A power converter produces power at a greater voltage than provided by a power source, while drawing power from the power source, wherein the power converter has a variable input current limit or a variable input power limit. One or more audio amplifiers are configured into i) drawing power from the power source bypassing the power converter and ii) drawing power from the power converter, according to audio signal amplitude, during audio playback and in accordance with an audio signal being amplified. A load of each amplifier is determined for when the amplifier is drawing power from the power source bypassing the power converter. The variable input limit of the power converter is adjusted in accordance with the determined load, during the audio playback. Other aspects are also described and claimed.

A power converter produces power at a greater voltage than provided by a power source, while drawing power from the power source, wherein the power converter has a variable input current limit or a variable input power limit. One or more audio amplifiers are configured into i) drawing power from the power source bypassing the power converter and ii) drawing power from the power converter, according to audio signal amplitude, during audio playback and in accordance with an audio signal being amplified. A load of each amplifier is determined for when the amplifier is drawing power from the power source bypassing the power converter. The variable input limit of the power converter is adjusted in accordance with the determined load, during the audio playback. Other aspects are also described and claimed.

In an electronic circuit design system, dynamic visual guidance for relative placement of mutually paired electronic components, such as a bypass capacitance portion and a power pin in a power domain, is provided. A first, selected component is adaptively paired with one of a plurality of second components eligible for pairing with the first component, according to predetermined pairing criteria such as proximity criteria. A mutual placement zone between the paired components is generated to define a locus of valid placement locations of the paired first and second components one with respect to the other according to predetermined placement criteria therefor. Visual indicia to represent the mutual placement zone is generated, thereby providing visual guidance to reposition the first component.

Examples disclosed herein relate to a vector modulator architecture, having an input splitter network configured to receive a radio frequency (RF) input signal and generate a plurality of quadrature signals at different phases, a variable gain amplifier (VGA) stage coupled to the input splitter network and configured to apply a first gain to one or more of the plurality of quadrature signals, a power combiner coupled to the VGA stage and configured to combine the plurality of quadrature signals into a combined RF signal, and a power amplifier (PA) stage coupled to the power combiner and configured to apply a second gain to the combined RF signal and generate an output RF signal. Other examples disclosed herein relate to an antenna system for autonomous vehicles and a radar system for use in an autonomous driving vehicle.

Examples disclosed herein relate to a vector modulator architecture, having an input splitter network configured to receive a radio frequency (RF) input signal and generate a plurality of quadrature signals at different phases, a variable gain amplifier (VGA) stage coupled to the input splitter network and configured to apply a first gain to one or more of the plurality of quadrature signals, a power combiner coupled to the VGA stage and configured to combine the plurality of quadrature signals into a combined RF signal, and a power amplifier (PA) stage coupled to the power combiner and configured to apply a second gain to the combined RF signal and generate an output RF signal. Other examples disclosed herein relate to an antenna system for autonomous vehicles and a radar system for use in an autonomous driving vehicle.

An amplifier device comprises an amplifying unit and a bias module. The amplifying unit has a first end coupled to a voltage source configured to receive a source voltage, a second end configured to receive an input signal, and a third end coupled to a first reference potential terminal configured to receive a first reference potential. The first end of the amplifying unit is configured to output an output signal amplified by the amplifying unit. The bias module is coupled to the second end of the amplifying unit, and configured to receive a voltage signal to provide a bias current to the amplifying unit. The voltage signal is a variable voltage. A supply current flowing into the amplifying unit and is adjusted in accordance with the voltage signal to stay within a predetermined range.

An amplifier device comprises an amplifying unit and a bias module. The amplifying unit has a first end coupled to a voltage source configured to receive a source voltage, a second end configured to receive an input signal, and a third end coupled to a first reference potential terminal configured to receive a first reference potential. The first end of the amplifying unit is configured to output an output signal amplified by the amplifying unit. The bias module is coupled to the second end of the amplifying unit, and configured to receive a voltage signal to provide a bias current to the amplifying unit. The voltage signal is a variable voltage. A supply current flowing into the amplifying unit and is adjusted in accordance with the voltage signal to stay within a predetermined range.

In a radio frequency power amplifier, a semiconductor chip includes at least one first transistor amplifying a radio frequency signal, a first external-connection conductive member connected to the first transistor, a bias circuit including a second transistor that applies a bias voltage to the first transistor, and a second external-connection conductive member connected to the second transistor. The second external-connection conductive member at least partially overlaps with the second transistor when viewed in plan.

In a radio frequency power amplifier, a semiconductor chip includes at least one first transistor amplifying a radio frequency signal, a first external-connection conductive member connected to the first transistor, a bias circuit including a second transistor that applies a bias voltage to the first transistor, and a second external-connection conductive member connected to the second transistor. The second external-connection conductive member at least partially overlaps with the second transistor when viewed in plan.

A system and method for using an embedded microprocessor in an RF amplifier. The use of an embedded microprocessor avoids manual calibration. The Microprocessor collects initial amplifier performance data based on a set of parameters and calculates the needed corrections. The microprocessor can change levels within the circuit to achieve those operating points. The embedded microprocessor sets voltage levels with internal circuitry and communicates this information externally through a serial communication port, or the like, to allow a user to communicate with and look at the amplifier data and readjust the internal bias levels, as needed. Thus, the internal microprocessor provides for calibration, self-testing, and monitoring of the RF amplifier and also functions as an in situ bias and temperature compensation controller for use in the presence of temperature variation and provides bias sequencing control to protect against improper applied timing of voltage inputs to the amplifier.