Systems and methods for driving using a radio-frequency integrated circuit to drive one or more front end modules. The front end modules provide signal flexibility to an electronic device. The radio-frequency integrated circuit drives the one or more front end modules via dual-pole, dual-throw switches that enable a pair of radio-frequency chains in the radio-frequency integrated circuit to drive two pairs of radio-frequency chains in each of two connected front end modules.

Systems and methods for driving using a radio-frequency integrated circuit to drive one or more front end modules. The front end modules provide signal flexibility to an electronic device. The radio-frequency integrated circuit drives the one or more front end modules via dual-pole, dual-throw switches that enable a pair of radio-frequency chains in the radio-frequency integrated circuit to drive two pairs of radio-frequency chains in each of two connected front end modules.

Describe is a buffer which comprises: a differential source follower coupled to a first input and a second input; first and second current steering devices coupled to the differential source follower; and a current source coupled to the first and second current steering devices. The buffer provides high supply noise rejection ratio (PSRR) together with high bandwidth.

Describe is a buffer which comprises: a differential source follower coupled to a first input and a second input; first and second current steering devices coupled to the differential source follower; and a current source coupled to the first and second current steering devices. The buffer provides high supply noise rejection ratio (PSRR) together with high bandwidth.

An envelope tracking (ET) integrated circuit (IC) (ETIC) is provided. The ETIC includes a number of ET circuits configured to generate a number of ET voltages based on a number of ET target voltages, respectively. In examples discussed herein, a selected ET circuit among the ET circuits is configured to generate a respective ET voltage based on a maximum ET target voltage among the ET target voltages. In this regard, the respective ET voltage generated by the selected ET circuit can be used as a reference ET voltage for the rest of the ET circuits in the ETIC. As a result, it may be possible to opportunistically turn off or reduce functionality of one or more other ET circuits in the ETIC, thus helping to reduce peak battery current and improve heat dissipation in an ET amplifier apparatus incorporating the ETIC.

An envelope tracking (ET) integrated circuit (IC) (ETIC) is provided. The ETIC includes a number of ET circuits configured to generate a number of ET voltages based on a number of ET target voltages, respectively. In examples discussed herein, a selected ET circuit among the ET circuits is configured to generate a respective ET voltage based on a maximum ET target voltage among the ET target voltages. In this regard, the respective ET voltage generated by the selected ET circuit can be used as a reference ET voltage for the rest of the ET circuits in the ETIC. As a result, it may be possible to opportunistically turn off or reduce functionality of one or more other ET circuits in the ETIC, thus helping to reduce peak battery current and improve heat dissipation in an ET amplifier apparatus incorporating the ETIC.

A power amplifier module includes a combining circuit including a combiner. The combining circuit further includes a first inductor connected in series between an output terminal of a first amplifier and the combiner, a second inductor connected in series between an output terminal of a second amplifier and the combiner, and a second capacitor having an end connected to the combiner and another end grounded. A phase of a third signal from the output terminal of the first amplifier to the second amplifier through the combiner is delayed by about 45 degrees in the first inductor and the second capacitor, and is delayed by about 45 degrees in the second inductor and the second capacitor. A phase of the third signal from the output terminal of the first amplifier to the second amplifier through the first capacitor is advanced by about 90 degrees.

A power amplifier module includes a combining circuit including a combiner. The combining circuit further includes a first inductor connected in series between an output terminal of a first amplifier and the combiner, a second inductor connected in series between an output terminal of a second amplifier and the combiner, and a second capacitor having an end connected to the combiner and another end grounded. A phase of a third signal from the output terminal of the first amplifier to the second amplifier through the combiner is delayed by about 45 degrees in the first inductor and the second capacitor, and is delayed by about 45 degrees in the second inductor and the second capacitor. A phase of the third signal from the output terminal of the first amplifier to the second amplifier through the first capacitor is advanced by about 90 degrees.

Bias circuits and methods for silicon-based amplifier architectures that are tolerant of supply and bias voltage variations, bias current variations, and transistor stack height, and compensate for poor output resistance characteristics. Embodiments include power amplifiers and low-noise amplifiers that utilize a cascode reference circuit to bias the final stages of a cascode amplifier under the control of a closed loop bias control circuit. The closed loop bias control circuit ensures that the current in the cascode reference circuit is approximately equal to a selected multiple of a known current value by adjusting the gate bias voltage to the final stage of the cascode amplifier. The final current through the cascode amplifier is a multiple of the current in the cascode reference circuit, based on a device scaling factor representing the relative sizes of the transistor devices in the cascode amplifier and in the cascode reference circuit.

Bias circuits and methods for silicon-based amplifier architectures that are tolerant of supply and bias voltage variations, bias current variations, and transistor stack height, and compensate for poor output resistance characteristics. Embodiments include power amplifiers and low-noise amplifiers that utilize a cascode reference circuit to bias the final stages of a cascode amplifier under the control of a closed loop bias control circuit. The closed loop bias control circuit ensures that the current in the cascode reference circuit is approximately equal to a selected multiple of a known current value by adjusting the gate bias voltage to the final stage of the cascode amplifier. The final current through the cascode amplifier is a multiple of the current in the cascode reference circuit, based on a device scaling factor representing the relative sizes of the transistor devices in the cascode amplifier and in the cascode reference circuit.