Bias circuits and methods for silicon-based amplifier architectures that are tolerant of supply and bias voltage variations, bias current variations, and transistor stack height, and compensate for poor output resistance characteristics. Embodiments include power amplifiers and low-noise amplifiers that utilize a cascode reference circuit to bias the final stages of a cascode amplifier under the control of a closed loop bias control circuit. The closed loop bias control circuit ensures that the current in the cascode reference circuit is approximately equal to a selected multiple of a known current value by adjusting the gate bias voltage to the final stage of the cascode amplifier. The final current through the cascode amplifier is a multiple of the current in the cascode reference circuit, based on a device scaling factor representing the relative sizes of the transistor devices in the cascode amplifier and in the cascode reference circuit.

A broadband power amplifier device includes an input matching network including first, second and third inductors, a driver amplifier, and first, second and third frequency modulators. First inductor has one end connected to output of a mixer and the other end connected to one end of the first frequency modulator, with the other end of the first frequency modulator being grounded. The second inductor has one end connected to one end of first inductor and the other end connected to input of driver amplifier, with second frequency modulator being connected across second inductor. Third inductor has one end connected to output of driver amplifier and the other end connected to input of power amplifier, with third frequency modulator being connected across third inductor. Bandwidth of power amplifier device can be extended and area and current consumption thereof can be reduced, while power can be improved without large LO driver.

An output signal can be free of any noise component generated from an amplifier disposed in a path, without degradation of the S/N ratio of the output signal. An amplifier includes: a first amplifier that is connected to an input node and generates a first intermediate signal; a feedback resistor that enables feedback of the first intermediate signal to the input node; an attenuator that receives the first intermediate signal and generates a second intermediate signal; a second amplifier that is connected to the input node and generates a third intermediate signal; a third amplifier that is connected to the input node and generates a fourth intermediate signal; and an adder that generates an output signal, using the second intermediate signal, the third intermediate signal, and the fourth intermediate signal.

An output signal can be free of any noise component generated from an amplifier disposed in a path, without degradation of the S/N ratio of the output signal. An amplifier includes: a first amplifier that is connected to an input node and generates a first intermediate signal; a feedback resistor that enables feedback of the first intermediate signal to the input node; an attenuator that receives the first intermediate signal and generates a second intermediate signal; a second amplifier that is connected to the input node and generates a third intermediate signal; a third amplifier that is connected to the input node and generates a fourth intermediate signal; and an adder that generates an output signal, using the second intermediate signal, the third intermediate signal, and the fourth intermediate signal.

An envelope tracking system includes an envelope tracking digital baseband (ETDBB) circuit, a digital-to-analog converter circuit, and an envelope tracking supply modulator (ETSM) circuit. The ETDBB circuit performs envelope detection upon a transmit (TX) baseband signal to generate an envelope detection result, and generates a digital envelope input according to the envelope detection result. The digital-to-analog converter circuit converts the digital envelope input into a supply envelope signal. The ETSM circuit generates a modulated supply voltage according to the supply envelope signal, and outputs the modulated supply voltage to a power amplifier. At least one of the ETDBB circuit and the ETSM circuit dynamically adjusts gain compression (GC) of the PA in response to a number of active resource blocks (RBs) in a channel bandwidth.

Package assemblies for improving heat dissipation of high-power components in microwave circuits are described. A laminate that includes microwave circuitry may have cut-outs that allow high-power components to be mounted directly on a heat slug below the laminate. Electrical connections to circuitry on the laminate may be made with wire bonds. The packaging allows more flexible design and tuning of packaged microwave circuitry.

Package assemblies for improving heat dissipation of high-power components in microwave circuits are described. A laminate that includes microwave circuitry may have cut-outs that allow high-power components to be mounted directly on a heat slug below the laminate. Electrical connections to circuitry on the laminate may be made with wire bonds. The packaging allows more flexible design and tuning of packaged microwave circuitry.

An exemplary structure has an output stage; a driver stage; and a power stage connected between the driver stage and the output stage. The power stage includes a first transistor and a second transistor connected in series between the driver stage and the output stage. The power stage also includes a third transistor and a fourth transistor connected in series between the driver stage and the output stage. An inductor has a first terminal electrically connected to a first node between the first transistor and the second transistor and a second terminal electrically connected to a second node between the third transistor and the fourth transistor. The inductor is configured to provide impedance matching between common-gate stages of the power stage.

Various methods and circuital arrangements for biasing one or more gates of stacked transistors of an amplifier are possible where the amplifier is configured to operate in at least an active mode and a standby mode. Circuital arrangements can reduce bias circuit standby current during operation in the standby mode while allowing a quick recovery to normal operating conditions of the amplifier. Biasing an input transistor of the stacked transistors can be obtained by using a replica stack circuit.

Various methods and circuital arrangements for biasing one or more gates of stacked transistors of an amplifier are possible where the amplifier is configured to operate in at least an active mode and a standby mode. Circuital arrangements can reduce bias circuit standby current during operation in the standby mode while allowing a quick recovery to normal operating conditions of the amplifier. Biasing an input transistor of the stacked transistors can be obtained by using a replica stack circuit.