H03F3/211

POWER AMPLIFIER SYSTEMS WITH DC CURRENT REUSE ACROSS STAGES

Power amplifier systems with DC current reuse across stages are disclosed. In certain embodiments, a mobile device includes a transceiver configured to generate a first radio frequency input signal, and a front end system. The front end system includes a first power amplifier stage configured to amplify the first radio frequency input signal to generate a first radio frequency output signal, and a second power amplifier stage configured to amplify a second radio frequency input signal to generate a second radio frequency output signal. The first power amplifier stage and the second power amplifier stage are electrically connected in a first stack between a first power high supply voltage and a power low supply voltage and configured to operate with a shared DC bias current.

Power amplifier

The present disclosure is to improve the power added efficiency of a power amplifier at high output power. The power amplifier includes: a first capacitor with a radio frequency signal input to one end thereof; a first transistor whose base is connected to the other end of the first capacitor to amplify the radio frequency signal; a bias circuit for supplying bias to the base of the first transistor; and a second capacitor with one end connected to the base of the first transistor and the other end connected to the emitter of the first transistor.

Direct substrate to solder bump connection for thermal management in flip chip amplifiers

Solder bumps are placed in direct contact with the silicon substrate of an amplifier integrated circuit having a flip chip configuration. A plurality of amplifier transistor arrays generate waste heat that promotes thermal run away of the amplifier if not directed out of the integrated circuit. The waste heat flows through the thermally conductive silicon substrate and out the solder bump to a heat-sinking plane of an interposer connected to the amplifier integrated circuit via the solder bumps.

Dynamic supply modulation power amplifier architecture for millimeter wave applications
11515630 · 2022-11-29 · ·

Examples disclosed herein relate to a dynamic supply modulation power amplifier architecture for millimeter wave applications. The architecture includes phase shifters coupled to a power input port, power amplifiers coupled to respective power output ports, variable gain amplifiers coupled to the phase shifters and to the power amplifiers and are configured to supply dynamically varying input power to the power amplifiers. The architecture includes a first look-up table coupled to the variable gain amplifiers to control the variable gain amplifiers. The architecture also includes a second look-up table coupled to the power amplifiers, where each of the power amplifiers is supply modulated by active drain voltage modulation controlled by the second look-up table and variable input power from the variable gain amplifiers. Other examples disclosed herein include a radar system for use in an autonomous driving vehicle and an analog beamforming antenna for millimeter wave applications.

Logarithmic RMS-detector with servo loop
11515852 · 2022-11-29 · ·

Measurement of signal power for variable or time varying signals. A log-linear VGA coupled in a feedback configuration to a difference detector and an integrator, includes a set of amplifier cells selectable by a sliding current generator, producing a sum of outputs. Outputs of the sliding current generator include a first control current provided using a sum of amplified currents, a sequence of intermediate control currents, and a final control current provided using a sum of amplified currents. Control currents to be summed can be differentially amplified or attenuated; attenuators include capacitors to compensate for capacitive loading. Selectable amplifier cells are differentially amplified or attenuated. Isolating switches and canceling stages reduce the effects of leakage between adjacent amplifier cells. The sliding current generator can have boosted current to first and last amplifier cells, providing a more linear-in-dB gain near a relative maximum or minimum.

AMPLIFICATION DEVICE
20220376663 · 2022-11-24 · ·

An amplification device includes an amplification unit, an impedance unit and a log power detector. The amplification unit includes an input terminal for receiving a radio-frequency signal, an output terminal for outputting an amplified radio-frequency signal, and a detected terminal for outputting a detected signal related to the radio-frequency signal. The impedance unit is used to provide an impedance. The impedance unit includes an input terminal coupled to the detected terminal of the amplification unit for receiving the detected signal, and an output terminal for outputting a power signal. The log power detector is used to generate a power indication signal according to the power signal. The log power detector includes an input terminal coupled to the output terminal of the impedance unit, and an output terminal for outputting the power indication signal.

Device stack with novel gate capacitor topology
11509270 · 2022-11-22 · ·

Systems, methods and apparatus for practical realization of an integrated circuit comprising a stack of transistors operating as an RF amplifier are described. As stack height is increased, capacitance values of gate capacitors used to provide a desired distribution of an RF voltage at the output of the amplifier across the stack may decrease to values approaching parasitic/stray capacitance values present in the integrated circuit which may render the practical realization of the integrated circuit difficult. Coupling of an RF gate voltage at the gate of one transistor of the stack to a gate of a different transistor of the stack can allow for an increase in the capacitance value of the gate capacitor of the different transistor for obtaining an RF voltage at the gate of the different transistor according to the desired distribution.

METHODS OF PLASMA DICING BULK ACOUSTIC WAVE COMPONENTS
20230059917 · 2023-02-23 ·

Aspects of this disclosure relate to methods of manufacturing bulk acoustic wave components. Such methods include plasma dicing to singulate individual bulk acoustic wave components. A buffer layer can be formed over a substrate of bulk acoustic wave components such that streets are exposed. The bulk acoustic wave components can be plasma diced along the exposed streets to thereby singulate the bulk acoustic wave components

FAST, LOW-POWER RECEIVE SIGNAL STRENGTH INDICATOR (RSSI) CIRCUIT AND METHOD THEREFOR

A receive signal strength indicator circuit includes a low-noise amplifier, an envelope detector, and a selection circuit. The low-noise amplifier has a plurality of serially-coupled amplifier stages each providing an amplified signal, wherein a first amplifier stage receives an input signal whose signal strength is to be measured, and a last amplifier stage provides an amplified output signal. The envelope detector stage includes a plurality of envelope detector circuits, each having an input receiving the amplified signal of a corresponding one of the plurality of serially-coupled amplifier stages, and an output for providing a receive signal strength indicator component. The selection circuit is coupled to the outputs of the plurality of envelope detector circuits, and provides the receive signal strength indicator component of one of the plurality of envelope detector circuits having a desired linear range as a detected RSSI signal.

VERSATILE LOW NOISE AMPLIFIER AND METHOD THEREFOR

A low noise amplifier includes a plurality of serially-coupled amplifier stages. Each serially-coupled amplifier stage provides a respective amplified signal, wherein a first amplifier stage receives an input signal, and a last amplifier stage provides an amplified output signal. Each serially-coupled amplifier stage includes a single-ended amplifier having an input, and an output providing the respective amplified signal, a first passive network, and a second passive network. The first passive network has a first terminal forming an input of a respective one of said plurality of serially-coupled amplifier stages, and a second terminal coupled to said input of said single-ended amplifier, the first passive network including a first capacitor coupled in series between the first and said second terminals of the first passive network. The second passive network is coupled in parallel to the single-ended amplifier and between the input and the output of the single-ended amplifier.