A filter circuit includes a first inductor circuit connected in series with a second inductor circuit, and a first capacitor circuit connected in series with a second capacitor circuit. The first inductor circuit and the second inductor circuit are connected between a first input/output port and a second input/output port of the filter circuit. A third inductor circuit is connected between a reference node and a first node that is between the first inductor circuit and the second inductor circuit. A resonator circuit is connected to a second node between the first capacitor circuit and the second capacitor circuit. A fourth inductor circuit is connected between the resonator circuit and the reference node. In some embodiments, another resonator circuit is connected between the input port and the output port of the filter circuit.

A filter device includes a body, a ground terminal, and resonators in the body and coupled to each other by electromagnetic field coupling. The resonators include a first resonator coupled to an input terminal, a second resonator coupled to an output terminal, and third and fourth resonators. The second resonator is adjacent to the first resonator in a first direction. The third resonator is adjacent to the first resonator in a second direction perpendicular to the first direction. The fourth resonator is adjacent to the third resonator in the first direction. The third and fourth resonators partially share a path to the ground terminal.

A filter device includes a multilayer body in which multiple dielectric layers are stacked, a ground terminal, and a first LC parallel resonator, a second LC parallel resonator, and a third LC parallel resonator located in the multilayer body and magnetically coupled to each other. The first LC parallel resonator includes a first conductor, the second LC parallel resonator includes a second conductor, and the third LC parallel resonator includes a third conductor. The filter device further includes a connection conductor on a layer different from a layer on which the second conductor is located, a first via including one end connected to the first conductor and another end connected to the connection conductor, and a second via including one end connected to the third conductor and another end connected to the connection conductor. The connection conductor includes a first region that overlaps a portion of the second conductor in plan view of the multilayer body seen in a stacking direction.

A coil component includes a first coil and a second coil that are magnetically coupled to each other. The coil component includes a multilayer body, first wiring patterns, second wiring patterns, and third wiring patterns. The first coil includes a portion in which the first wiring patterns and the third wiring patterns are electrically connected to each other by a first via conductor and a second via conductor through the first wiring patterns and the third wiring pattern to connect the wiring patterns in parallel. The second coil includes a portion in which the second wiring patterns and the third wiring patterns are electrically connected to each other by a third via conductor and a fourth via conductor through the second wiring patterns and the third wiring pattern to connect the wiring patterns in parallel.

A multilayer fringe capacitor includes first and second interdigitated capacitor electrodes, both parallel to and intersecting a first planar surface; third and fourth interdigitated capacitor electrodes, the first and second electrodes parallel to and separated by a non-zero distance from the third and fourth electrodes; a first set of coupling vias that electrically couples the first electrode to the third electrode; and a second set of coupling vias that electrically couples the second electrode to the fourth electrode.

A high-frequency module includes a semiconductor chip device that is mounted on an external circuit substrate by wire bonding. A switch forming section, a power amplifier forming section and a low noise amplifier forming section, realized by a group of FETs, which are active elements, are formed in the semiconductor chip device. Flat plate electrodes, which form capacitors are formed in the semiconductor chip device. Conductor wires that connect the external circuit substrate and the semiconductor chip device function as inductors. A group of passive elements that includes inductors and capacitors is formed. As a result, a high-frequency module that can be reduced in size while still obtaining the required transmission characteristic is realized.

A termination/attenuation network applies to an input of a set-top box a MOCA channel signal having a narrow band of frequencies and included in RF signals having a wide band of frequencies received via a cable from a satellite antenna. The network includes a pair of series resistors and a parallel resistor coupled to a junction terminal between the pair of series resistors in a T-shaped configuration. A series-pass band-pass filter (L1, C2) bypasses the pair of series resistors and a parallel band stop filter (L2, C1) decouples the parallel resistor at the frequency band of the MOCA channel signal for selectively reducing attenuation at the frequency band of the MOCA channel signal.

Examples are disclosed herein that relate to driving a resonant scanning mirror system using a linear LC resonant driving scheme. In one example, a resonant scanning mirror system includes a scanning mirror, first and second mirror drive elements, and a drive circuit to drive the scanning mirror at a resonant frequency. The drive circuit includes one or more signal sources configured to create a first source signal and a second source signal that is 180 degrees out of phase with the first source signal. The drive circuit further includes a buffer stage configured to receive the first and second source signals and output first and second drive signals, a first resonant LC stage configured to amplify the first drive signal for provision to the first mirror drive element, and a second resonant LC stage configured to amplify the second drive signal for provision to the second mirror drive element.

A composite electronic component includes a multilayered body in which a plurality of dielectric layers and a plurality of conductor layers are alternately stacked, a first resonant circuit including a first line and a first capacitor, the first line being formed of one or more first conductor layers of the conductor layers, the first capacitor including a first electrode formed of a plurality of second conductor layers of the conductor layers, and a second resonant circuit including a second line and a second capacitor, the second line being formed of one or more third conductor layers of the conductor layers, the second capacitor including a second electrode formed of the second conductor layers, the second conductor layers being located between the one or more first conductor layers and the one or more third conductor layers.

A package for a tunable filter is disclosed. In an embodiment, the tunable filter includes a substrate having a first interconnection plane and a semiconductor device assembled on the substrate in a first component plane, the semiconductor device electrically connected to the first interconnection plane and containing tunable passive components. The filter further includes a control unit arranged in the first component plane, a dielectric layer arranged above the first component plane, a second component plane arranged on the dielectric layer and discrete passive devices arranged in the second component plane and interconnected with the semiconductor device, wherein the tunable passive components are tunable by the control unit.