A method of manufacturing a piezoelectric resonator unit that includes mounting a piezoelectric resonator on a base member using a conductive adhesive, keeping the piezoelectric resonator in an environment having a temperature and a humidity higher than those of a surrounding region for a predetermined time, performing frequency adjustment of the piezoelectric resonator by etching using an ion beam, and joining a lid member to the base member using a joining material such that the piezoelectric resonator is hermetically sealed between the lid member and the base member.

A method of manufacturing a piezoelectric resonator unit that includes mounting a piezoelectric resonator on a base member using a conductive adhesive, keeping the piezoelectric resonator in an environment having a temperature and a humidity higher than those of a surrounding region for a predetermined time, performing frequency adjustment of the piezoelectric resonator by etching using an ion beam, and joining a lid member to the base member using a joining material such that the piezoelectric resonator is hermetically sealed between the lid member and the base member.

A resonator device includes a base substrate including a principal surface, a side surface, and an inclined surface that couples the principal surface to the side surface and that is inclined with respect to the principal surface and the side surface, a resonator element arranged on the principal surface of the base substrate, and a lid that is bonded to the principal surface of the base substrate and accommodates the resonator element between the lid and the base substrate. A bonding area in which the base substrate and the lid are bonded is positioned inside an outer edge of the principal surface.

A resonator device includes a base substrate including a principal surface, a side surface, and an inclined surface that couples the principal surface to the side surface and that is inclined with respect to the principal surface and the side surface, a resonator element arranged on the principal surface of the base substrate, and a lid that is bonded to the principal surface of the base substrate and accommodates the resonator element between the lid and the base substrate. A bonding area in which the base substrate and the lid are bonded is positioned inside an outer edge of the principal surface.

A method for the batch production of acoustic wave filters comprises: synthesizing N theoretical filters, each filter defined by a set of j theoretical resonator(s) having a triplet C.sub.0ij,eq, .sub.rij,eq and .sub.aij,eq, these parameters grouped into subsets; determining a reference resonator structure for each subset, naturally having a resonant frequency .sub.r,ref, where .sub.aij,eq<.sub.r,ref<.sub.rij,eq; determining, for each theoretical resonator, an elementary building block comprising an intermediate resonator R.sub.ij, a parallel reactance Xp.sub.ij and/or a series reactance Xs.sub.ij, the intermediate resonator R.sub.ij having a triplet C.sub.0ij, .sub.r,ref and .sub.a,ref, the parameters C.sub.0ij, Xpij and/or Xs.sub.ij defined so the elementary building block has a triplet: C.sub.0ij,eq, .sub.rij,eq and .sub.aij,eq; determining the geometrical dimensions of the actual resonators R.sub.ij of the filters so they have a capacitance C.sub.0ij; producing each actual resonator; associating series and/or parallel reactances with actual resonators in order to form the elementary building blocks.

A method for the batch production of acoustic wave filters comprises: synthesizing N theoretical filters, each filter defined by a set of j theoretical resonator(s) having a triplet C.sub.0ij,eq, .sub.rij,eq and .sub.aij,eq, these parameters grouped into subsets; determining a reference resonator structure for each subset, naturally having a resonant frequency .sub.r,ref, where .sub.aij,eq<.sub.r,ref<.sub.rij,eq; determining, for each theoretical resonator, an elementary building block comprising an intermediate resonator R.sub.ij, a parallel reactance Xp.sub.ij and/or a series reactance Xs.sub.ij, the intermediate resonator R.sub.ij having a triplet C.sub.0ij, .sub.r,ref and .sub.a,ref, the parameters C.sub.0ij, Xpij and/or Xs.sub.ij defined so the elementary building block has a triplet: C.sub.0ij,eq, .sub.rij,eq and .sub.aij,eq; determining the geometrical dimensions of the actual resonators R.sub.ij of the filters so they have a capacitance C.sub.0ij; producing each actual resonator; associating series and/or parallel reactances with actual resonators in order to form the elementary building blocks.

A piezoelectric vibration member that includes a substrate having a main surface on or in which a piezoelectric vibration member is mounted, a lid having a recess that is open so as to face the main surface and which includes a flange portion that projects outward from an opening edge of the recess, and a bonding layer that bonds the substrate and the lid together so as to hermetically seal the piezoelectric vibrator in a space between the recess and the main surface. The surface roughness of a side surface of the flange portion is greater than the surface roughness of the surface of the recess, and the bonding layer extends from the main surface of the substrate to the side surface of the flange portion.

A piezoelectric vibration member that includes a substrate having a main surface on or in which a piezoelectric vibration member is mounted, a lid having a recess that is open so as to face the main surface and which includes a flange portion that projects outward from an opening edge of the recess, and a bonding layer that bonds the substrate and the lid together so as to hermetically seal the piezoelectric vibrator in a space between the recess and the main surface. The surface roughness of a side surface of the flange portion is greater than the surface roughness of the surface of the recess, and the bonding layer extends from the main surface of the substrate to the side surface of the flange portion.

An acoustic resonator includes a first electrode disposed over a substrate; a piezoelectric layer disposed over the first electrode; a second electrode disposed over the piezoelectric layer; and a ring disposed in either the first electrode, or in the second electrode. The ring defines at least a portion of a perimeter along an active region of the acoustic resonator.

An acoustic resonator includes a first electrode disposed over a substrate; a piezoelectric layer disposed over the first electrode; a second electrode disposed over the piezoelectric layer; and a ring disposed in either the first electrode, or in the second electrode. The ring defines at least a portion of a perimeter along an active region of the acoustic resonator.