Use of a closed loop APC may involve a problem of cost and power consumption due to increased circuit scale. The semiconductor device includes a power amplifier that amplifies an output from a transmission circuit and a regulator that supplies power to the power amplifier. The regulator includes an operational amplifier comprising a loop gain control circuit and a loop gain control voltage generation circuit that supplies control voltage to the loop gain control circuit. The loop gain control voltage generation circuit minimizes a loop gain of the operational amplifier when starting up the regulator.

A packaged transistor amplifier includes a package having an input lead and an output lead; a transistor stage having a plurality of unit cell transistors that are electrically coupled to the input lead in parallel, each of the unit cell transistors having an output; a first output bond pad that is coupled to a first subset of the outputs of the unit cell transistors by a first feed network; a second output bond pad that is separate from the first output bond pad, the second output bond pad coupled to a second subset of the outputs of the unit cell transistors by a second feed network; a first output bond wire coupled between the first output bond pad and the output lead; and a second output bond wire coupled between the second output bond pad and the output lead. Related design methods are also provided.

A packaged transistor amplifier includes a package having an input lead and an output lead; a transistor stage having a plurality of unit cell transistors that are electrically coupled to the input lead in parallel, each of the unit cell transistors having an output; a first output bond pad that is coupled to a first subset of the outputs of the unit cell transistors by a first feed network; a second output bond pad that is separate from the first output bond pad, the second output bond pad coupled to a second subset of the outputs of the unit cell transistors by a second feed network; a first output bond wire coupled between the first output bond pad and the output lead; and a second output bond wire coupled between the second output bond pad and the output lead. Related design methods are also provided.

An apparatus for detecting difference in operating characteristics of a main circuit by using a replica circuit is presented. In one exemplary case, a sensed difference in operating characteristics of the two circuits is used to drive a tuning control loop to minimize the sensed difference. In another exemplary case, several replica circuits of the main circuit are used, where each is isolated from one or more operating variables that affect the operating characteristic of the main circuit. Each replica circuit can be used for sensing a different operating characteristic, or, two replica circuits can be combined to sense a same operating characteristic.

An apparatus for detecting difference in operating characteristics of a main circuit by using a replica circuit is presented. In one exemplary case, a sensed difference in operating characteristics of the two circuits is used to drive a tuning control loop to minimize the sensed difference. In another exemplary case, several replica circuits of the main circuit are used, where each is isolated from one or more operating variables that affect the operating characteristic of the main circuit. Each replica circuit can be used for sensing a different operating characteristic, or, two replica circuits can be combined to sense a same operating characteristic.

An amplifier circuit including a semiconductor element is formed on a substrate. A protection circuit formed on the substrate includes a plurality of protection diodes that are connected in series with each other, and the protection circuit is connected to an output terminal of the amplifier circuit. A pad conductive layer at least partially includes a pad for connecting to a circuit outside the substrate. The pad conductive layer and the protection circuit at least partially overlap each other in plan view.

An amplifier circuit including a semiconductor element is formed on a substrate. A protection circuit formed on the substrate includes a plurality of protection diodes that are connected in series with each other, and the protection circuit is connected to an output terminal of the amplifier circuit. A pad conductive layer at least partially includes a pad for connecting to a circuit outside the substrate. The pad conductive layer and the protection circuit at least partially overlap each other in plan view.

Techniques for monitoring a distortion signal of a power amplifier circuit, where the output of a distortion monitoring circuit includes little or no fundamental signal and closely represents the actual distortion of the amplifier circuit of a wired communications system. The power amplifier circuit can generate a distortion feedback signal that does not affect the power amplifier's output power capability, e.g., no inherent loss in the fundamental output of the amplifier. That is, using a distortion monitor circuit, the power amplifier circuit can resolve a distortion feedback signal from the intended output signal of the output power amplifier circuit.

Techniques for monitoring a distortion signal of a power amplifier circuit, where the output of a distortion monitoring circuit includes little or no fundamental signal and closely represents the actual distortion of the amplifier circuit of a wired communications system. The power amplifier circuit can generate a distortion feedback signal that does not affect the power amplifier's output power capability, e.g., no inherent loss in the fundamental output of the amplifier. That is, using a distortion monitor circuit, the power amplifier circuit can resolve a distortion feedback signal from the intended output signal of the output power amplifier circuit.

A semiconductor integrated circuit includes a transformer that includes a first winding and a second winding, a low-noise amplifier circuit that includes an input terminal in which at least one end of the second winding of the transformer is connected to the input terminal; and a switch that is provided between the one end and another end of the second winding of the transformer. The switch is opened and the transformer functions as an input impedance matching circuit for the low-noise amplifier circuit in a period in which a reception signal is supplied to the first winding of the transformer. On the other hand, the switch is closed and the transformer is caused to become an element including a predetermined capacitance in a period in which another circuit connected to the predetermined node operates.