H03F3/195

Radio frequency transistor amplifiers having leadframes with integrated shunt inductors and/or direct current voltage source inputs

A packaged radio frequency transistor amplifier includes a package housing, an RF transistor amplifier die that is mounted within the package housing, a first capacitor die that is mounted within the package housing, an input leadframe that extends through the package housing to electrically connect to a gate terminal of the RF transistor amplifier die, and an output leadframe that extends through the package housing to electrically connect to a drain terminal of the RF transistor amplifier die. The output leadframe includes an output pad region, an output lead that extends outside of the package housing, and a first arm that extends from one of the output pad region and the output lead to be adjacent the first capacitor die.

Radio frequency transistor amplifiers having leadframes with integrated shunt inductors and/or direct current voltage source inputs

A packaged radio frequency transistor amplifier includes a package housing, an RF transistor amplifier die that is mounted within the package housing, a first capacitor die that is mounted within the package housing, an input leadframe that extends through the package housing to electrically connect to a gate terminal of the RF transistor amplifier die, and an output leadframe that extends through the package housing to electrically connect to a drain terminal of the RF transistor amplifier die. The output leadframe includes an output pad region, an output lead that extends outside of the package housing, and a first arm that extends from one of the output pad region and the output lead to be adjacent the first capacitor die.

Envelope tracking power amplifier apparatus
11588449 · 2023-02-21 · ·

An envelope tracking (ET) power amplifier apparatus is provided. The ET power amplifier apparatus includes an amplifier circuit configured to amplify a radio frequency (RF) signal based on an ET voltage and a tracker circuit configured to generate the ET voltage based on an ET target voltage. The ET power amplifier apparatus also includes a control circuit. The control circuit is configured to dynamically determine a voltage standing wave ratio (VSWR) change at a voltage output relative to a nominal VSWR and cause an adjustment to the ET voltage. By dynamically determining the VSWR change and adjusting the ET voltage in response to the VSWR change, the amplifier circuit can operate under a required EVM threshold across all phase angles of the RF signal.

Envelope tracking power amplifier apparatus
11588449 · 2023-02-21 · ·

An envelope tracking (ET) power amplifier apparatus is provided. The ET power amplifier apparatus includes an amplifier circuit configured to amplify a radio frequency (RF) signal based on an ET voltage and a tracker circuit configured to generate the ET voltage based on an ET target voltage. The ET power amplifier apparatus also includes a control circuit. The control circuit is configured to dynamically determine a voltage standing wave ratio (VSWR) change at a voltage output relative to a nominal VSWR and cause an adjustment to the ET voltage. By dynamically determining the VSWR change and adjusting the ET voltage in response to the VSWR change, the amplifier circuit can operate under a required EVM threshold across all phase angles of the RF signal.

Radio frequency front-end
11588507 · 2023-02-21 · ·

A radio frequency front-end is disclosed having a first power amplifier (PA) having a first PA input and a first PA output, a second PA having a second PA input and a second PA output, and a low-noise amplifier (LNA) having an LNA output connected to a receive output terminal and an LNA input. An input 90° hybrid coupler has a first port input connected to a transmit terminal, a second port input connected to a fixed voltage node through an isolation impedance, a third port output connected to the first amplifier input and a fourth port output connected to the second amplifier input. An output 90° hybrid coupler has a first port output connected to a common terminal, a second port output connected to the LNA input, a third port input connected to the second PA output, and a fourth port input connected to the first PA output.

Digital predistortion of signals

Systems, circuitries, and methods for predistorting a digital signal in a transmit chain based on a predistortion function are provided. A method includes shifting a center frequency of an input signal by an offset to generate an adapted signal; predistorting the adapted signal based on a predistortion function to generate a predistorted adapted signal; reverting the shifting of the center frequency of the predistorted adapted signal by the offset to generate a predistorted signal; and causing transmission of the predistorted signal by a transmit chain.

Power amplifier module

A power amplifier module includes a substrate including, in an upper surface of the substrate, an active region and an element isolation region. The power amplifier module further includes a collector layer, a base layer, and an emitter layer that are stacked on the active region; an interlayer insulating film that covers the collector layer, the base layer, and the emitter layer; a pad that is thermally coupled to the element isolation region; and an emitter bump that is disposed on the interlayer insulating film, electrically connected to the emitter layer through a via hole provided in the interlayer insulating film, and electrically connected to the pad. In plan view, the emitter bump partially overlaps an emitter region which is a region of the emitter layer and through which an emitter current flows.

Power amplifier module

A power amplifier module includes a substrate including, in an upper surface of the substrate, an active region and an element isolation region. The power amplifier module further includes a collector layer, a base layer, and an emitter layer that are stacked on the active region; an interlayer insulating film that covers the collector layer, the base layer, and the emitter layer; a pad that is thermally coupled to the element isolation region; and an emitter bump that is disposed on the interlayer insulating film, electrically connected to the emitter layer through a via hole provided in the interlayer insulating film, and electrically connected to the pad. In plan view, the emitter bump partially overlaps an emitter region which is a region of the emitter layer and through which an emitter current flows.

Logarithmic amplifier circuit

A logarithmic amplifier circuit includes an adaptive gain amplifier circuit and a transistor. The adaptive gain amplifier circuit includes a gain stage and a diode. The gain stage includes an input terminal, and an output terminal. The diode includes a cathode terminal coupled to the output terminal, and an anode terminal coupled to a common terminal. The transistor includes a first terminal coupled to the input terminal, a second terminal coupled to the common terminal, and a third terminal coupled to the output terminal.

Substrate comprising capacitor configured for power amplifier output match

A device that includes a substrate and a power amplifier coupled to the substrate. The substrate includes at least one dielectric layer, a plurality of interconnects, and a capacitor configured to operate as an output match element, where the capacitor is defined by a plurality of capacitor interconnects. The power amplifier is coupled to the capacitor. The capacitor is configured to operate as an output match element for the power amplifier. The substrate includes an inductor coupled to the capacitor, where the inductor is defined by at least one inductor interconnect. The capacitor and the inductor are configured to operate as a resonant trap or an output match element.