An average power tracking (APT) power management circuit is provided. The APT power management circuit is configured to generate a first APT voltage(s) for a first power amplifier(s) and a second APT voltage(s) for a second power amplifier(s). The APT power management circuit further includes a pair of switcher circuits that can generate a pair of reference voltages. Depending on various operating scenarios of the APT power management circuit, it is possible to selectively output any of the reference voltages as any one or more of the first APT voltage(s) and the second APT voltage(s). As such, it is possible to flexibly configure the APT power management circuit to support the various operating scenarios based on a minimum possible number of the switcher circuits, thus helping to reduce footprint and cost of the APT power management circuit.

A power amplifier module includes a first power amplifier that amplifies an input signal and outputs a first transmission signal; a first switch circuit that receives input of the first transmission signal and performs switching to, of a plurality of signal paths, a signal path through which the first transmission signal passes; and a second switch circuit that receives input of the first transmission signal output from the first switch circuit through the signal path to which the first switch circuit has performed switching and switches between signal paths to an antenna terminal. The second switch circuit includes a power supply circuit that supplies a reference voltage to the first switch circuit and the second switch circuit.

A power amplifier module includes a first power amplifier that amplifies an input signal and outputs a first transmission signal; a first switch circuit that receives input of the first transmission signal and performs switching to, of a plurality of signal paths, a signal path through which the first transmission signal passes; and a second switch circuit that receives input of the first transmission signal output from the first switch circuit through the signal path to which the first switch circuit has performed switching and switches between signal paths to an antenna terminal. The second switch circuit includes a power supply circuit that supplies a reference voltage to the first switch circuit and the second switch circuit.

A power amplifier circuit includes a first amplifier; a first transformer including a first primary coil connected to an output of the first amplifier and a first secondary coil electromagnetically coupled to the first primary coil; a second amplifier connected to one end of the first secondary coil; a third amplifier connected to another end of the first secondary coil; a second transformer including a second primary coil having one end connected to an output of the second amplifier and another end connected to an output of the third amplifier, and a second secondary coil electromagnetically coupled to the second primary coil; a first capacitance element provided between the second secondary coil and a ground; and a second capacitance element having one end connected to one end of the second secondary coil and another end connected to another end of the second secondary coil.

A power amplifier circuit includes a first amplifier; a first transformer including a first primary coil connected to an output of the first amplifier and a first secondary coil electromagnetically coupled to the first primary coil; a second amplifier connected to one end of the first secondary coil; a third amplifier connected to another end of the first secondary coil; a second transformer including a second primary coil having one end connected to an output of the second amplifier and another end connected to an output of the third amplifier, and a second secondary coil electromagnetically coupled to the second primary coil; a first capacitance element provided between the second secondary coil and a ground; and a second capacitance element having one end connected to one end of the second secondary coil and another end connected to another end of the second secondary coil.

An RF power amplifier includes an amplifier device and a shunt-inductance circuit. The amplifier device includes a substrate, a combining node lead, first and second amplifier dies coupled to the substrate, and first and second output circuits. The first and second amplifier dies are configured to amplify first and second input RF signals, respectively, to produce first and second output RF signals at first and second output terminals, respectively. The first output circuit includes a first inductive path connecting the first output terminal to the lead. The second output circuit includes a second inductive path connecting the second output terminal to the lead. The lead is configured to combine the first and second output RF signals to produce a third output RF signal. The shunt-inductance circuit is coupled between the first output terminal and a ground reference.

An RF power amplifier includes an amplifier device and a shunt-inductance circuit. The amplifier device includes a substrate, a combining node lead, first and second amplifier dies coupled to the substrate, and first and second output circuits. The first and second amplifier dies are configured to amplify first and second input RF signals, respectively, to produce first and second output RF signals at first and second output terminals, respectively. The first output circuit includes a first inductive path connecting the first output terminal to the lead. The second output circuit includes a second inductive path connecting the second output terminal to the lead. The lead is configured to combine the first and second output RF signals to produce a third output RF signal. The shunt-inductance circuit is coupled between the first output terminal and a ground reference.

A module substrate has first and second main surfaces that on opposite sides of the module substrate, a resin member that covers the second main surface, and a plurality of post electrodes that are spaced apart from each other on the second main surface and penetrate through the resin member from the second main surface. The plurality of post electrodes includes a first post electrode and a first recess recessed toward the second main surface and formed in at least part of a region of the surface of the resin member that surrounds a leading end part of the first post electrode.

A radio-frequency module includes a mount board, an antenna terminal and a ground terminal, a low-noise amplifier, a first inductor, and a second inductor. The mount board has a first principal surface and a second principal surface on opposite sides of the mount board from one another. The low-noise amplifier includes a transistor configured to amplify a signal. The first inductor is disposed on one of the first principal surface and the second principal surface of the mount board. The first inductor is connected to the antenna terminal. The second inductor is disposed on the other of the first principal surface and the second principal surface of the mount board. The second inductor is connected between the transistor and the ground terminal.

A radio frequency module has a substrate, a first chip inductor, an integrated circuit, and a first amplifier connected to the first chip inductor. The first chip inductor is on a first main surface of the substrate and the integrated circuit is on a second main surface of the substrate, the second main surface being opposite the first main surface. The integrated circuit includes the first amplifier. When the substrate is viewed from a direction perpendicular to the first main surface of the substrate, the first chip inductor at least partially overlaps the integrated circuit.