A radio frequency (RF) summer circuit having a characteristic impedance Z.sub.0 comprises first and second ports coupled by first and second resistances, respectively, to a junction. The circuit further comprises a series combination of a third resistance and a switch movable between open and closed positions and an amplifier having input and output terminals and operable in an off state and an on state wherein the series combination is coupled across the input and output terminals of the amplifier between the junction and a third port. The first resistance, second resistance, and the third resistance are all substantially equal to Z.sub.0/3. Further, when the switch is moved to the closed position and the amplifier is switched to the off state a passive mode of operation is implemented and when the switch is moved to the open position and the amplifier is switched to the on state an active mode of operation is implemented. The RF summer circuit develops a summed signal at the third port equal to a sum of signals at the first and second ports modified by one of first and second gain values.

A power amplifier circuit includes a power splitter, a first amplifier, a second amplifier, a third amplifier, a fourth amplifier, a first bias circuit, a first line connecting the first bias circuit and the first amplifier, and a second line connecting the first bias circuit and the third amplifier on the same semiconductor substrate, in which the first line and the second line are formed such that a voltage drop amount of the first bias voltage between the first bias circuit and the first amplifier is substantially equal to a voltage drop amount of the first bias voltage between the first bias circuit and the third amplifier.

A power amplification circuit including: a power splitter which splits an input signal into a first signal and a second signal; a first carrier amplifier which amplifies the first signal to output a first amplified signal; a first peak amplifier which amplifies the second signal when a power level of the second signal is larger than or equal to a predetermined power level to output a second amplified signal; and a combiner which combines the first amplified signal and the second amplified signal, in which the first carrier amplifier and the first peak amplifier are provided to a same semiconductor substrate.

A current control circuit controls a bias current that is supplied to an amplifier transistor that amplifies a radio-frequency signal and includes a node, a constant current source circuit that supplies a first current to the node, and a variable current source circuit that supplies a second current to the node, based on a result of comparison between a potential of the node and a reference potential. The node outputs a control current including the first current and the second current for controlling the bias current.

An RF amplifier includes an amplifier input, a transistor die with a transistor and a transistor input terminal, a fundamental frequency impedance matching circuit coupled between the amplifier input and the transistor input terminal, and a harmonic frequency termination circuit coupled between the transistor input terminal and a ground reference node. The harmonic frequency termination circuit includes a first inductance coupled between the transistor input terminal and a first node, and a tank circuit coupled between the first node and the ground reference node. The tank circuit includes a first capacitance coupled between the first node and the ground reference node, and a second inductance coupled between the first node and the ground reference node. The tank circuit is configured to shunt signal energy at or near a second harmonic frequency, while appearing as an open circuit to signal energy at a fundamental frequency of operation of the RF amplifier.

According to at least one example of the disclosure, a power amplifier system is provided comprising an amplifying transistor configured to amplify a radio frequency signal, a bias circuit configured to provide a bias voltage to the amplifying transistor, and a clamp circuit for protecting the power amplifier system by absorbing a current flowing through the amplifying transistor when the clamp circuit is switched on. The clamp circuit is connected at a bias node between the bias circuit and the amplifying transistor and includes a clamp transistor and a clamp diode, the clamp diode having one end connected to a collector of the clamp transistor at the bias node and another end connected to a base of the clamp transistor.

An amplifier includes an input matching network; at least one transistor; an input lead coupled to the at least one transistor; a ground terminal coupled to the transistor; an output lead coupled to the at least one transistor; an output matching circuit coupled to the output lead and to the at least one transistor; and a baseband impedance enhancement circuit having at least one reactive element coupled to the input matching network. The baseband impedance enhancement circuit is configured to reduce resonances of a baseband termination.

An amplifier includes a semiconductor die and a substrate that is distinct from the semiconductor die. The semiconductor die includes a III-V semiconductor substrate, a first RF signal input terminal, a first RF signal output terminal, and a transistor (e.g., a GaN FET). The transistor has a control terminal electrically coupled to the first RF signal input terminal, and a current-carrying terminal electrically coupled to the first RF signal output terminal. The substrate includes a second RF signal input terminal, a second RF signal output terminal, circuitry coupled between the second RF signal input terminal and the second RF signal output terminal, and an electrostatic discharge (ESD) protection circuit. The amplifier also includes a connection electrically coupled between the ESD protection circuit and the control terminal of the transistor. The substrate may be another semiconductor die (e.g., with a driver transistor and/or impedance matching circuitry) or an integrated passive device.

An amplifier includes a semiconductor die and a substrate that is distinct from the semiconductor die. The semiconductor die includes a III-V semiconductor substrate, a first RF signal input terminal, a first RF signal output terminal, and a transistor (e.g., a GaN FET). The transistor has a control terminal electrically coupled to the first RF signal input terminal, and a current-carrying terminal electrically coupled to the first RF signal output terminal. The substrate includes a second RF signal input terminal, a second RF signal output terminal, circuitry coupled between the second RF signal input terminal and the second RF signal output terminal, and an electrostatic discharge (ESD) protection circuit. The amplifier also includes a connection electrically coupled between the ESD protection circuit and the control terminal of the transistor. The substrate may be another semiconductor die (e.g., with a driver transistor and/or impedance matching circuitry) or an integrated passive device.

A semiconductor device includes: a conductive base substrate; a semiconductor chip mounted on the base substrate and having a signal pad; a frame configured to surround the semiconductor chip, to be mounted on the base substrate, and to include a step having an inner first upper surface and an outer second upper surface higher than the first upper surface in a plan view, wherein a first conductor pattern provided on the first upper surface is electrically connected to the base substrate; a capacitive component mounted on the first conductor pattern; a signal terminal mounted on the second upper surface of the frame; a first bonding wire configured to electrically connect the signal pad and an upper surface of the capacitive component; and a second bonding wire configured to electrically connect the upper surface of the capacitive component and the signal terminal.