One or more systems, devices and/or methods of use provided herein relate to a baseband filter that can be used in a current-mode end-to-end signal path. The current-mode end-to-end signal path can include a digital to analog converter (DAC) operating in current-mode and an upconverting mixer, operating in current-mode and operatively coupled to the DAC. In one or more embodiments, a device used in the signal path can comprise a baseband filter that receives an input current and outputs an output current. The baseband filter can comprise a feedback loop component having an active circuit branch and a passive circuit branch coupled in a loop. A mirroring device can be coupled to the feedback loop component and can provide an output of the device. Selectively activating the mirroring device can vary gain, such as of the mirroring device.

Amplifier having electrostatic discharge and surge protection circuit. In some embodiments, a radio-frequency integrated circuit can include an amplifier, a controller configured to control operation of the amplifier, and a clamp circuit configured to provide electrostatic discharge protection and surge protection for either or both of the amplifier and the controller. The clamp circuit can include a feedback combination clamp implemented to direct a current associated with either or both of an electrostatic discharge and a surge at a first node to a second node.

Systems and devices are provided for tracking bandgap current generated by a bandgap circuit and mitigation of leakage current regardless of variations in PVT conditions. An apparatus may include one or more power amplifiers that powers components of the apparatus and comprising a transistor. The apparatus may also include bandgap current mirroring circuitry that generates a mirrored current that mirrors a received current that is process, voltage, and temperature (PVT) independent. The apparatus may also include a bulk voltage generator circuit including an amplifier having an input coupled to the bandgap current mirroring circuitry. Bulk voltage control circuitry is coupled to an output of the amplifier and generates a bulk voltage based on the relationship between the mirrored current and the leakage current.

Concurrent electrostatic discharge and surge protection clamps in power amplifiers. In some embodiments, a semiconductor die can include a semiconductor substrate and an integrated circuit implemented on the semiconductor substrate. The integrated circuit can include a power amplifier and a controller. The semiconductor die can further include a clamp circuit implemented on the semiconductor substrate and configured to provide electrostatic discharge protection and surge protection for at least some of the integrated circuit.

A strain sensor is based on a self-biasing reference circuit that reaches an operating state that, at least at first order, is at least supply-voltage independent. The strain sensor provides an output signal that is defined by the operating state of the self-biasing reference circuit. At least one component in the self-biasing reference circuit has an electrical characteristic that depends on a strain to which the at least one component is subjected. This makes that the operating state of the self-biasing reference circuit depends on the strain. As a result, the output signal of the strain sensor varies as a function of the strain to which the at least one component is subjected.

Methods and apparatus for a signal isolator that mitigates the effects of CMTI strikes. In embodiments, a first die comprises a transmit module and the first die has a first voltage domain; and a second die comprises a receive module including a receive amplifier configured to receive from the transmit module a transmit signal that includes a differential signal and a common mode current. The second die may have a second voltage domain with the first and second die being separated by an isolation barrier. In embodiment, the receive amplifier includes a differential amplifier to receive the differential input signal from the transmit module; and a common mode module configured to sense the common mode current and sink or source the common mode current and minimize changes to an input impedance of the receive amplifier.

One or more systems, devices and/or methods of use provided herein relate to a device that can support a signal generation. A current-mode end-to-end signal path can include a digital to analog converter (DAC) operating in current-mode and an upconverting mixer, operating in current-mode and operatively coupled to the DAC. Analog inputs and outputs of the DAC and upconverting mixer can be represented as currents, and the DAC can generate a baseband signal. The DAC and upconverting mixer each can comprise switching transistors of the same type, such as p-type metal-oxide semiconductor (PMOS) switching transistors. In one or more embodiments, a current source and a diode-connected transistor can be arranged in parallel in the current-mode signal path, and the current source passes a static current, while the diode-connected transistor passes both a static current and a dynamic current.

A circuit for converting a first voltage to a second voltage in a communication system is disclosed. The circuit includes a pass transistor including a first terminal, a second terminal and a gate, wherein the first terminal is coupled with the first voltage. The circuit is also includes an error amplifier. The error amplifier includes a first input that is coupled with a constant reference voltage and a second input that is coupled with a first switch that is coupled with an output port. A second switch is included and is coupled between the first voltage and an output of the error amplifier. The output of the error amplifier is coupled with the gate of the pass transistor. A third switch is included and is coupled between ground and the output of the error amplifier. The second switch is configured to be driven by a first one shot pulse generated from an input signal of the communication system and the third switch is configured to be driven by a second one shot pulse generated from the input signal.

One aspect of this disclosure is a power amplifier module that includes a power amplifier, a semiconductor resistor, a tantalum nitride terminated through wafer via, and a conductive layer electrically connected to the power amplifier. The semiconductor resistor can include a resistive layer that includes a same material as a layer of a bipolar transistor of the power amplifier. A portion of the conductive layer can be in the tantalum nitride terminated through wafer via. The conductive layer and the power amplifier can be on opposing sides of a semiconductor substrate. Other embodiments of the module are provided along with related methods and components thereof.

A device includes an amplifier having inverting and non-inverting inputs and an output. The device includes a capacitor coupled to a first node and to ground, a resistor coupled to the first node and the amplifier output, and a first switch coupled to the first node and a current sink, which is coupled to ground. The device includes AND gate having inputs and an output coupled to control terminal of first switch. The device includes a first comparator having non-inverting and inverting inputs and an output coupled to an AND gate input; a second comparator having a non-inverting input coupled to the amplifier output, an inverting input coupled to a transistor stack, and an output coupled to an AND gate input; and a second switch coupled to the transistor stack and to a current source, the second switch having a control terminal coupled to the first comparator output.