Patent classifications
H03F3/195
DOHERTY AMPLIFIER CIRCUITS
A Doherty amplifier circuit comprising: a splitter having: a splitter-input-terminal for receiving an input signal; a main-splitter-output-terminal; and a peaking-splitter-output-terminal; a main-power-amplifier having a main-power-input-terminal and a main-power-output-terminal, wherein; the main-power-input-terminal is connected to the main-splitter-output-terminal; and the main-power-output-terminal is configured to provide a main-power-amplifier-output-signal; a peaking-power-amplifier having a peaking-power-input-terminal and a peaking-power-output-terminal, wherein: the peaking-power-input-terminal is connected to the peaking-splitter-output-terminal; and the peaking-power-output-terminal is configured to provide a peaking-power-amplifier-output-signal. The splitter, the main-power-amplifier and the peaking-power-amplifier are provided by means of an integrated circuit.
FLIP CHIP CIRCUIT
A flip chip circuit comprising: a semiconductor substrate; a power amplifier provided on the semiconductor substrate; and a metal pad configured to receive an electrically conductive bump for connecting the flip chip to external circuitry. At least a portion of the power amplifier is positioned directly between the metal pad and the semiconductor substrate.
FLIP CHIP CIRCUIT
A flip chip circuit comprising: a semiconductor substrate; a power amplifier provided on the semiconductor substrate; and a metal pad configured to receive an electrically conductive bump for connecting the flip chip to external circuitry. At least a portion of the power amplifier is positioned directly between the metal pad and the semiconductor substrate.
BIASED TRANSISTOR MODULE
A biased-transistor-module comprising: a module-input-terminal; a module-output-terminal; a reference-terminal; a module-supply-terminal configured to receive a supply voltage; a module-reference-voltage-terminal configured to receive a module reference voltage; a main-transistor having a main-control-terminal, a main-first-conduction-channel-terminal and a main-second-conduction-channel-terminal, wherein the main-first-conduction-channel-terminal is connected to the module-output-terminal, and the main-second-conduction-channel-terminal is connected to the reference-terminal, and the main-control-terminal is connected to an input-signal-node, wherein the input-signal-node is connected to the module-input-terminal; and a bias-circuit. The bias-circuit comprises: a first-bias-transistor; a first-bias-resistor; a second-bias-transistor; and a second-bias-resistor.
SEMICONDUCTOR DEVICE
A semiconductor device is provided with one or more gate fingers (20) that are provided in an active region on a semiconductor substrate (1), and a source finger (30) and a drain finger (40) that are provided in the active region and arranged alternately to allow each gate finger to be sandwiched between the source and drain fingers. The semiconductor device includes terminal circuit (60) that has inductive impedance at the frequency of a signal input to an input terminal of the one or more gate fingers, and is directly or indirectly connected to the one or more gate fingers at an area being spaced away from a connecting position of the input terminal (21a) of the one or more gate fingers (20).
DIGITAL TIME CONVERTER SYSTEMS AND METHODS
A digital to time converter (DTC). The DTC includes a lookup table, a divider, a thermometric array and a switched capacitor array. The lookup table is configured to generate one or more corrections based on thermometric bits of an input signal. The divider is configured to generate a plurality of divider signals from an oscillator signal based on the one or more corrections. The thermometric array is configured to generate a medium approximation signal from the plurality of divider signals based on the one or more corrections. The switched capacitor array is configured to generate a digital delay signal from the medium approximation signal based on the one or more corrections and switched capacitor bits of the input signal.
Differential Directional Coupler, Signal Conversion System and Method for Converting a Differential Input Signal
In accordance with an embodiment, a differential directional coupler includes a first coupler having a first transformer comprising a first input coil and a first output coil, and a second coupler having a second transformer comprising a second input coil and a second output coil. The first input coil and the second input coil each include an input port, the first transformer at least partially covers the second transformer in a top view from a vertical direction onto the differential directional coupler, and the first input coil and the second input coil are configured to be mirror symmetric with respect to one another in the top view with respect to their input ports.
Differential Directional Coupler, Signal Conversion System and Method for Converting a Differential Input Signal
In accordance with an embodiment, a differential directional coupler includes a first coupler having a first transformer comprising a first input coil and a first output coil, and a second coupler having a second transformer comprising a second input coil and a second output coil. The first input coil and the second input coil each include an input port, the first transformer at least partially covers the second transformer in a top view from a vertical direction onto the differential directional coupler, and the first input coil and the second input coil are configured to be mirror symmetric with respect to one another in the top view with respect to their input ports.
Apparatuses And Methods For Signal Coupling
Coupling apparatuses, circuits having such coupling apparatuses and corresponding methods are provided that involve a first and a second signal being coupled out from an out-coupling circuit part and being separately coupled into first and second circuit pmts. The use of different coupling mechanisms effects signal separation in this case. In particular, one of the signals can be coupled as a differential signal and the other as a common mode signal.
Apparatuses And Methods For Signal Coupling
Coupling apparatuses, circuits having such coupling apparatuses and corresponding methods are provided that involve a first and a second signal being coupled out from an out-coupling circuit part and being separately coupled into first and second circuit pmts. The use of different coupling mechanisms effects signal separation in this case. In particular, one of the signals can be coupled as a differential signal and the other as a common mode signal.