H03F3/195

AMPLIFIER WITH STACKED TRANSCONDUCTING CELLS IN CURRENT MODE COMBINING
20220166386 · 2022-05-26 ·

An amplifier with stacked transconducting cells in “current mode combining” is disclosed herein. In one or more embodiments, a method for operation of a high-voltage signal amplifier comprises inputting, into each transconducting cell of a plurality of transconducting cells, a direct current (DC) supply current (Idc), an alternating current (AC) radio frequency (RF) input current (I.sub.RF_IN), and an RF input signal (RF.sub.IN). The method further comprises outputting, by each of the transconducting cells of the plurality of transconducting cells, the DC supply current (Idc) and an AC RF output current (I.sub.RF_OUT). In one or more embodiments, the transconducting cells are connected together in cascode for the DC supply current, and are connected together in cascade for the AC RF input and output currents.

AMPLIFIER WITH STACKED TRANSCONDUCTING CELLS IN CURRENT MODE COMBINING
20220166386 · 2022-05-26 ·

An amplifier with stacked transconducting cells in “current mode combining” is disclosed herein. In one or more embodiments, a method for operation of a high-voltage signal amplifier comprises inputting, into each transconducting cell of a plurality of transconducting cells, a direct current (DC) supply current (Idc), an alternating current (AC) radio frequency (RF) input current (I.sub.RF_IN), and an RF input signal (RF.sub.IN). The method further comprises outputting, by each of the transconducting cells of the plurality of transconducting cells, the DC supply current (Idc) and an AC RF output current (I.sub.RF_OUT). In one or more embodiments, the transconducting cells are connected together in cascode for the DC supply current, and are connected together in cascade for the AC RF input and output currents.

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
20220166407 · 2022-05-26 ·

When a radio-frequency module is viewed in plan in a thickness direction of a mounting substrate, an electronic component overlaps an IC component. The electronic component includes four or more filters, each of which includes an input terminal and an output terminal. The IC component includes a first switch connected to the input terminals of at least four of the four or more filters and a second switch connected to the output terminals of the at least four filters. The input terminals of the at least four filters are in a first region including a center of the electronic component when viewed in plan in the thickness direction of the mounting substrate. The output terminals of the at least four filters are in a second region between the first region and a perimeter of the electronic component when viewed in plan in the thickness direction of the mounting substrate.

RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE
20220166407 · 2022-05-26 ·

When a radio-frequency module is viewed in plan in a thickness direction of a mounting substrate, an electronic component overlaps an IC component. The electronic component includes four or more filters, each of which includes an input terminal and an output terminal. The IC component includes a first switch connected to the input terminals of at least four of the four or more filters and a second switch connected to the output terminals of the at least four filters. The input terminals of the at least four filters are in a first region including a center of the electronic component when viewed in plan in the thickness direction of the mounting substrate. The output terminals of the at least four filters are in a second region between the first region and a perimeter of the electronic component when viewed in plan in the thickness direction of the mounting substrate.

AUTOMATIC GAIN CONTROL SYSTEM, CONTROL METHOD, POWER DETECTOR AND RADIO FREQUENCY RECEIVER
20230276380 · 2023-08-31 ·

An automatic gain control system and a control method, a power detector and a radio frequency receiver are provided, wherein the power detector includes: a detection circuit, having a first and second input terminals connected to respective first and second differential output terminals of the trans-impedance amplifier, and configured to sample a peak of a differential output signal of the trans-impedance amplifier along with a clock cycle and provide a differential detection signal at a first output node; a filter circuit converts energy of the differential detection signal obtained at the first output node into an output voltage, so that the power detector may be used to detect an output power of the trans-impedance amplifier and adjust, by a control logic unit, a gain or an output power of a low noise amplifier connected to a radio frequency signal.

Packaged electronic devices with top terminations

An embodiment of an electronic device includes a circuit component (e.g., a transistor or other component) coupled to the top surface of a substrate. Encapsulation is formed over the substrate and the component. An opening in the encapsulation extends from the encapsulation top surface to a conductive feature on the top surface of the component. A conductive termination structure within the encapsulation opening extends from the conductive feature to the encapsulation top surface. The device also may include a second circuit physically coupled to the encapsulation top surface and electrically coupled to the component through the conductive termination structure. In an alternate embodiment, the conductive termination structure may be located in a trench in the encapsulation that extends between two circuits that are embedded within the encapsulation, where the conductive termination structure is configured to reduce electromagnetic coupling between the two circuits during device operation.

Tri-phasing modulation for efficient and wideband radio transmitter

According to an aspect, there is provided a method for power-amplification of a transmission signal, comprising: obtaining the transmission signal with phase and amplitude modulation; generating a power-amplified polar signal for approximating a power-amplified transmission signal by power-amplifying a first constant-envelope signal with one of two or more first amplification factors based on the transmission signal; generating an outphasing pair of a first power-amplified outphasing signal and a second power-amplified outphasing signal based on the transmission signal; and combining the power-amplified polar signal, the first power-amplified outphasing signal and the second power-amplified outphasing signal to provide the power-amplified transmission signal.

Tri-phasing modulation for efficient and wideband radio transmitter

According to an aspect, there is provided a method for power-amplification of a transmission signal, comprising: obtaining the transmission signal with phase and amplitude modulation; generating a power-amplified polar signal for approximating a power-amplified transmission signal by power-amplifying a first constant-envelope signal with one of two or more first amplification factors based on the transmission signal; generating an outphasing pair of a first power-amplified outphasing signal and a second power-amplified outphasing signal based on the transmission signal; and combining the power-amplified polar signal, the first power-amplified outphasing signal and the second power-amplified outphasing signal to provide the power-amplified transmission signal.

Band pass filter
11342898 · 2022-05-24 · ·

Aspects of this disclosure relate to a band pass filter that includes LC resonant circuits coupled to each other by a capacitor. A bridge capacitor can be in parallel with series capacitors, in which the series capacitors include the capacitor coupled between the LC resonant circuits. The bridge capacitor can create a transmission zero at a frequency below the passband of the band pass filter. The LC resonant circuits can each include a surface mount capacitor and a conductive trace of the substrate, and an integrated passive device die can include the capacitor. Band pass filters disclosed herein can be relatively compact, provide relatively good out-of-band rejection, and relatively low loss.

Band pass filter
11342898 · 2022-05-24 · ·

Aspects of this disclosure relate to a band pass filter that includes LC resonant circuits coupled to each other by a capacitor. A bridge capacitor can be in parallel with series capacitors, in which the series capacitors include the capacitor coupled between the LC resonant circuits. The bridge capacitor can create a transmission zero at a frequency below the passband of the band pass filter. The LC resonant circuits can each include a surface mount capacitor and a conductive trace of the substrate, and an integrated passive device die can include the capacitor. Band pass filters disclosed herein can be relatively compact, provide relatively good out-of-band rejection, and relatively low loss.