Patent classifications
H03H2003/022
Vibrator device, method of manufacturing vibrator device, electronic apparatus, and vehicle
A vibrator device including a vibrator element, an IC substrate including a semiconductor substrate configured of a semiconductor having a first conductive type and a circuit electrically coupled to the vibrator element, the first conductive type being any one of an N-type and a P-type, and a lid directly bonded to the semiconductor substrate and configured of a semiconductor having the first conductive type.
Vibrator device, vibrator module, and electronic apparatus
A vibrator device includes a base, a vibrator element attached to the base, and a lid housing the vibrator element between the base and itself and bonded to the base. The base has a semiconductor substrate including a first surface bonded to the lid and a second surface in a front-back relationship with the first surface, a first insulating layer placed on the first surface, first, second internal terminals placed on the first insulating layer and electrically coupled to the vibrator element, a second insulating layer placed on the second surface, and first, second external terminals placed on the second insulating layer and electrically coupled to the first, second internal terminals. The second insulating layer has a first external terminal region in which the first external terminal is placed and a second external terminal region separated from the first external terminal region, in which the second external terminal is placed.
Vibration Device And Method For Manufacturing Vibration Device
A vibration device includes a base having a first surface and a second surface that is in a front-back relationship with the first surface, a vibrator disposed at the first surface, and a lid having a first recess that opens toward the first surface, a third surface that is the bottom surface of the first recess, and a fourth surface that is in a front-back relationship with the third surface, the lid being so bonded to the first surface that the vibrator is encapsulated in the first recess, and the lid has a second recess that is part of the third surface recessed toward the fourth surface and includes a diaphragm formed of the bottom surface of second recess and the fourth surface.
PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD OF THE SAME
A piezoelectric device includes a conductive adhesive, a container, and an AT-cut crystal element. The AT-cut crystal element has at least one side surface intersecting with a Z′-axis of the crystallographic axis of the crystal constituted of three surfaces. When a dimension of a straight-line portion along the Z′-axis of a second side opposed to the first side is expressed as W1 and a dimension along the Z′-axis of the AT-cut crystal element is expressed as W0, W1/W0 is 0.91 or greater, and the straight-line portion has both sides constituting corner portions in approximately right angles with sides along an X-axis of the crystal of the AT-cut crystal element. The side of the first side is at a −X-side in an X-axis of the crystallographic axis of the crystal and a side of the second side is at a +X-side in the X-axis.
VIBRATOR AND OSCILLATOR
A vibrator includes: a vibration element that includes a pair of first excitation electrodes formed at the first vibration portion, a pair of second excitation electrodes formed at the second vibration portion, and a pair of third excitation electrodes formed at the third vibration portion, in which one second excitation electrode of the pair of second excitation electrodes is formed at a first inclined surface that is inclined with respect to two main surfaces, and one third excitation electrode of the pair of third excitation electrodes is formed at a second inclined surface that is inclined with respect to the two main surfaces and the first inclined surface; and a package that houses the vibration element. The vibration element includes a fixing portion to be fixed to the package. The fixing portion is provided between the first vibration portion and the second and third vibration portions.
Quartz crystal device
A quartz crystal device includes a crystal element, a container, a conductive adhesive having flexibility, first pillow portions, and a second pillow portion. The first pillow portions hold the crystal element floated from an inner bottom surface of the container at the proximities of the two positions. The second pillow portion opposes the crystal element at a proximity of a second side. The second side opposes the first side of the crystal element. A height of the first pillow portion is represented as h and a length of the first pillow portion in a direction perpendicular to the first side is represented as X1, where the h is 20 μm to 50 μm and the X1 is 150 μm or less. The conductive adhesive covers at least a top surface and a side surface of the first pillow portion. The side surface is in a center side of the crystal element.
Piezoelectric resonator unit and method for manufacturing the piezoelectric resonator unit
A quartz crystal resonator unit that includes a quartz crystal resonator, a lid member and a base member defining an internal space that accommodates the quartz crystal resonator, and a sealing frame and a joining material joining the lid member and the base member to each other. In a plan view of a principal surface of the base member, the sealing frame and the joining material have a frame shape surrounding the quartz crystal resonator, and the frame shape has a uniform width.
Ultra high frequency and tunable carbon nanotube resonator
A carbon nanotube (CNT) resonator includes: a first CNT having a first end and a second end both fixed to a substrate; and a second CNT having a first end fixed to the substrate. The second CNT creates a Van der Waals (VdW) bond with the first CNT where the second CNT overlaps the first CNT. A length of the VdW bond along a distance between the first and the second CNTs oscillates based on a DC voltage applied between the first end of the first CNT and the first end of the second CNT. An electrical current passing through the first and the second CNTs using the VdW bond oscillates based on the oscillation of the length of the VdW bond.
VIBRATION ELEMENT, VIBRATOR, AND METHOD FOR PRODUCING VIBRATION ELEMENT
A vibrator, a vibrating element and a method for producing the vibrating element may include vibrating piece having a central portion and a peripheral portion. The vibrator, the vibrating element and the method may further include a pair of excitation electrodes provided on a first side and a second side of a main surface of the central portion. The vibrator, the vibrating element and the method may further include a pair of connection electrodes provided on the peripheral portion and electrically connected to the pair of excitation electrodes. The vibrator, the vibrating element and the method may further include a substrate configured to be connected to the pair of connection electrodes via an electrically-conductive holding member interposed therebetween and configured to support the vibration element in an excitable manner.
METHOD OF MANUFACTURING QUARTZ CRYSTAL ELEMENT
A method of manufacturing a quartz crystal element includes the steps of preparing a quartz crystal wafer which has a predetermined cutting angle with respect to a crystal axis of a quartz crystal, and which has a first surface and a second surface having an obverse-reverse relationship, forming a first resist film on the first surface, the first resist film having a first tilted part tilted with respect to the first surface, and being dry-etched together with the quartz crystal, forming a first tilted surface tilted with respect to the first surface by dry-etching the quartz crystal wafer from the first surface side, forming a second resist film on the second surface, the second resist film having a second tilted part tilted with respect to the second surface, and being dry-etched together with the quartz crystal, and forming a second tilted surface tilted with respect to the second surface by dry-etching the quartz crystal wafer from the second surface side, wherein the quartz crystal element which is provided with the first tilted surface and the second tilted surface, and which has a cutting angle different from the predetermined cutting angle is formed.