A vibration device includes a semiconductor substrate having a first surface at which an integrated circuit is provided and a second surface that is a rear surface with respect to the first surface, which is a front surface, a vibration element disposed at the first surface, a lid having a recess that opens toward the first surface and a contact surface that is in contact with the first surface, the lid being bonded to the first surface via the contact surface, and a metal layer disposed between the first surface and the contact surface, and at least part of the integrated circuit overlaps with the metal layer in a plan view viewed in the direction of a normal to the first surface.

A vibrator device includes a semiconductor substrate which includes a first surface and a second surface and is provided with a through hole penetrating the first surface and the second surface, a semiconductor circuit which is disposed at the second surface side and includes a conductive layer exposed in the through hole, a first interconnection which is disposed on an inner circumferential surface of the through hole and is electrically coupled to the conductive layer, a second interconnection which is disposed on the first surface and includes an interconnection layer smaller in surface roughness than the first interconnection and a covering layer covering the interconnection layer, and a vibrator which is located at the first surface side and is bonded to the second interconnection via a bonding member.

A composite filter device includes a piezoelectric substrate, a transmission filter, a reception filter, a first capacitance element, and a second capacitance element. The transmission filter includes a first parallel arm resonator connected to a first reference potential electrode. The reception filter includes a second parallel arm resonator connected to a second reference potential electrode. The first capacitance element is connected between a signal line in the reception filter and the first reference potential electrode. The second capacitance element is connected to the signal line and the second reference potential electrode in the reception filter.

A resonator device includes a base and a resonator component disposed on the base. The base includes a semiconductor substrate having a first surface and a second surface that are in a front-to-back relation with each other; an integrated circuit that includes a wiring layer disposed at the second surface side and including a connection pad and includes an insulating layer disposed between the second surface and the wiring layer; a through electrode that penetrates the semiconductor substrate and the insulating layer and is coupled to the connection pad; and an annular metal layer that is disposed so as to penetrate the insulating layer between the second surface and the wiring layer and surrounds the through electrode in a plan view of the semiconductor substrate.

A resonator device includes a semiconductor substrate having a through hole, a resonator element provided to the semiconductor substrate, a lid which is bonded to an outer circumferential portion of a first surface of the semiconductor substrate and is configured to house the resonator element between the lid and the first surface, an oscillation circuit which is disposed on the first surface and is configured to oscillate the resonator element, a terminal disposed on a second surface of the semiconductor substrate, and a through electrode which is provided to the through hole and is configured to electrically couple the terminal and the oscillation circuit, wherein the through electrode is disposed closer to the outer circumferential portion than to a center of the first surface in a plan view of the semiconductor substrate.

A vibration device includes a base having a first surface and a second surface that is in a front-back relationship with the first surface, a vibrator disposed at the first surface, and a lid having a first recess that opens toward the first surface, a third surface that is the bottom surface of the first recess, and a fourth surface that is in a front-back relationship with the third surface, the lid being so bonded to the first surface that the vibrator is encapsulated in the first recess, and the lid has a second recess that is part of the third surface recessed toward the fourth surface and includes a diaphragm formed of the bottom surface of second recess and the fourth surface.

A microelectromechanical resonator device has: a main body, with a first surface and a second surface, opposite to one another along a vertical axis, and made of a first layer and a second layer, arranged on the first layer; a cap, having a respective first surface and a respective second surface, opposite to one another along the vertical axis, and coupled to the main body by bonding elements; and a piezoelectric resonator structure formed by: a mobile element, constituted by a resonator portion of the first layer, suspended in cantilever fashion with respect to an internal cavity provided in the second layer and moreover, on the opposite side, with respect to a housing cavity provided in the cap; a region of piezoelectric material, arranged on the mobile element on the first surface of the main body; and a top electrode, arranged on the region of piezoelectric material, the mobile element constituting a bottom electrode of the piezoelectric resonator structure.

The piezoelectric vibration plate includes a piezoelectric substrate, a first driving electrode and a second driving electrode formed on main surfaces on both sides of the piezoelectric substrate, and a first mounting terminal and a second mounting terminal respectively connected to the first driving electrode and the second driving electrode. The first and second mounting terminals each have a metal film for mounting purpose formed on the piezoelectric substrate and a metal film for driving purpose formed on the metal film for mounting purpose. The metal films for mounting purpose each include a solder-resistant metal film. The metal films for driving purpose are formed in continuity with the first and second driving electrodes and constitute the first and second driving electrodes.

A method for manufacturing a vibration element includes, a base film forming step of forming a first base film at a first substrate surface of a quartz crystal substrate in first and second vibrating arm forming regions, a protective film forming step of forming a first protective film in a bank portion forming region of the first base film, and a dry-etching step of dry-etching the quartz crystal substrate through the first base film and the first protective film.

Metal films for first and second mounting terminals are formed at ends on both sides of a piezoelectric vibration plate across a vibrating portion, and first and second mounting terminals connected to these metal films are formed on outer surfaces of resin films adhered to the piezoelectric vibration plate. In case the metal films for first and second mounting terminals on both sides of the vibrating portion are desirably reduced in size in order to enlarge the vibrating portion, an adequate joining area for mounting purpose is still secured for the first and second mounting terminals formed on the outer surfaces of the resin films.