Herein disclosed in some embodiments is a fault detector for power amplifiers of a communication system. The fault detector can detect a portion of the power amplifiers that are in fault condition and can prevent or limit current flow to the power amplifiers in fault condition while allowing the rest of the power amplifiers to operate normally. The fault detector can further indicate which power amplifiers are in fault condition and/or the cause for the power amplifiers to be in fault condition. Based on the indication, a controller can direct communications away from the power amplifiers in fault condition and/or perform operations to correct the fault condition.

A DC-to-DC converter block with multiple supply voltages includes a power circuit, the power circuit including N depletion-mode HEMT transistors (T3_1, T3_2, T3_N), N being a natural number greater than or equal to 3. The DC-to-DC converter block also includes a gate drive circuit for the N depletion-mode HEMT transistors (T3_1, T3_2, T3_N) of the power circuit, the drive circuit including depletion-mode HEMT transistors (T1_1, T2_1, T1_2, T2_2, T1_N, T2_N) configured to drive the gates of the N depletion-mode HEMT transistors (T3_1, T3_2, T3_N) of the power circuit, and the power circuit being powered by N positive and non-zero supply voltages, namely a lower supply voltage (VDD_1), an upper supply voltage (VDD_N), and (N2) intermediate supply voltages (VDD_2) distributed between the lower (VDD_1) and upper (VDD_N) supply voltages.

A DC-to-DC converter block with multiple supply voltages includes a power circuit, the power circuit including N depletion-mode HEMT transistors (T3_1, T3_2, T3_N), N being a natural number greater than or equal to 3. The DC-to-DC converter block also includes a gate drive circuit for the N depletion-mode HEMT transistors (T3_1, T3_2, T3_N) of the power circuit, the drive circuit including depletion-mode HEMT transistors (T1_1, T2_1, T1_2, T2_2, T1_N, T2_N) configured to drive the gates of the N depletion-mode HEMT transistors (T3_1, T3_2, T3_N) of the power circuit, and the power circuit being powered by N positive and non-zero supply voltages, namely a lower supply voltage (VDD_1), an upper supply voltage (VDD_N), and (N2) intermediate supply voltages (VDD_2) distributed between the lower (VDD_1) and upper (VDD_N) supply voltages.

Described herein are variable gain amplifiers and multiplexers that embed programmable attenuators into switchable paths to provide variable gain for individual amplifier inputs. The variable gain for an individual input is provided using a amplification stage that is common for each input of the amplifier. A variable attenuation is provided for individual inputs through a combination of a band selection switch and an attenuation selection branch. The attenuation can be tailored for individual inputs and can depend on a gain mode of the amplifier.

Described herein are variable gain amplifiers and multiplexers that embed programmable attenuators into switchable paths to provide variable gain for individual amplifier inputs. The variable gain for an individual input is provided using a amplification stage that is common for each input of the amplifier. A variable attenuation is provided for individual inputs through a combination of a band selection switch and an attenuation selection branch. The attenuation can be tailored for individual inputs and can depend on a gain mode of the amplifier.

A variable-gain power amplifying technique includes generating, with a network of one or more reactive components included in an oscillator, a first oscillating signal, and outputting, via one or more taps included in the network of the reactive components, a second oscillating signal. The second oscillating signal has a magnitude that is proportional to and less than the first oscillating signal. The power amplifying technique further includes selecting one of the first and second oscillating signals to use for generating a power-amplified output signal, and amplifying the selected one of the first and second oscillating signals to generate the power-amplified output signal.

A low noise amplifier (LNA) includes a pair of n-type transistors, each configured to provide a first transconductance; a pair of p-type transistors, each configured to provide a second transconductance; a first pair of coupling capacitors, cross-coupled between the pair of n-type transistors, and configured to provide a first boosting coefficient to the first transconductance; and a second pair of coupling capacitors, cross-coupled between the pair of p-type transistors, and configured to provide a second boosting coefficient to the second transconductance, wherein the LNA is configured to use a boosted effective transconductance based on the first and second boosting coefficients, and the first and second transconductances to amplify an input signal.

A low noise amplifier (LNA) includes a pair of n-type transistors, each configured to provide a first transconductance; a pair of p-type transistors, each configured to provide a second transconductance; a first pair of coupling capacitors, cross-coupled between the pair of n-type transistors, and configured to provide a first boosting coefficient to the first transconductance; and a second pair of coupling capacitors, cross-coupled between the pair of p-type transistors, and configured to provide a second boosting coefficient to the second transconductance, wherein the LNA is configured to use a boosted effective transconductance based on the first and second boosting coefficients, and the first and second transconductances to amplify an input signal.

A semiconductor device includes: a first semiconductor layer formed, on a substrate, of a nitride semiconductor; a second semiconductor layer formed, on the first semiconductor layer, of a nitride semiconductor; a source electrode formed on the second semiconductor layer; a drain electrode formed on the second semiconductor layer; a metal oxide film formed, between the source electrode and the drain electrode, on the second semiconductor layer; and a gate electrode formed on the metal oxide film. The metal oxide film includes AlO.sub.x and InO.sub.x. AlO.sub.x/InO.sub.x in the metal oxide film is greater than or equal to 3.

A semiconductor device includes: a first semiconductor layer formed, on a substrate, of a nitride semiconductor; a second semiconductor layer formed, on the first semiconductor layer, of a nitride semiconductor; a source electrode formed on the second semiconductor layer; a drain electrode formed on the second semiconductor layer; a metal oxide film formed, between the source electrode and the drain electrode, on the second semiconductor layer; and a gate electrode formed on the metal oxide film. The metal oxide film includes AlO.sub.x and InO.sub.x. AlO.sub.x/InO.sub.x in the metal oxide film is greater than or equal to 3.