A system may include control circuitry for detecting a plosive event associated with a microphone transducer and in response to the plosive event, causing restoration of acoustic sense operation of the microphone transducer and a processing circuit associated with the microphone transducer. A system for configuring a filter having at least two frequency response configurations to achieve an effective frequency response configuration intermediate to the at least two frequency response configurations may include control circuitry for rapidly switching between the at least two frequency response configurations such that a weighted average frequency response of the filter corresponds to the effective frequency response configuration.

Systems and methods described herein modify audio content on an electronic device. Embodiments can be configured to detect a mode of the electronic device to determine whether the device is in a telephone mode; receive a speech signal from a speech source while the device is in the telephone mode; and process the speech signal to improve the perceived quality of the speech at a recipient when the electronic device is in a telephone mode; wherein processing the speech signal to improve the perceived quality of the speech comprises, decreasing the signal level of audio content outside of a determined frequency band relative to the signal level of the audio content within the determined frequency band; and wherein the determined frequency band is a frequency band associated a vocal range of the anticipated speech content.

An electronic device includes a conductive lead, a semiconductor die, a package structure enclosing the semiconductor die and a portion of the conductive lead, and a non-conductive die attach film extending between the conductive lead and the semiconductor die and having a thickness less than 50 m. A method of fabricating an electronic device includes singulating portions of a non-conductive die attach film on a carrier, partially singulating prospective die areas from a front side of a wafer, removing wafer material from a back side of the wafer to separate a semiconductor die from the wafer, and attaching a backside the semiconductor die to a singulated portion of the non-conductive die attach film on the carrier.