Patent classifications
H03F1/0288
BIASED TRANSISTOR MODULE
A biased-transistor-module comprising: a module-input-terminal; a module-output-terminal; a reference-terminal; a module-supply-terminal configured to receive a supply voltage; a module-reference-voltage-terminal configured to receive a module reference voltage; a main-transistor having a main-control-terminal, a main-first-conduction-channel-terminal and a main-second-conduction-channel-terminal, wherein the main-first-conduction-channel-terminal is connected to the module-output-terminal, and the main-second-conduction-channel-terminal is connected to the reference-terminal, and the main-control-terminal is connected to an input-signal-node, wherein the input-signal-node is connected to the module-input-terminal; and a bias-circuit. The bias-circuit comprises: a first-bias-transistor; a first-bias-resistor; a second-bias-transistor; and a second-bias-resistor.
MULTIPLE-PATH RF AMPLIFIERS WITH ANGULARLY OFFSET SIGNAL PATH DIRECTIONS, AND METHODS OF MANUFACTURE THEREOF
An embodiment of a Doherty amplifier module includes a substrate, an RF signal splitter, a carrier amplifier die, and a peaking amplifier die. The RF signal splitter divides an input RF signal into first and second input RF signals, and conveys the first and second input RF signals to first and second splitter output terminals. The carrier amplifier die includes one or more first power transistors configured to amplify, along a carrier signal path, the first input RF signal to produce an amplified first RF signal. The peaking amplifier die includes one or more second power transistors configured to amplify, along a peaking signal path, the second input RF signal to produce an amplified second RF signal. The carrier and peaking amplifier die are coupled to the substrate so that the RF signal paths through the carrier and peaking amplifier die extend in substantially different (e.g., orthogonal) directions.
Circuits, devices and methods related to antenna tuner
Circuits, devices and methods related to antenna tuner. In some embodiments, an antenna can be tuned by amplifying a signal for transmission by operating a transistor with a base current, and monitoring the base current. The method can further include adjusting an antenna tuner to thereby adjust an antenna load impedance presented to the amplified signal, with the adjustment being based on a variation of the monitored base current.
SYSTEM FOR OPERATING MULTIPLE TRANSCEIVER MODULES CONCURRENTLY
Embodiments describe systems, apparatuses, and methods for transmitting/receiving signal data to/from a plurality of transceiver modules. Devices in accordance with some embodiments can include a plurality of wireless transceiver modules, each wireless transceiver module to be communicatively coupled to a corresponding external transceiver mixture, one or more antennas to exchange signal data with the plurality of external transceiver modules, a radio frequency (RF) circulator, and one or more amplifiers to amplify the signal data received by the one or more antennas and signal data to be transmitted by the one or more antennas. The use of the RF circulator prevents transmitting signals that may collide with each other and cause interference with the communications.
METHOD AND APPARATUS FOR ACHIEVING AND MAINTAINING BALANCE IN SOLID-STATE RF AND MICROWAVE POWER AMPLIFIERS
This application is generally related to methods for improving performance in a system. One of the methods may include a step of determining whether absorbed power in a system meets a predetermined threshold. The absorbed power may be based upon first and second Walsh codes transmitted to each of first and second gain and phase modulators in the system. The first Walsh code may be orthogonal to the second Walsh code. A first set of the first and second Walsh codes may be inverted with respect to a second set of the first and second Walsh codes. The method may also include a step of modulating the absorbed power in view of the determination. The method may further include a step of transmitting feedback based upon the modulated power to the first and second gain and phase modulators.
Doherty amplifier device
An amplifier device includes a substrate, a composite packaged amplifier having a bottom plate and an output plate, a first amplifier and a second amplifier provided on the bottom plate, a combining node that combines an output of the first amplifier with an output of the second amplifier, an output matching circuits provided on the bottom plate, that has a first transmission line provided between the first amplifier and the combining node, and a second transmission line provided between the combining node and the second amplifier, a third transmission line having one transmission line on which the output plate is mounted and other transmission line that connects the one transmission line to the external port, and wirings connecting to one terminal of the output plate and the combining node. A length of the output plate and the other transmission line is equal or less than π/4 radian for a signal.
No-load-modulation, high-efficiency power amplifier
Apparatus and methods for a multiclass, broadband, no-load-modulation power amplifier are described. The power amplifier (500) may include a main amplifier (532) operating in a first amplification class and a plurality of peaking amplifiers (536, 537, 538) operating in a second amplification class. The main amplifier (532) and peaking amplifiers (536, 537, 538) may operate in parallel on portions of signals derived from an input signal to be amplified. The main amplifier (532) may see no modulation of its load impedance between a fully-on state of the power amplifier (all amplifiers amplifying) and a fully backed-off state (peaking amplifiers idle). By avoiding load modulation, the power amplifier (500) can exhibit improved bandwidth and efficiency compared to conventional Doherty amplifiers.
DOHERTY AMPLIFIER
A Doherty amplifier includes: a first amplifier to amplify a first signal as an auxiliary amplifier in a case where a frequency of each of the first signal and a second signal is a first frequency, and amplify the first signal as a main amplifier in a case where the frequency of each of the first signal and the second signal is a second frequency; a second amplifier to amplify the second signal as a main amplifier in a case where the frequency of each of the first signal and the second signal is the first frequency, and amplify the second signal as an auxiliary amplifier in a case where the frequency of each of the first signal and the second signal is the second frequency; and a combiner to synthesize the first signal amplified by the first amplifier and the second signal amplified by the second amplifier.
AMPLIFIER CIRCUIT
An amplifier circuit is configured in such a way that the amplifier circuit includes: a first amplifier to amplify a signal to be amplified; an output matching circuit through which the signal amplified by the first amplifier propagates; and a second amplifier to amplify the signal which has propagated through the output matching circuit, and the output matching circuit is a lumped constant circuit including multiple lumped constant elements, and, by using the multiple lumped constant elements, transforms the impedance seen on the second amplifier side from the first amplifier when the output power of the second amplifier is lower than saturation electric power, to impedance higher than impedance seen on the second amplifier side from the first amplifier when the output power of the second amplifier is equal to the saturation electric power.
POWER AMPLIFIER MODULES AND SYSTEMS CONTAINING ELECTROMAGNETIC BANDGAP ISOLATION ARRAYS
Power amplifier systems including power amplifier modules (PAMs) and electromagnetic bandgap (EBG) isolation structures are disclosed. In embodiments, the power amplifier system includes a printed circuit board (PCB) and a PAM mounted to the PCB in an inverted orientation. The PCB has a PCB frontside on which a PAM mount region is provided, and radio frequency (RF) input and output bondpads. The PAM includes a topside input/output interface having RF input and output terminals electrically coupled to the RF input and output pads, respectively. The power amplifier system further includes a first EBG isolation structure containing a first grounded EBG cell array, at least a portion of which is located within or beneath the PAM mount region.