An amplifier module is provided. The amplifier module includes a multi-layer printed circuit board (PCB). A first power transistor die is mounted at a top surface of the multi-layer PCB. A second power transistor die is mounted at the top surface of the multi-layer PCB. An impedance inversion element is coupled between an output of the first power transistor die and an output of the second power transistor die. A combining node is formed at the output of the second power transistor die. A stub circuit including a transmission line element is coupled at the combining node.

An amplifier module is provided. The amplifier module includes a multi-layer printed circuit board (PCB). A first power transistor die is mounted at a top surface of the multi-layer PCB. A second power transistor die is mounted at the top surface of the multi-layer PCB. An impedance inversion element is coupled between an output of the first power transistor die and an output of the second power transistor die. A combining node is formed at the output of the second power transistor die. A stub circuit including a transmission line element is coupled at the combining node.

An apparatus for generating an output signal, may comprise a signal path having an analog signal path portion having an analog magnitude droop, a digital signal path portion having a digital magnitude droop, a digital-to-analog converter for converting the digital input signal into the analog signal, a first digital compensation filter that compensates for the analog magnitude droop, and a second digital compensation filter that compensates for the digital magnitude droop, such that the first digital compensation filter and the second digital compensation filter together compensate for magnitude droop of the signal path to ensure a substantially flat passband response of the signal path. An apparatus may include a delta-sigma modulator for quantization noise shaping of a digital signal, a digital-to-analog converter configured to generate an analog signal from the digital signal, and an amplifier configured to amplify the analog signal and powered from a charge pump, wherein the charge pump is configured to operate at a switching frequency approximately equal to a zero of a modulator noise transfer function of the delta-sigma modulator, such that the impact of charge pump noise on a total harmonic distortion noise of the apparatus is minimized.

An apparatus for generating an output signal, may comprise a signal path having an analog signal path portion having an analog magnitude droop, a digital signal path portion having a digital magnitude droop, a digital-to-analog converter for converting the digital input signal into the analog signal, a first digital compensation filter that compensates for the analog magnitude droop, and a second digital compensation filter that compensates for the digital magnitude droop, such that the first digital compensation filter and the second digital compensation filter together compensate for magnitude droop of the signal path to ensure a substantially flat passband response of the signal path. An apparatus may include a delta-sigma modulator for quantization noise shaping of a digital signal, a digital-to-analog converter configured to generate an analog signal from the digital signal, and an amplifier configured to amplify the analog signal and powered from a charge pump, wherein the charge pump is configured to operate at a switching frequency approximately equal to a zero of a modulator noise transfer function of the delta-sigma modulator, such that the impact of charge pump noise on a total harmonic distortion noise of the apparatus is minimized.

An apparatus for and method of a supply modulator (SM) for a power amplifier (PA) is provided. The apparatus includes a buck-boost converter, including a supply input connected to a battery voltage (Vbat), and an output; and a buck converter, including a supply input connected to Vbat, an input connected to the output of the buck-boost converter, and an output.

An apparatus for and method of a supply modulator (SM) for a power amplifier (PA) is provided. The apparatus includes a buck-boost converter, including a supply input connected to a battery voltage (Vbat), and an output; and a buck converter, including a supply input connected to Vbat, an input connected to the output of the buck-boost converter, and an output.

An amplifier has an N number of input networks connected to an input terminal to receive an input signal, a first amplifier to amplify one output signal from the N number of input networks, a (N1) number of secondary amplifiers to amplify the remaining (N1) number of output signals, except for the one output signal, from the N number of input networks, where the amplification order of the (N1) number of secondary amplifiers is determined based on the power level of each output signal from the N number of input networks when the first amplifier is operational, an N number of output networks which are arranged, and a first bias network to supply a D.C. bias voltage to at least one of the N number of output networks. An electrical length of the first bias network is less than 90 degrees.

An amplifier has an N number of input networks connected to an input terminal to receive an input signal, a first amplifier to amplify one output signal from the N number of input networks, a (N1) number of secondary amplifiers to amplify the remaining (N1) number of output signals, except for the one output signal, from the N number of input networks, where the amplification order of the (N1) number of secondary amplifiers is determined based on the power level of each output signal from the N number of input networks when the first amplifier is operational, an N number of output networks which are arranged, and a first bias network to supply a D.C. bias voltage to at least one of the N number of output networks. An electrical length of the first bias network is less than 90 degrees.

Monolithic microwave integrated circuits are provided that include a substrate, a transmit/receive selection device that is formed on the substrate, a high power amplifier formed on the substrate and coupled to a first RF port of the transmit/receive selection device, a low noise amplifier formed on the substrate and coupled to a second RF port of the transmit/receive selection device and a protection circuit that is coupled to a first control port of the transmit/receive selection device.

Monolithic microwave integrated circuits are provided that include a substrate, a transmit/receive selection device that is formed on the substrate, a high power amplifier formed on the substrate and coupled to a first RF port of the transmit/receive selection device, a low noise amplifier formed on the substrate and coupled to a second RF port of the transmit/receive selection device and a protection circuit that is coupled to a first control port of the transmit/receive selection device.