The invention provides a bond wire arrangement comprising a signal bond wire (1) for operably connecting a first electronic device (6) to a second electronic device (8), and a control bond wire (2) being arranged alongside the signal bond wire at a distance so as to have a magnetic coupling with the signal bond wire (1), and having a first end (11) coupled to ground, and a second end (12) coupled to ground via a resistive element (14). The proposed solution allows the control of the Q factor (losses) of wire bond inductors during assembly phase, which will save time and reduce overall design cycle as compared to known methods.

Shoot-through condition in a component containing an amplifier with a push-pull output stage is managed. A first current in a first transistor of the output stage is mirrored to generate a first mirrored current. A second current in a second transistor of the output stage is mirrored to generate a second mirrored current. A sum of the first mirrored current and said second mirrored current is generated. When a magnitude of the sum exceeds a first pre-determined threshold, a respective control voltage of the first transistor and the second transistor is adjusted to reduce the first current and the second current at least until the sum falls below a second pre-determined threshold. In an embodiment, the first pre-determined threshold equals the second pre-determined threshold. In an embodiment, the component is a class-L power amplifier.

Shoot-through condition in a component containing an amplifier with a push-pull output stage is managed. A first current in a first transistor of the output stage is mirrored to generate a first mirrored current. A second current in a second transistor of the output stage is mirrored to generate a second mirrored current. A sum of the first mirrored current and said second mirrored current is generated. When a magnitude of the sum exceeds a first pre-determined threshold, a respective control voltage of the first transistor and the second transistor is adjusted to reduce the first current and the second current at least until the sum falls below a second pre-determined threshold. In an embodiment, the first pre-determined threshold equals the second pre-determined threshold. In an embodiment, the component is a class-L power amplifier.

Nested microstrip systems and methods, and systems and methods encompassing same, are disclosed herein. In one example, a nested microstrip system includes a printed circuit board (PCB) having first and second layer levels, where first and second conductive traces are positioned at the second layer level. The first conductive trace is configured to include an orifice, and to extend between first and second locations along a first path, and the second conductive trace is positioned within the orifice. A non-conductive gap portion of the orifice exists between the first and second conductive traces so that the second conductive trace is electrically isolated from the first conductive trace. One or more first electromagnetic signals can be propagated along a first part of the first conductive trace, and one or more second electromagnetic signals can be propagated along at least a second part of the second conductive trace.

Nested microstrip systems and methods, and systems and methods encompassing same, are disclosed herein. In one example, a nested microstrip system includes a printed circuit board (PCB) having first and second layer levels, where first and second conductive traces are positioned at the second layer level. The first conductive trace is configured to include an orifice, and to extend between first and second locations along a first path, and the second conductive trace is positioned within the orifice. A non-conductive gap portion of the orifice exists between the first and second conductive traces so that the second conductive trace is electrically isolated from the first conductive trace. One or more first electromagnetic signals can be propagated along a first part of the first conductive trace, and one or more second electromagnetic signals can be propagated along at least a second part of the second conductive trace.

A power amplification high-frequency circuit device includes: an input conversion pin; an output conversion pin; a high-frequency amplifier having an input terminal and an output terminal; a waveguide tube in which an input waveguide tube and an output waveguide tube face each other with a short wall interposed between the input waveguide tube and the output waveguide tube, an upper wall of the input waveguide tube has an input pin insertion hole into which the input conversion pin is inserted while being electrically insulated, an upper wall of the output waveguide tube has an output pin insertion hole into which the output conversion pin is inserted while being electrically insulated, an upper wall has a storage portion having a flat bottom surface, and the high-frequency amplifier is stored in the storage portion with a bottom surface thereof being in close contact with the bottom surface of the storage portion.

A power amplification high-frequency circuit device includes: an input conversion pin; an output conversion pin; a high-frequency amplifier having an input terminal and an output terminal; a waveguide tube in which an input waveguide tube and an output waveguide tube face each other with a short wall interposed between the input waveguide tube and the output waveguide tube, an upper wall of the input waveguide tube has an input pin insertion hole into which the input conversion pin is inserted while being electrically insulated, an upper wall of the output waveguide tube has an output pin insertion hole into which the output conversion pin is inserted while being electrically insulated, an upper wall has a storage portion having a flat bottom surface, and the high-frequency amplifier is stored in the storage portion with a bottom surface thereof being in close contact with the bottom surface of the storage portion.

An amplifier circuit includes an inductor coupled to an amplifier, an inductor coupled to an amplifier, an inductor provided in series in a first output path connecting the amplifier and the inductor, a capacitor coupled to the first output path and the ground, a capacitor provided in series in a second output path connecting the amplifier and the inductor, an inductor coupled to the second output path and the ground, and a first circuit coupled between a first path connecting the inductors and a second path connecting the capacitor and the inductor.

An amplifier circuit includes an inductor coupled to an amplifier, an inductor coupled to an amplifier, an inductor provided in series in a first output path connecting the amplifier and the inductor, a capacitor coupled to the first output path and the ground, a capacitor provided in series in a second output path connecting the amplifier and the inductor, an inductor coupled to the second output path and the ground, and a first circuit coupled between a first path connecting the inductors and a second path connecting the capacitor and the inductor.

There is provided a transmission apparatus having a transmission line into which a low-impedance part is inserted. The transmission apparatus includes a package having a first impedance, a first transmission line and a second transmission line respectively connected on either side of the package and having a second impedance different from the first impedance, and an intermediate section respectively disposed in a connection between the package and the first transmission line and in a connection between the package and the second transmission line. The intermediate section is adjusted to have an electrical length of ?/4 (where ? is an electromagnetic wavelength corresponding to a desired frequency) and an impedance that is intermediate between the first impedance and the second impedance.