An apparatus is provided that includes circuitry for decomposing an input signal to multiple substantially constant-envelope components and an outphasing path for each substantially constant-envelope component. The apparatus also includes a modulator for discrete phase control in each outphasing path, an amplifier in each outphasing path and a combiner for combining output signals from the outphasing paths. A system and method are also provided.

An amplifier circuit includes an output terminal, an amplification unit and a switch. The output terminal is used to output an amplification signal. The amplification unit includes a first transistor and a second transistor. The first transistor includes a control terminal for receiving a first input signal, a first terminal coupled to the output terminal for outputting an amplified first input signal, and a second terminal. The second transistor includes a control terminal for receiving a second input signal, a first terminal coupled to the output terminal for outputting an amplified second input signal, and a second terminal. The switch includes a first terminal coupled to the second terminal of the first transistor, and a second terminal. The amplification signal is generated using at least the amplified first input signal and/or the amplified second input signal.

A digital radio-frequency (RF) circuitry is disclosed. In one aspect, the circuitry includes a digitally controlled amplifier configured to receive an RF input signal and a digital control signal, and to output an amplitude controlled output signal. The digitally controlled amplifier includes one or more common-source amplifying unit cells. A respective common-source amplifying unit cell includes a sources node connected to a switching circuitry controllable by the digital control signal so as to activate or deactivate the common-source amplifying unit cell. The switching circuitry comprises a first switch configured to connect the source node with a first power supply node and a second switch configured to connect the source node with a second power supply node when activating and deactivating, respectively, the common-source amplifying unit cell.

An integrated circuit device is provided. In some examples, the integrated circuit device includes a first amplifier path, a second amplifier path coupled in parallel with the first amplifier path, a matching network coupled to the first amplifier path and the second amplifier path, and an antenna coupled to the matching network. In some such examples, the first amplifier path includes a first differential power amplifier coupled to the matching network, and the second amplifier path includes a second differential power amplifier coupled to the matching network. The integrated circuit device may further include a controller coupled to selectively enable the first amplifier path to provide a transmitter output power within a first range and to selectively enable the second amplifier path to provide a transmitter output power within a second range that is different from the first range.

A Doherty amplifier system is disclosed. The Doherty amplifier system includes a carrier amplifier having a main input for receiving a first portion of a radio frequency (RF) signal and a main output in communication with a RF signal output. A peaking amplifier has a peak input for receiving a second portion of the RF signal and a peak output in communication with the RF signal output. Further included is a first impedance inverter coupled between the main output and the peak output. A second impedance inverter is coupled between the peak output and the RF signal output. A first impedance inverter coefficient of the first impedance inverter is numerically within ±10% of a second impedance inverter coefficient of the second impedance inverter.

A Doherty power amplifier having a main power amplification device and an auxiliary power amplification device arranged in parallel with the main power amplification device includes a load modulation circuit having a harmonic injection circuit connected with respective outputs of the main power amplification device and the auxiliary power amplification device. The harmonic injection circuit is arranged to provide a phase shift to simultaneously modulate transfer of second harmonic components generated at the main power amplification device to the auxiliary power amplification device and transfer of second harmonic components generated at the auxiliary power amplification device to the main power amplification device, when the main power amplification device and the auxiliary power amplification device are operated at saturation.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier configured to amplify a transmission signal; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier and the PA control circuit are stacked on the first principal surface, and the first circuit component is disposed on the second principal surface.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.

A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying element; a second amplifying element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying element, another end of the primary coil is connected to an output terminal of the second amplifying element, an end of the secondary coil is connected to an output terminal of the power amplifier, the first amplifying element and the second amplifying element are disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.

An embodiment of a Doherty amplifier includes a module substrate, first and second surface-mount devices coupled to a top surface of the module substrate, and an impedance inverter line assembly. The first and second surface-mount devices include first and second amplifier dies, respectively. The impedance inverter line assembly is electrically connected between outputs of the first and second amplifier dies. The impedance inverter line assembly includes an impedance inverter line coupled to the module substrate, a first lead of the first surface-mount device coupled between the first amplifier die output and a proximal end of the impedance inverter line, and a second lead of the second surface-mount device coupled between the second amplifier die output and a distal end of the impedance inverter line. According to a further embodiment, the impedance inverter line assembly has a 90 degree electrical length at a fundamental operational frequency of the Doherty amplifier.