Amplification device and processes capable of miniaturization in a device for performing linear amplification and switching amplification operations on incoming signals are provided. The amplifying device includes a first amplifying unit for amplifying an input signal and outputting a first output signal, the input switch unit connected in parallel with the first amplifying unit for performing a switching operation by an input signal and outputting a switch output signal, and a second amplifying unit for amplifying a first output signal or a switch output signal and outputting a second output signal, and the first amplifying unit or the input switch unit operates based on the type of the input signal.

Amplification device and processes capable of miniaturization in a device for performing linear amplification and switching amplification operations on incoming signals are provided. The amplifying device includes a first amplifying unit for amplifying an input signal and outputting a first output signal, the input switch unit connected in parallel with the first amplifying unit for performing a switching operation by an input signal and outputting a switch output signal, and a second amplifying unit for amplifying a first output signal or a switch output signal and outputting a second output signal, and the first amplifying unit or the input switch unit operates based on the type of the input signal.

A digital power amplifier comprising at least two individually activatable amplifiers connected to an output network comprising a first hybrid coupler. An output of a first amplifier is connected to a first input of the first hybrid coupler and an output of a second amplifier is connected to a second input of the first hybrid coupler such that activating an amplifier of the at least two amplifiers causes the amplifier to load modulate another activated amplifier of at least two amplifiers.

Described examples provide for digital communication circuits and systems that implement digital pre-distortion (DPD). In an example, a system includes a DPD circuit configured to compensate an input signal for distortions resulting from an amplifier. The DPD circuit includes an infinite impulse response (IIR) filter configured to implement a transfer function. The IIR filter includes a selection circuit configured to selectively output a selected parameter. The transfer function is based on the selected parameter.

Example embodiments relate to RF amplifier packages. One example RF amplifier package includes an input terminal, an output terminal, a substrate, a first DC blocking capacitor having a first terminal and a grounded second terminal, and a second conductor die mounted on the substrate. The semiconductor die includes a semiconductor substrate, an RE power field-effect transistor (FET) integrated on the semiconductor substrate, a gate bondbar, a first drain bondbar, a second drain bondbar, and a plurality of first bondwires connecting the second drain bondbar to the first terminal of the first DC blocking capacitor. The RF power FET includes a plurality of gate fingers that are electrically connected to the gate bondbar and that each extend from the gate bondbar towards the first drain bondbar and underneath the second drain bondbar, a first set of drain fingers, and a second set of drain fingers.

Example embodiments relate to RF amplifier packages. One example RF amplifier package includes an input terminal, an output terminal, a substrate, a first DC blocking capacitor having a first terminal and a grounded second terminal, and a second conductor die mounted on the substrate. The semiconductor die includes a semiconductor substrate, an RE power field-effect transistor (FET) integrated on the semiconductor substrate, a gate bondbar, a first drain bondbar, a second drain bondbar, and a plurality of first bondwires connecting the second drain bondbar to the first terminal of the first DC blocking capacitor. The RF power FET includes a plurality of gate fingers that are electrically connected to the gate bondbar and that each extend from the gate bondbar towards the first drain bondbar and underneath the second drain bondbar, a first set of drain fingers, and a second set of drain fingers.

According to various embodiments of the present disclosure, an electronic device may comprise: a transceiver; a power amplifier connected to the transceiver; a power source modulator configured to supply power to the power amplifier; at least one antenna connected to the power amplifier; and at least one processor operably connected to the transceiver, the power amplifier; and the power source modulator. The at least one processor may confirm whether the state of an uplink signal transmitted through the at least one antenna is a first state, and may control the power source modulator to add a first offset value to a voltage value of power supplied to the power amplifier from the power source modulator, based on the state of a downlink signal received to the transceiver being the first state.

Desired characteristics can be achieved. A radio-frequency circuit includes an inductor and a switch. The inductor has a first end and a second end. The switch has a first input-output terminal, a second input-output terminal, a first switching terminal coupled to the first end of the inductor, and a second switching terminal coupled to the second end of the inductor. The switch can switch between a first state and a second state. In the first state, the first input-output terminal is coupled to the first switching terminal, and the second input-output terminal is coupled to the second switching terminal. In the second state, the first input-output terminal is coupled to the second switching terminal, and the second input-output terminal is coupled to the first switching terminal.

A system includes a first differential amplifier and a first transformer with a primary coil coupled to an output of the first differential amplifier and with a secondary coil coupled to a load. The system also includes a second differential amplifier and a second transformer with a primary coil coupled to an output of the second differential amplifier and with a secondary coil coupled in series with the secondary coil of the first transformer. The system also includes a tuning network coupled to a center tap node between the secondary coil of the first transformer and the secondary coil of the second transformer.

An envelope tracking integrated circuit having a tracker circuitry configured to generate a modulated supply voltage for a radio frequency power amplifier in response to an envelope of a radio frequency signal to be amplified by the radio frequency power amplifier is disclosed. Also included is a charge pump system configured to generate a tracker supply voltage for the tracker circuitry. Further included is an analog multiplexer configured to receive the tracker supply voltage and a battery source voltage and output a selected one of the tracker supply voltage and the battery source voltage in response to a voltage select signal. A digital processor further included in the envelope tracking integrated circuit is configured to control portions of the tracker circuitry and be powered by the selected one of the tracker supply voltage and the battery source voltage during transmission gaps when the radio frequency signal is not transmitted.