H03H2003/023

Solidly-mounted transversely excited film bulk acoustic resonator using rotated Y-X cut lithium niobate

Acoustic resonator devices, filters, and methods are disclosed. An acoustic resonator device includes a substrate, a single-crystal lithium niobate plate, an acoustic Bragg reflector sandwiched between a surface of the substrate and a back surface of the lithium niobate plate, wherein the acoustic Bragg reflector includes a plurality of layers alternating between high acoustic impedance layers and low acoustic impedance layers, wherein all of the plurality of layers are dielectric materials, and wherein the high acoustic impedance layers are one of silicon nitride and aluminum nitride and the low acoustic impedance layers are carbon-containing silicon oxide, and an interdigital transducer (IDT) formed on a front surface of the lithium niobate plate. Euler angles of the lithium niobate plate are [0°, β, 0°], where β is greater than or equal to 0° and less than or equal to 60°.

Transversely-excited film bulk acoustic resonator with reduced spurious modes

Acoustic filters, resonators and methods are disclosed. An acoustic resonator device includes a substrate having a surface. A back surface of a single-crystal piezoelectric plate is attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. A conductor pattern is formed on the front surface of the piezoelectric plate, the conductor pattern including an interdigital transducer (IDTs), interleaved fingers of the IDT disposed on the diaphragm. A pitch of the interleaved fingers and a mark of the interleaved fingers are set in combination such that a resonance frequency of the acoustic resonator is equal to a predetermined target frequency.

Film bulk acoustic resonator fabrication method

Methods of fabricating acoustic resonators are disclosed. A back surface of a piezoelectric plate is bonded to a surface of a substrate. Thickness measurements are made at a plurality of positions on the piezoelectric plate. Excess material is removed from the front surface of the piezoelectric plate in accordance with the thickness measurements to improve a thickness uniformity of the piezoelectric plate. A conductor pattern is formed on the front surface, the conductor pattern including a plurality of interdigital transducers (IDTs) of a plurality of resonators. Cavities are formed in the substrate such that portions of the single-crystal piezoelectric plate form a plurality of diaphragms spanning respective cavities, wherein interleaved fingers of each IDT of the plurality of IDTs are disposed on a respective one of the plurality of diaphragms.

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH MULTIPLE DIAPHRAGM THICKNESSES AND FABRICATION METHOD
20210313963 · 2021-10-07 ·

Filter devices and methods are disclosed. A filter device includes a substrate and a piezoelectric plate attached to the substrate, the piezoelectric plate forming diaphragms spanning respective cavities in the substrate. A first portion of the piezoelectric plate has a first thickness. A front surface of a second portion of the piezoelectric plate is recessed relative to a front surface of the first portion of the piezoelectric plate such that the second portion of the piezoelectric plate has a second thickness less than the first thickness. A conductor pattern is formed on the front surfaces of the first and second portions of the piezoelectric plate. The conductor pattern includes a first interdigital transducer (IDT) with interleaved fingers on a diaphragm having the first thickness, and a second IDT with interleaved fingers on a diaphragm having the second thickness.

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH REDUCED SPURIOUS MODES

Acoustic filters, resonators and methods of making acoustic filters are disclosed. An acoustic resonator device includes a substrate. A back surface of a piezoelectric plate is attached to the substrate, a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. A conductor pattern is formed on the front surface of the piezoelectric plate, the conductor pattern including an interdigital transducer (IDTs) with interleaved fingers of the IDT disposed on the diaphragm. A ratio of the mark of the interleaved fingers to the pitch of the interleaved fingers is greater than or equal to 0.2 and less than or equal to 0.3.

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH REDUCED SPURIOUS MODES

Acoustic filters, resonators and methods are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate including a diaphragm that spans a cavity in the substrate. A conductor pattern includes an interdigital transducer (IDT) with interleaved parallel fingers on the diaphragm. A ratio of a width of either of two adjacent parallel fingers and a center-to-center spacing between the two adjacent parallel fingers is greater than or equal to 0.2 and less than or equal to 0.3.

TRANSVERSELY-EXCITED FILM BULK ACOUSTIC RESONATOR WITH REDUCED SPURIOUS MODES

Acoustic filters, resonators and methods are disclosed. An acoustic resonator includes a substrate and a piezoelectric plate includes a diaphragm that spans a cavity in the substrate. A conductor pattern includes an interdigital transducer (IDT) with interleaved parallel fingers on the diaphragm. A center-to-center spacing between two adjacent parallel fingers is greater than or equal to 2.5 times a thickness of the diaphragm and less than or equal to 15 times the diaphragm thickness.

Transversely-excited film bulk acoustic resonator

Acoustic resonator devices and filters are disclosed. An acoustic resonator includes a substrate having a surface and a single-crystal piezoelectric plate having parallel front and back surfaces, the back surface attached to the surface of the substrate except for a portion of the piezoelectric plate forming a diaphragm that spans a cavity in the substrate. An interdigital transducer (IDT) is formed on the front surface of the single-crystal piezoelectric plate such that interleaved fingers of the IDT are disposed on the diaphragm. The IDT is configured to excite a primary acoustic mode in the diaphragm in response to a radio frequency signal applied to the IDT. A direction of acoustic energy flow of the primary acoustic mode is substantially orthogonal to the front and back surfaces of the diaphragm. The diaphragm is contiguous with the piezoelectric plate around at least 50% of a periphery of the diaphragm.

Front end module for 5.5 GHz Wi-Fi acoustic wave resonator RF filter circuit

A front end module (FEM) for a 5.5 GHz Wi-Fi acoustic wave resonator RF filter circuit. The device can include a power amplifier (PA), a 5.5 GHz resonator, and a diversity switch. The device can further include a low noise amplifier (LNA). The PA is electrically coupled to an input node and can be configured to a DC power detector or an RF power detector. The resonator can be configured between the PA and the diversity switch, or between the diversity switch and an antenna. The LNA may be configured to the diversity switch or be electrically isolated from the switch. Another 5.5 GHZ resonator may be configured between the diversity switch and the LNA. In a specific example, this device integrates a 5.5 GHz PA, a 5.5 GHZ bulk acoustic wave (BAW) RF filter, a single pole two throw (SP2T) switch, and a bypassable LNA into a single device.

POLARITY PATTERNED PIEZOELECTRIC FILM
20210288627 · 2021-09-16 ·

A piezoelectric device includes a foundation structure and a plurality of metal islands distributed over a first area of a top surface of the foundation structure. A piezoelectric film resides over the foundation structure and is formed from a piezoelectric material. The piezoelectric film has a non-piezoelectric portion over the first area and a piezoelectric portion over a second area of the top surface of the foundation structure. Within the non-piezoelectric portion, the piezoelectric film is polarity patterned to have pillars and a mesh. The pillars of the piezoelectric material have a first polar orientation residing over corresponding ones of the plurality of metal islands. The mesh of the piezoelectric material has a second polar orientation, which is opposite that of the first polar orientation, and surrounds the pillars. In one embodiment, the metal islands are self-assembled islands.