A portable communication device including a processor positioned in a first PCB, a communication circuit; and an antenna module. The antenna module includes a second PCB, an antenna array positioned in the second PCB, wherein the antenna array includes a plurality of antennas, a plurality of PAs, a plurality of LNAs, wherein the plurality of LNAs is greater than the plurality of PAs, a first transmission-reception circuit positioned in the second PCB, and a first reception circuit positioned in the second PCB.

A communication device includes a power amplifier that generates power signals according to one or more operating bands of communication data, with the amplitude being driven and generated in output stages of the power amplifier. The final stage can include an output passive network that suppresses suppress an amplitude modulation-to-phase modulation (AM-PM) distortion. During a back-off power mode a bias of a capacitive unit of the output power network component can be adjusted to minimize an overall capacitance variation. An output passive network can further generate a flat-phase response between dual resonances of operation.

There is provided a linearized multiplier configured to produce an output current representing a product of a first input voltage and a second input voltage, comprising: a first transconductance stage which is configured to input the first input voltage and to output a first pair of differential currents, wherein the first transconductance stage comprises a negative feedback network, at least one second transconductance stage which is configured to input the second input voltage and to output a pre-distorted voltage of the second input voltage, wherein each second transconductance stage comprises a negative feedback network, a pair of third transconductance stages, each of which is configured to input a voltage corresponding to the pre-distorted voltage of the second input voltage and to output a second pair of differential currents, when being supplied with a bias current corresponding to a respective current of the first pair of differential currents.

A power amplifier device includes a substrate, a power transistor die, and one or more surface mount components. The substrate has substrate die contacts exposed at a first substrate surface, and additional substrate contacts exposed at a second substrate surface. The power transistor die includes an integrated transistor. The transistor includes a control terminal and a first current conducting terminal coupled, respectively, to first and second die contacts at the first die surface, and a second current conducting terminal coupled to a third die contact at a second die surface. The surface-mount components are connected to the additional substrate components, and the surface-mount components are electrically coupled through the substrate to the first and second die contacts. The power amplifier device also includes an encapsulation material layer covering the surface-mount components and the second substrate surface.

A high frequency amplifier includes an asymmetrical Doherty amplifier having a carrier amplifier, a peak amplifier, a branch circuit, and a phase adjusting circuit, a driver amplifier, and a base member mounting a first circuit board mounting the driver amplifier, the carrier amplifier, and the peak amplifier and a second circuit board mounting the circuits. The branch circuit divides a path of a RF signal into input paths of the peak and carrier amplifiers. The driver amplifier, the carrier amplifier, and the peak amplifier have rear surfaces in contact with the base member. The electrical length from the output terminal of the driver amplifier to the input terminal of the peak amplifier, when converted based on a phase of the signal, is from (2n+1)/4 to (2n+1)+/4, where n is an integer greater than or equal to zero.

A Doherty amplifier including a main amplifier and a peak amplifier is mounted on a package substrate. A low noise amplifier is further mounted on the package substrate. A transmit/receive switch switches in terms of time between a transmission connection state in which an output signal of the Doherty amplifier is supplied to an antenna and a reception connection state in which a signal received by the antenna is inputted to the low noise amplifier.

A radio-frequency module includes a mounting substrate and first and second power amplifiers. The first and second power amplifiers are each mounted on one main surface of the mounting substrate. The first power amplifier includes a first input terminal and a first outer periphery. The first outer periphery includes a first edge section. The second power amplifier includes a second input terminal and a second outer periphery. The second outer periphery includes a second edge section. The second edge section opposes the first edge section in a first direction. The first input terminal is disposed in the first edge section of the first power amplifier. The second input terminal is disposed in the second edge section of the second power amplifier. The first and second input terminals do not overlap each other in the first direction.

A testing system includes: a dividing circuit configured to receive a testing signal and provide a plurality of input signals according to the testing signal; and a plurality of power-amplifier chips coupled to the dividing circuit, each of the plurality of power-amplifier chips being configured to be tested by receiving a respective input signal of the plurality of input signals and generating a respective output signal for a predetermined testing time.

A dual mode notch filter for use in a multi-band millimeter wave (mmW) transmitter includes a transmit filter circuit disposed between two amplifiers in a mmW transmit signal path, the transmit filter circuit formed by at least one switch, at least one capacitor, and a double-tuned transformer, the transmit filter circuit having at least two modes configured to selectively filter a spurious signal in at least a first communication band.

Described is a system for modulating power to one or more radio frequency (RF) amplifiers to suppress undesired output signal components, improve linearity and reduce noise. The described systems and techniques enable shaping of spectral components introduced via an amplifier bias voltage owing to transitions among bias discrete states. The systems and techniques facilitate operation of multilevel, RF amplifiers under a wider range of operating conditions. In embodiments, the system includes modulators coupled to a supply terminal port of each of the one or more amplifiers to modulate the voltage levels supplied to the one or more amplifiers. The outputs of the modulators may be combined to provide a combined signal coupled to the amplifiers. A delay circuit delays switching of at least one of the power modulators relative to other modulator, by a variable time delay. This results in suppression of undesired output signal components of the amplifier output.