Embodiments include packaged semiconductor devices and methods of manufacturing packaged semiconductor devices. A semiconductor die includes a conductive feature coupled to a bottom surface of the die. The conductive feature only partially covers the bottom die surface to define a conductor-less region that spans a portion of the bottom die surface. The die is encapsulated by attaching the encapsulant material to the bottom die surface (e.g., including over the conductor-less region). The encapsulant material includes an opening that exposes the conductive feature. After encapsulating the die, a heatsink is positioned within the opening, and a surface of the heatsink is attached to the conductive feature. Because the heatsink is attached after encapsulating the die, the heatsink sidewalls are not directly bonded to the encapsulant material.

Embodiments include packaged semiconductor devices and methods of manufacturing packaged semiconductor devices. A semiconductor die includes a conductive feature coupled to a bottom surface of the die. The conductive feature only partially covers the bottom die surface to define a conductor-less region that spans a portion of the bottom die surface. The die is encapsulated by attaching the encapsulant material to the bottom die surface (e.g., including over the conductor-less region). The encapsulant material includes an opening that exposes the conductive feature. After encapsulating the die, a heatsink is positioned within the opening, and a surface of the heatsink is attached to the conductive feature. Because the heatsink is attached after encapsulating the die, the heatsink sidewalls are not directly bonded to the encapsulant material.

An apparatus is disclosed for current-mode filtering using current steering. In an example aspect, the apparatus includes a filter. The filter includes a current-steering node, a first output node, a second output node, a wideband path, and a narrowband path. The wideband path is coupled between the current-steering node and the first output node. The wideband path includes a wideband low-pass filter configured to pass frequencies within a wide passband. The narrowband path is coupled between the current-steering node and the second output node. The narrowband path includes a narrowband low-pass filter configured to pass a portion of the frequencies that are within a narrow passband.

A low-noise amplifier system is disclosed. The low-noise amplifier system includes a low-noise amplifier having an input node and an output node in a receive path and a capacitance equalization network coupled to the output node. Compensation capacitance of the capacitance equalization network sums with non-linear capacitance of the low-noise amplifier such that a total capacitance at the output node varies by no more than 5% over an output voltage range within voltage headroom limits of the low-noise amplifier for a given supply voltage of the low-noise amplifier. In at least some exemplary embodiments, the compensation capacitance of the capacitance equalization network is a function of output signal voltage at the output node.

A low-noise amplifier system is disclosed. The low-noise amplifier system includes a low-noise amplifier having an input node and an output node in a receive path and a capacitance equalization network coupled to the output node. Compensation capacitance of the capacitance equalization network sums with non-linear capacitance of the low-noise amplifier such that a total capacitance at the output node varies by no more than 5% over an output voltage range within voltage headroom limits of the low-noise amplifier for a given supply voltage of the low-noise amplifier. In at least some exemplary embodiments, the compensation capacitance of the capacitance equalization network is a function of output signal voltage at the output node.

A transistor includes an active region bounded by an outer periphery and formed in a substrate. The active region includes sets of input fingers, output fingers, and common fingers disposed within the substrate and oriented substantially parallel to one another. The transistor further includes an input port, an output port, a first via connection disposed at the outer periphery of the active region proximate the input port and a second via connection disposed at the outer periphery of the active region proximate the output port. The second via connection has a noncircular cross-section with a second major axis and a second minor axis, the second major axis having a second major axis length, the second minor axis having a second minor axis length that is less than the second major axis length. The second major axis is oriented parallel to a longitudinal dimension of the input, output, and common fingers.

The method and system for converging a 5th-generation (5G) communication system for supporting higher data rates beyond a 4th-generation (4G) system with a technology for internet of things (IoT) are provided. The method includes intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The system includes a power amplification device capable of minimizing the effect of envelope impedance. The power amplification device may be incorporated in a terminal and a base station.

The method and system for converging a 5th-generation (5G) communication system for supporting higher data rates beyond a 4th-generation (4G) system with a technology for internet of things (IoT) are provided. The method includes intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. The system includes a power amplification device capable of minimizing the effect of envelope impedance. The power amplification device may be incorporated in a terminal and a base station.

A current reuse type FET amplifier according to the present invention has a capacitance provided between a drain of a first FET in a first stage and a gate of a second FET in a next stage, electrically separates a gate voltage of the second FET from a drain voltage of the first FET, and includes a control circuit controlling the gate voltage of the first FET and the gate voltage of the second FET so that a variation of a drain current of the second FET and a variation of a drain voltage of the first FET are reduced in accordance with a variation of a saturation current Idss of the FET. Furthermore, the current reuse type FET amplifier according to the present invention uses only a depression mode FET to provide a circuit configuration operable with a positive single power source.

An amplifier includes a transistor chip including a plurality of transistor cells, a gate pad, and a drain pad, a matching substrate having a surface on which a metal pattern is formed, a terminal with a width larger than a width of the transistor chip and than a width of the matching substrate, a plurality of terminal wires connecting the terminal to the metal pattern, and a plurality of chip wires connecting the metal pattern to the transistor chip. Inter-wire distances of portions of the plurality of terminal wires connected to the metal pattern are larger than inter-wire distances between portions of the plurality of terminal wires connected to the terminal.