An electronic device may include wireless circuitry with a processor, a transceiver, an antenna, and a front-end module coupled between the transceiver and the antenna. The front-end module may include one or more power amplifiers for amplifying a signal for transmission through the antenna. Radio-frequency power amplifier circuitry may include an amplifier, an input transformer for coupling radio-frequency input signals to the amplifier, an active inductor load coupled to the input transformer, and a second order intermodulation generation circuit configured to generate and inject a second order intermodulation product into the input transformer. The injected second order intermodulation product can be used to cancel out unwanted third order intermodulation products generated by the amplifier, which reduces intermodulation distortion experienced by the amplifier circuitry.

Systems and methods are disclosed herein for selectively compensating for a specific Intermodulation Distortion (IMO) product(s) of an arbitrary order in a transmitter system. In some embodiments, a method of compensating for one or more specific IMO products in a concurrent multi-band transmitter system comprises generating an IMO correction signal for a specific IMO product as a function of two or more frequency band input signals for two or more frequency bands of a concurrent multi-band signal, the IMO product being an arbitrary order IMD product. The method further comprises frequency translating the IMD correction signal to a desired frequency that corresponds to a Radio Frequency (RF) location of the specific IMO product and, after frequency translating the IMO correction signal to the desired frequency, utilizing the IMO correction signal to compensate for the specific IMO product.

Systems and methods are disclosed herein for selectively compensating for a specific Intermodulation Distortion (IMO) product(s) of an arbitrary order in a transmitter system. In some embodiments, a method of compensating for one or more specific IMO products in a concurrent multi-band transmitter system comprises generating an IMO correction signal for a specific IMO product as a function of two or more frequency band input signals for two or more frequency bands of a concurrent multi-band signal, the IMO product being an arbitrary order IMD product. The method further comprises frequency translating the IMD correction signal to a desired frequency that corresponds to a Radio Frequency (RF) location of the specific IMO product and, after frequency translating the IMO correction signal to the desired frequency, utilizing the IMO correction signal to compensate for the specific IMO product.

A power amplifier system having a power amplifier stage with dynamic bias circuitry is disclosed. Also included is bias control circuitry having a compression sensor having a sensor input coupled to a RF signal output and a sensor output, wherein the compression sensor is configured to generate a gain deviation signal in response to a sensed deviation from a flat gain profile of the power amplifier stage. Further included is a bias driver that is configured to drive dynamic bias circuitry to adjust bias to the power amplifier stage to maintain the flat gain profile in response to the gain deviation signal.

In some embodiments, a power amplification system can comprise a current source, an input switch configured to alternatively feed current from the current source to a high-power circuit path and a low-power circuit path, and a band switch including a switch arm for switching between a plurality of bands. Each of the high-power circuit path and the low-power circuit path can be connected to the switch arm.

In some embodiments, a power amplification system can comprise a current source, an input switch configured to alternatively feed current from the current source to a high-power circuit path and a low-power circuit path, and a band switch including a switch arm for switching between a plurality of bands. Each of the high-power circuit path and the low-power circuit path can be connected to the switch arm.

Bias arrangements for amplifiers are disclosed. An example bias arrangement for an amplifier includes a bias circuit, configured to produce a bias signal for the amplifier; a linearization circuit, configured to improve linearity of the amplifier by modifying the bias signal produced by the bias circuit to produce a modified bias signal to be provided to the amplifier; and a coupling circuit, configured to couple the bias circuit and the linearization circuit. Providing separate bias and linearization circuits coupled to one another by a coupling circuit allows separating a linearization operation from a biasing loop to overcome some drawbacks of prior art bias arrangements that utilize a single biasing loop.

A semiconductor amplifier circuit has a driver that outputs a drive signal corresponding to an input signal and switches drive capability of the drive signal in accordance with a logic of an instruction signal, an instruction signal setting unit that sets the logic of the instruction signal in accordance with whether the input signal satisfies a predetermined condition, and an output circuit that comprises a control terminal to which the drive signal is input and an output terminal that outputs a signal obtained by amplifying the input signal.

Thermal temperature sensors for power amplifiers are provided herein. In certain implementations, a semiconductor die includes a compound semiconductor substrate, and a power amplifier including a plurality of field-effect transistors (FETs) configured to amplify a radio frequency (RF) signal. The plurality of FETs are arranged on the compound semiconductor substrate as a transistor array. The semiconductor die further includes a semiconductor resistor configured to generate a signal indicative of a temperature of the transistor array. The semiconductor resistor is located adjacent to one end of the transistor array.

Thermal temperature sensors for power amplifiers are provided herein. In certain implementations, a semiconductor die includes a compound semiconductor substrate, and a power amplifier including a plurality of field-effect transistors (FETs) configured to amplify a radio frequency (RF) signal. The plurality of FETs are arranged on the compound semiconductor substrate as a transistor array. The semiconductor die further includes a semiconductor resistor configured to generate a signal indicative of a temperature of the transistor array. The semiconductor resistor is located adjacent to one end of the transistor array.