A testing system includes: a signal generator arranged to generate a testing signal; a dividing circuit coupled to the signal generator for providing a plurality of input signals according to the testing signal; and a plurality of power-amplifier chips coupled to the dividing circuit for being tested by generating a plurality of output signals for a predetermined testing time according to the plurality of input signals respectively.

A radio frequency circuit includes: a first power amplifier capable of amplifying a first radio frequency signal and a second radio frequency signal each having a different frequency; and a second power amplifier capable of amplifying the second radio frequency signal. In a case where the first radio frequency signal and the second radio frequency signal are simultaneously transmitted, (i) under a condition that a sum of a bandwidth of the first radio frequency signal and a bandwidth of the second radio frequency signal is broader than or equal to a predetermined bandwidth, the first radio frequency signal is amplified by the first power amplifier, and the second radio frequency signal is amplified by the second power amplifier, and (ii) under a condition that the sum is narrower than the predetermined bandwidth, the first radio frequency signal and the second radio frequency signal are amplified by the first power amplifier.

A radio frequency module includes: a module board including first and second principal surfaces; first and second power amplifiers on the first principal surface; external-connection terminals on the second principal surface; and first and second via conductors connecting the first and second principal surfaces. The first and second via conductors are spaced apart in the module board, one end of the first via conductor is connected to a first ground electrode of the first power amplifier, the other end of the first via conductor is connected to a first external-connection terminal, one end of the second via conductor is connected to a second ground electrode of the second power amplifier, the other end of the second via conductor is connected to a second external-connection terminal, and the first and second via conductors each penetrate through the module board in a direction normal to the first and second principal surfaces.

Radio frequency (RF) front ends with integrated channel matching calibration are provided herein. In one aspect, a front end system includes: a plurality of front end amplification chains including transmit and receive chains for at least two radio frequency bands, each of the front end amplification chains configured to either transmit or receive radio frequency signals via one of a plurality of antennas, and each of the front end amplification chains includes an amplifier configured to receive a bias current and amplify the corresponding radio frequency signal based on the bias current, a control circuit configured to generate each of the bias currents, and a multiplexor configured to receive the bias currents and provide the bias currents to the corresponding amplifiers.

Embodiments include an electronic package that includes a radio frequency (RF) front end. In an embodiment, the RF front end may comprise a package substrate and a first die attached to a first surface of the package substrate. In an embodiment, the first die may include CMOS components. In an embodiment, the RF front end may further comprise a second die attached to the first surface of the package substrate. In an embodiment, the second die may comprise amplification circuitry. In an embodiment, the RF front end may further comprise an antenna attached to a second surface of the package substrate. In an embodiment, the second surface is opposite from the first surface.

An uplink multiple input-multiple output (MIMO) transmitter apparatus includes a transmitter chain that includes a sigma-delta circuit that creates a summed (sigma) signal and a difference (delta) signal from two original signals to be transmitted. These new sigma and delta signals are amplified by power amplifiers to a desired output level before having two signals reconstructed from the amplified sigma and amplified delta signals by a second circuit. These reconstructed signals match the two original signals in content but are at a desired amplified level relative to the two original signals. The reconstructed signals are then transmitted through respective antennas as uplink signals. By employing this uplink MIMO transmitter apparatus, it is possible to use smaller power amplifiers, which may reduce footprint, power consumption, and costs of the uplink MIMO transmitter apparatus.

Systems and apparatuses are disclosed that include an RF generator configured to generate RF signals having a wavelength. Amplifiers are configured to receive and amplify the RF signals from the RF generator and are separated from each other by a separation distance in a range between about 0.2 times the wavelength and about 10.0 times the wavelength. A power management system is configured to control one or more of the amplifiers based on information received that is associated with the RF signals.

A power amplifier circuit includes a first impedance transformer circuit arranged to connect with a carrier device, and a second impedance transformer circuit arranged to connect with a peaking device. Both the first and the second impedance transformer circuit include a parallel impedance transformer arrangement.

Disclosed are systems for adjusting bias power provided to a radio-frequency amplifier to one or more figures of merit based on sensed characteristics of the amplifier and/or characteristics of the input or output power. The systems may be used in terrestrial and satellite based communications and radar, among other possibilities.

Aspects of the disclosure include a wireless device comprising a module input to receive an input signal, a module output to provide an amplified output signal, a low-noise amplifier including an input amplification stage coupled to the input, and a plurality of output amplification stages switchably coupled to the input amplification stage, and a plurality of impedance-matching circuits, each impedance-matching circuit of the plurality of impedance-matching circuits having an input coupled to a respective output amplification stage and an output coupled to the module output.