrode portions is positioned on each of said faces. A method of moving a rotor along a y-axis relative to an object is disclosed, wherein an orthogonal x-axis direction is normal to an engagement surface of the rotor at a first contact tip of a piezoelectric stator. The method includes positioning a first portion of a preload mechanism in a hollow space of the piezoelectric stator, attaching a second portion to the object, and moving the first contact tip along an elliptical path in an x-y plane to frictionally couple the engagement surface.