An LC composite component includes a multilayer body including insulating base members that are laminated and include insulating base members on which conductor patterns are provided. Capacitor conductor patterns are provided on insulating base members different from an insulating base member on which a coil conductor pattern is provided, and each include an extending portion overlapping with a line segment connecting a center of a first terminal and a center of a second terminal in a shortest distance as viewed in the lamination direction and projecting portions projecting in directions different from the direction of the line segment, and the projecting portions overlap with linear portions of the coil conductor pattern without overlapping with bent portions thereof as viewed in the lamination direction.

A band-pass filter includes a first input/output port, a second input/output port, a first high-pass filter, a first low-pass filter, and a first stub resonator. The first stub resonator includes a first distributed constant line. The first low-pass filter is provided between the first input/output port and the first high-pass filter in the circuit configuration. The first distributed constant line has a first end connected to a first path connecting the first input/output port and the first low-pass filter, and a second end closest to a ground in the circuit configuration.

An LC filter includes a first capacitor electrode connected to one end of a first via conductor and faces a first ground electrode in a laminating direction. A second capacitor electrode is connected to one end of a second via conductor and faces the first ground electrode in the laminating direction. A third capacitor electrode is connected to one end of a third via conductor and faces the first ground electrode in the laminating direction. A fourth capacitor electrode is connected to one end of a fourth via conductor and faces the first ground electrode in the laminating direction. The second capacitor electrode faces each of the first capacitor electrode, the third capacitor electrode, and the fourth capacitor electrode in a direction orthogonal or substantially orthogonal to the laminating direction.

An LC filter includes a first electrode connected to a first via conductor between two ends of the first via conductor, a second electrode connected to a second via conductor between two ends of the second via conductor, a third electrode connected to a third via conductor between two ends of the third via conductor, and a fourth electrode connected to a fourth via conductor between two ends of the fourth via conductor. In a plan view viewed from the laminating direction, the second via conductor and the fourth via conductor are disposed on two sides of a virtual line connecting the first via conductor and the third via conductor, respectively. The second electrode faces the first electrode and the third electrode.

Aspects of this disclosure relate to a band pass filter that includes LC resonant circuits coupled to each other by a capacitor. A bridge capacitor can be in parallel with series capacitors, in which the series capacitors include the capacitor coupled between the LC resonant circuits. The bridge capacitor can create a transmission zero at a frequency below the passband of the band pass filter. The LC resonant circuits can each include a surface mount capacitor and a conductive trace of the substrate, and an integrated passive device die can include the capacitor. Band pass filters disclosed herein can be relatively compact, provide relatively good out-of-band rejection, and relatively low loss.

An electronic component includes a common port, a signal port, a first inductor, a second inductor, and a stack. The first inductor has a first end and a second end. The second end of the first inductor is connected to one end of the second inductor. A first inductor conductor constituting the first inductor is wound about an axis extending in a first direction. A second inductor conductor constituting the second inductor is wound about an axis extending in a second direction intersecting the first direction.

An adjustable rejection circuit with tunable impedance circuit is disclosed. In particular, a circuit is provided with an impedance tuner configured to match impedances for an antenna. The impedance tuner may include an LC circuit (inductor-capacitor circuit) with one or more elements of the LC circuit being variable. An adjustable rejection circuit may be placed in parallel with the impedance tuner. The adjustable rejection circuit may include a variable negative capacitance element that provides strong attenuation in frequencies of interest.

An adjustable rejection circuit with tunable impedance circuit is disclosed. In particular, a circuit is provided with an impedance tuner configured to match impedances for an antenna. The impedance tuner may include an LC circuit (inductor-capacitor circuit) with one or more elements of the LC circuit being variable. An adjustable rejection circuit may be placed in parallel with the impedance tuner. The adjustable rejection circuit may include a variable negative capacitance element that provides strong attenuation in frequencies of interest.

A filter device includes a filter including at least one inductor and at least one capacitor, and a stack of a plurality of dielectric layers and a plurality of conductor layers. The plurality of dielectric layers include at least one first dielectric layer formed of a first dielectric material and at least one second dielectric layer formed of a second dielectric material. The plurality of conductor layers include at least one first conductor layer in contact with the at least one first dielectric layer, and at least one second conductor layer in contact with the at least one second dielectric layer. The temperature coefficient of resonant frequency of the first dielectric material has a positive value. The temperature coefficient of resonant frequency of the second dielectric material has a negative value.

A filter device includes a first port, a second port, a first high-pass filter, a first low-pass filter, and a stack. The first high-pass filter includes a first inductor. The first low-pass filter includes a first inductor. At least one second conductor layer constituting the first inductor of the first low-pass filter is located between at least one first conductor layer constituting the first inductor of the first high-pass filter and a ground conductor layer in a stacking direction.