A circuit device includes an oscillation circuit generating an oscillation signal by oscillating a vibrator, a temperature sensor circuit performing an intermittent operation, a logic circuit performing temperature compensation processing based on an output of the temperature sensor circuit, and a power supply circuit supplying power to the oscillation circuit. Further, the logic circuit or the power supply circuit is disposed between the oscillation circuit and the temperature sensor circuit.

A circuit device includes an oscillation circuit that generates an oscillation signal by using a vibrator, a frequency adjustment circuit that adjusts an oscillation frequency of the oscillation circuit based on frequency adjustment data, a temperature sensor circuit that outputs temperature data, an arithmetic operation circuit, and a storage circuit. The arithmetic operation circuit outputs converted temperature data by performing, on the temperature data, conversion processing in which a slope of the converted temperature data with respect to the temperature data in a first temperature range is different from a slope of the converted temperature data with respect to the temperature data in a second temperature range. The storage circuit stores a lookup table representing a correspondence between the converted temperature data and the frequency adjustment data.

An aspect of the present disclosure concerns an oscillator circuit including a driver circuit that includes a first amplifier and a current detector where the first amplifier produces an oscillation voltage signal, where the current detector detects an oscillation current signal and produces a drive voltage signal, and where the oscillation current signal corresponds to difference in voltage between the oscillation voltage signal and the drive voltage signal; a feedback circuit that includes a second amplifier receiving the oscillation voltage signal and the drive voltage signal, to produce a feedback voltage signal to the driver circuit; and an oscillator that oscillates at a frequency determined in accordance with the drive voltage signal.

A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.

In described examples, a method of operating a transmitter includes generating a frequency reference signal having a reference frequency and outputting the frequency reference to a phase locked loop (PLL) that includes a voltage controlled oscillator (VCO). The VCO output is locked to the frequency reference signal to form a carrier signal. The transmitter receives an I input signal, a Q input signal, and a direct current (DC) leaky carrier signal. Either the I input signal or the Q input signal is added to the leaky carrier signal. The carrier signal is modulated with the resulting two signals using an I-Q mixer to generate a modulated signal that includes an unmodulated carrier signal component. The modulated signal is then transmitted.

A wiring substrate includes a substrate with a first principal face and a second principal face. The first principal face has a first corner and first and second sides. The second principal face has a second corner corresponding to the first corner, and a third and a fourth side, respectively corresponding to the first and second sides. The substrate further comprising a first side surface connected to the first side, a second side surface connected to the second side, a third side surface connected to the third side, a fourth side surface connected to the fourth side, a first fracture part located between the first and third side surfaces to connect them, and a second fracture part located between the second and the fourth side surfaces to connect them. In the substrate's thickness direction, the length of the second side surface is smaller than the first side surface.

A clock oscillator includes with a pullable BAW oscillator to generate an output signal with a target frequency. The BAW oscillator is based on a BAW resonator and voltage-controlled variable load capacitance, responsive to a capacitance control signal to provide a selectable load capacitance. An oscillator driver (such as a differential negative gm transconductance amplifier), is coupled to the BAW oscillator to provide an oscillation drive signal. The BAW oscillator is responsive to the oscillation drive signal to generate the output signal with a frequency based on the selectable load capacitance. The oscillator driver can include a bandpass filter network with a resonance frequency substantially at the target frequency.

A system includes a tunable bulk acoustic wave (BAW) resonator device and a direct-current (DC) tuning controller coupled to the tunable BAW resonator device. The system also includes an oscillator circuit coupled to the tunable BAW resonator device. The DC tuning controller selectively adjusts a DC tuning signal applied to the tunable BAW resonator device to adjust a signal frequency generated by the oscillator circuit.

An electric measurement circuit possesses an electrical reaction leg for forming an oscillator from a resonator, and furthermore possesses a measurement leg the input of which is supplied by the electrical reaction leg. The measurement leg contains an adjustable phase shifter so that an additional excitation force that is applied to the resonator in the measurement leg can be adjusted in phase quadrature with respect to an excitation force that is applied to the resonator in the electrical reaction leg. Such an electrical measurement circuit is particularly suitable for forming a photoacoustic gas detector.

A stacked-die oscillator package includes an oscillator circuit die having inner bond pads, and outer bond pads, and a bulk acoustic wave (BAW) resonator die having a piezoelectric transducer with a first and second BAW bond pad on a same side coupled to a top and bottom electrode layer across a piezoelectric layer. A first metal bump is on the first BAW bond pad and a second metal bump is on the second BAW bond pad flip chip bonded to the inner bond pads of the oscillator circuit die. A polymer material is in a portion of a gap between the BAW and oscillator circuit die.