A device and method for amplifying signals is provided. The device can have an input to receive an input signal having a first desired signal on a first carrier, a second desired signal on a second carrier, and one or more interfering signals. The device can have a first carrier aggregation (CA) chain for use with the first desired signal and a second CA chain for use with the second desired signal. The first and second CA chains can be coupled to the input. The first and second CA chains can have a plurality of transconductance stages. Each of the transconductance stages can be configured as a high impedance stage or a low impedance stage. The transconductance stages can be selectively activated to incrementally adjust the transconductance, and therefore the input impedance, of each of the CA chains.

A device and method for amplifying signals is provided. The device can have an input to receive an input signal having a first desired signal on a first carrier, a second desired signal on a second carrier, and one or more interfering signals. The device can have a first carrier aggregation (CA) chain for use with the first desired signal and a second CA chain for use with the second desired signal. The first and second CA chains can be coupled to the input. The first and second CA chains can have a plurality of transconductance stages. Each of the transconductance stages can be configured as a high impedance stage or a low impedance stage. The transconductance stages can be selectively activated to incrementally adjust the transconductance, and therefore the input impedance, of each of the CA chains.

A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The first die is disposed between the crystal and the substrate. An overmold encloses the first die and the crystal. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal, where the second die is disposed on an opposite side of the substrate from the first die and the crystal.

A packaged module for use in a wireless communication device has a substrate supporting a first integrated circuit die that implements at least a portion of a radio frequency baseband subsystem and a second integrated circuit die that implements at least a portion of a radio frequency front end including a radio frequency power amplifier. The substrate is disposed between the first integrated circuit die and the second integrated circuit die. An overmold encloses one of the first integrated circuit die and the second integrated circuit die.

An amplification circuit includes a first switching circuit that includes input terminals and first and second output terminals and that puts the second output terminal into an open state with respect to the input terminals while selectively putting the first output terminal into a state of being connected to any of the input terminals or selectively puts the second output terminal into a state of being connected to any of input terminals while putting the first output terminal into a state of being open with respect to the input terminals; a matching network that is connected to the first output terminal; an amplifier that is connected to an output side of the matching network; a second switching circuit that is connected to an output side of the amplifier; and a bypass path that electrically connects the second output terminal and an output terminal of the second switching circuit. The amplifier is a variable-gain amplifier.

A high frequency amplifier circuit includes a transistor including a drain, a gate, and a source, an inductance-capacitor (LC) tank connected to the drain, and a transformer connected to the gate and the source.

A high frequency amplifier circuit includes a transistor including a drain, a gate, and a source, an inductance-capacitor (LC) tank connected to the drain, and a transformer connected to the gate and the source.

A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.

A packaged module for use in a wireless communication device has a substrate supporting an integrated circuit die that includes at least a microprocessor and radio frequency receiver circuitry and a stacked filter assembly configured as a filter circuit that is in communication with the radio frequency receiver circuitry. The stacked filter assembly includes a plurality of passive components, where each passive component is packaged as a surface mount device. At least one passive component is in direct communication with the substrate and at least another passive component is supported above the substrate by the at least one passive component that is in the direct communication with the substrate.

A packaged module for a radio frequency wireless device has a substrate supporting a first wireless device component and a second wireless device component where the first wireless device component is between the second wireless device component and a first surface of the substrate. At least a first overhanging portion of the second wireless device component extends beyond at least a portion of the periphery of the first wireless device component.