Antenna waveguide transitions for solid state power amplifiers (SSPAs) are disclosed. An SSPA includes a waveguide channel that is configured to propagate an input signal, such as an electromagnetic signal, from an input port to a solid state amplifier for amplification. The waveguide channel is further configured to propagate an amplified signal from the solid state amplifier to an output port. Waveguide transitions to and from the solid state amplifier are bandwidth matched to the waveguide channel. Additionally, the waveguide transitions may be thermally coupled to the waveguide channel. The waveguide transitions may include antenna structures that have a signal conductor and a ground conductor. In this manner, the SSPA may have improved broadband coupling as well as improved thermal dissipation for heat generated by the solid state amplifier.

This invention provides compact Power Amplifiers with improved efficiency of the circuitry and improved heat dissipation, together achieved much smaller enclosure size for use in modern installations requiring reduced height such as between the thin flat TV and wall, under the table or on the projector pole or in ceiling box and the like.

In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.

In one embodiment, an electronic system includes a printed circuit board, one or more packaged semiconductor devices, and a vapor chamber having a top and a bottom and enclosing a sealed cavity that is partially filled with a coolant. The vapor chamber comprises a thermo-conductive and electro-conductive material. The top of the vapor chamber has one or more depressions formed therein, each depression receiving and thermo-conductively connected to at least part of a bottom of a corresponding packaged semiconductor device, which is mounted through a corresponding aperture in the PCB. A heat sink may be thermo-conductively attached to the bottom of the vapor chamber.

Packaged RF transistor amplifiers are provided that include a flat no-lead overmold package that includes a die pad, a plurality of terminal pads and an overmold encapsulation that at least partially covers the die pad and the terminal pads and an RF transistor amplifier die mounted on the die pad and at least partially covered by the overmold encapsulation. These packaged RF transistor amplifiers may have an output power density of at least 3.0 W/mm.sup.2.

Packaged RF transistor amplifiers are provided that include a flat no-lead overmold package that includes a die pad, a plurality of terminal pads and an overmold encapsulation that at least partially covers the die pad and the terminal pads and an RF transistor amplifier die mounted on the die pad and at least partially covered by the overmold encapsulation. These packaged RF transistor amplifiers may have an output power density of at least 3.0 W/mm.sup.2.

A motion sensor device comprises: a reverse electrowetting-on-dielectric (REWOD) generator configured to generate alternating current (AC) based on motion; a motion sensor configured to measure motion data; and a wireless motion sensor read-out circuit coupled to the REWOD generator and the motion sensor, the wireless motion sensor read-out circuit configured to transmit the motion data and operate on the AC from the REWOD generator.

A digital quadrature modulator holds local oscillator circuitry configured to provide local oscillator signals, and local oscillator polarity logic circuitry configured to select an In-phase and a Quadrature local oscillator signal according to a sign bit of an In-phase control word and a sign bit of a Quadrature control word, respectively. The modulator holds a number of local oscillator control logic circuits, each configured to generate a conditioned signal by gating one or both of the selected local oscillator signals according to values of the In-phase control word and/or values of the Quadrature control word. The modulator has one or more sets of switched-capacitor units, where each unit has an output provided by an output capacitor, and where a signal at the input side of the output capacitor is controlled by a conditioned signal. The outputs of at least two of the switched-capacitor units are combined in a common node.

A digital quadrature modulator holds local oscillator circuitry configured to provide local oscillator signals, and local oscillator polarity logic circuitry configured to select an In-phase and a Quadrature local oscillator signal according to a sign bit of an In-phase control word and a sign bit of a Quadrature control word, respectively. The modulator holds a number of local oscillator control logic circuits, each configured to generate a conditioned signal by gating one or both of the selected local oscillator signals according to values of the In-phase control word and/or values of the Quadrature control word. The modulator has one or more sets of switched-capacitor units, where each unit has an output provided by an output capacitor, and where a signal at the input side of the output capacitor is controlled by a conditioned signal. The outputs of at least two of the switched-capacitor units are combined in a common node.

Example embodiments relate to hybrid Doherty power amplifier modules. One embodiment includes a printed circuit board having an input RF terminal and an output RF terminal, and on which printed circuit board a primary Doherty amplifier is integrated. The primary Doherty amplifier includes a primary Doherty splitter arranged on the printed circuit board and configured for splitting an input RF signal received at the input RF terminal into a plurality of RF signal components. The primary Doherty amplifier also includes a plurality of amplifying paths, each amplifying path being partially integrated on a semiconductor die of a first kind mounted on the printed circuit board and partially integrated on a semiconductor die of a second kind mounted on the printed circuit board. Further, the primary Doherty amplifier includes a primary Doherty combiner arranged on the printed circuit board.