H03F3/193

Signal processing device, and driving method and program thereof

A power switch 307a is provided between a bias generation circuit 301 and a high potential power source, or a power switch 307b is provided between the bias generation circuit 301 and a low potential power source. A bias potential Vb output from the bias generation circuit 301 is held by a potential holding circuit 300. The bias potential Vb held by the potential holding circuit 300 is input to a bias generation circuit 301a, and a bias potential Vb2 output from the bias generation circuit 301a on which an input signal IN is superimposed is input to an amplifier circuit 302. The potential holding circuit 300 is constituted of a capacitor 306 and a switch 305 formed of, for example, a transistor with a low off-state current that is formed using a wide band gap oxide semiconductor. Structures other than the above structure are claimed.

Multiplex modules for carrier aggregation receivers

Multiplex modules for use in carrier aggregation receivers are disclosed. In an exemplary embodiment, an apparatus includes an LNA multiplexer configured to receive a plurality of RF signals at a plurality of input terminals and to combine the RF signals into a combined RF signal that is output from an output terminal. The apparatus also includes an LNA demultiplexer configured to receive the combined RF signal at an input port that is connected to the output terminal and to distribute the combined RF signal to a plurality of output ports.

Multiplex modules for carrier aggregation receivers

Multiplex modules for use in carrier aggregation receivers are disclosed. In an exemplary embodiment, an apparatus includes an LNA multiplexer configured to receive a plurality of RF signals at a plurality of input terminals and to combine the RF signals into a combined RF signal that is output from an output terminal. The apparatus also includes an LNA demultiplexer configured to receive the combined RF signal at an input port that is connected to the output terminal and to distribute the combined RF signal to a plurality of output ports.

Transformer-based doherty power amplifier

Transformer-based Doherty power amplifier (PA). In some embodiments, a Doherty PA can include a carrier amplification path having an output that includes a carrier transformer, and a peaking amplification path having an output that includes a peaking transformer. The Doherty PA can further include a combiner configured to combine the outputs of the carrier and peaking amplification paths into an output node. The combiner can include a quarter-wave circuit implemented between the carrier and peaking transformers.

Transformer-based doherty power amplifier

Transformer-based Doherty power amplifier (PA). In some embodiments, a Doherty PA can include a carrier amplification path having an output that includes a carrier transformer, and a peaking amplification path having an output that includes a peaking transformer. The Doherty PA can further include a combiner configured to combine the outputs of the carrier and peaking amplification paths into an output node. The combiner can include a quarter-wave circuit implemented between the carrier and peaking transformers.

High-frequency amplifier
09774298 · 2017-09-26 · ·

According to one embodiment, a high-frequency amplifier includes an active element and an output matching circuit. The active element is provided on a substrate. The active element is configured to amplify a signal having a frequency band. The active element includes a cell region. The output matching circuit is connected to the active element. The output matching circuit includes a wire, a transmission line and an output terminal. The wire includes an input end and an output end. The input end of the wire is connected to an output part of the cell region of the active element. The transmission line is provided on the substrate. The transmission line includes an input part and an output part. The input part of the transmission line is connected to the output end of the wire. The output terminal is provided on the substrate.

High-frequency amplifier
09774298 · 2017-09-26 · ·

According to one embodiment, a high-frequency amplifier includes an active element and an output matching circuit. The active element is provided on a substrate. The active element is configured to amplify a signal having a frequency band. The active element includes a cell region. The output matching circuit is connected to the active element. The output matching circuit includes a wire, a transmission line and an output terminal. The wire includes an input end and an output end. The input end of the wire is connected to an output part of the cell region of the active element. The transmission line is provided on the substrate. The transmission line includes an input part and an output part. The input part of the transmission line is connected to the output end of the wire. The output terminal is provided on the substrate.

Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
09774301 · 2017-09-26 · ·

An embodiment of a Doherty amplifier module includes a substrate, an RF signal splitter, a carrier amplifier die, and a peaking amplifier die. The RF signal splitter divides an input RF signal into first and second input RF signals, and conveys the first and second input RF signals to first and second splitter output terminals. The carrier amplifier die includes one or more first power transistors configured to amplify, along a carrier signal path, the first input RF signal to produce an amplified first RF signal. The peaking amplifier die includes one or more second power transistors configured to amplify, along a peaking signal path, the second input RF signal to produce an amplified second RF signal. The carrier and peaking amplifier die are coupled to the substrate so that the RF signal paths through the carrier and peaking amplifier die extend in substantially different (e.g., orthogonal) directions.

Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
09774301 · 2017-09-26 · ·

An embodiment of a Doherty amplifier module includes a substrate, an RF signal splitter, a carrier amplifier die, and a peaking amplifier die. The RF signal splitter divides an input RF signal into first and second input RF signals, and conveys the first and second input RF signals to first and second splitter output terminals. The carrier amplifier die includes one or more first power transistors configured to amplify, along a carrier signal path, the first input RF signal to produce an amplified first RF signal. The peaking amplifier die includes one or more second power transistors configured to amplify, along a peaking signal path, the second input RF signal to produce an amplified second RF signal. The carrier and peaking amplifier die are coupled to the substrate so that the RF signal paths through the carrier and peaking amplifier die extend in substantially different (e.g., orthogonal) directions.

Low-noise amplifier for intra-band non contiguous carrier agregation

A low noise amplifier (LNA) system for amplifying a plurality of carriers includes a first amplifier circuit that generates a first radio-frequency (RF) output signal by amplifying a first input RF signal corresponding to a first frequency band, the first amplifier circuit having a first input impedance, and a second amplifier circuit that generates a second RF output signal by amplifying the first input RF signal when the system is in a first multi-output mode, a second input impedance of the second amplifier having a first impedance value when the system is in the first multi-output mode. The LNA system further includes a first impedance controller that maintains the second input impedance of the second amplifier circuit at a second impedance value when the apparatus is in a mode other than the first multi-output mode. The second impedance value is substantially the same as the first impedance value.