According to some embodiments, an on-chip diplexer circuit is disclosed. The on-chip diplexer circuit includes a LC resonator module, the LC resonator module further comprises a first port, a first LC resonator unit and a second LC resonator unit; a first filter unit, the first filter unit is electrically connected to the first LC resonator unit in the LC resonator module, and the first filter unit is electrically connected to a second port; and a second filter unit, the second filter unit is electrically connected to the second LC resonator unit in the LC resonator module, and the second filter unit is electrically connected to a third port. According to some embodiments, the first LC resonator unit serves as an impedance matching circuit for a first signal having a first resonant frequency and serves as an open circuit for a second signal having a second resonant frequency that is different from the first resonant frequency; the second LC resonator unit serves as an impedance matching circuit for the second signal having the second resonant frequency and serves as an open circuit for the first signal having the first resonant frequency. The first filter unit passes signals with the first resonant frequency; and the second filter unit passes signals with the second resonant frequency.

The present invention includes a method for creating a system in a package with integrated lumped element devices is system-in-package (SiP) or in photo-definable glass, comprising: masking a design layout comprising one or more electrical components on or in a photosensitive glass substrate; activating the photosensitive glass substrate, heating and cooling to make the crystalline material to form a glass-crystalline substrate; etching the glass-crystalline substrate; and depositing, growing, or selectively etching a seed layer on a surface of the glass-crystalline substrate on the surface of the photodefinable glass, wherein the integrated lumped element devices reduces the parasitic noise and losses by at least 25% from a package lumped element device mount to a system-in-package (SiP) in or on photo-definable glass when compared to an equivalent surface mounted device.

A motor vehicle with at least one energizable active current line, which at least sometimes carries an active current for the operation of at least one electrical consumer. At least one attenuation line layout is coupled by way of an inductive coupling to the energizable active current line in such a way that, in a protection area spaced apart from the active current line and the attenuation line layout, a magnetic field generated by the active current and/or a perturbation superimposed on the active current and/or a leakage current produced by the active current is attenuated by current flow induced in the attenuation line layout.

An electronic component includes: a first conductor extending in one direction; a second conductor extending in the one direction; a first inductor conductor bridged so as to linearly extend between an end portion of the first conductor in its extending direction and an end portion of the second conductor in its extending direction; a connecting conductor that extends in the one direction and has a first end portion and a second end portion in its extending direction, the first end portion being connected to the first inductor conductor and being located between the first conductor and the second conductor; and a capacitor pad electrically connected to the second end portion of the connecting conductor.

A semiconductor device capable of reducing in size thereof and suppressing degradation in the characteristics of circuit components is provided. The semiconductor device includes an LC circuit comprised of a spiral inductor provided over a semiconductor substrate and a capacitive element coupled with the spiral inductor. The spiral inductor includes a central area encircled with a metal wiring and a peripheral area other than the central area. The capacitive element is formed in an upper-layer or a lower-layer position corresponding to the peripheral area other than the central area.

According to some embodiments, an on-chip diplexer circuit is disclosed. The on-chip diplexer circuit includes a LC resonator module, the LC resonator module further comprises a first port, a first LC resonator unit and a second LC resonator unit; a first filter unit, the first filter unit is electrically connected to the first LC resonator unit in the LC resonator module, and the first filter unit is electrically connected to a second port; and a second filter unit, the second filter unit is electrically connected to the second LC resonator unit in the LC resonator module, and the second filter unit is electrically connected to a third port. According to some embodiments, the first LC resonator unit serves as an impedance matching circuit for a first signal having a first resonant frequency and serves as an open circuit for a second signal having a second resonant frequency that is different from the first resonant frequency; the second LC resonator unit serves as an impedance matching circuit for the second signal having the second resonant frequency and serves as an open circuit for the first signal having the first resonant frequency. The first filter unit passes signals with the first resonant frequency; and the second filter unit passes signals with the second resonant frequency.

A multilayer resonant circuit component includes a multilayer body in which first electrode layers, which are provided with both coil patterns and capacitor patterns that constitute an LC circuit, are stacked with first insulator layers interposed therebetween. The multilayer body further includes, stacked together with a second insulator layer, at least one of the following: one or more second electrode layers that each include only a capacitor pattern; and a third electrode layer that includes only a coil pattern.

Provided is a stacked electronic component having: a stacked body 1 in which ceramic layers 1a to 1h are stacked, the stacked body having an a upper surface U and side surfaces S; at least one recess portion 8 formed on the upper surface U that indicates at least one of a mark, a letter, or a number; electrodes 3, 4, 5, 6 formed between the layers of the stacked body 1; and a shield layer 9 formed on the upper surface U and the side surfaces S of the stacked body 1. Right below an inner bottom surface of the recess portion 8 of the stacked body 1, there is provided a no-electrode region NE in which the electrodes 3, 4, 5, 6 are not formed, the no-electrode region NE having a thickness which is equal to or larger than a depth of the recess portion 8.

A multiplexer includes: a first terminal; a second terminal; a third terminal; a first filter connected between the first and second terminals, including a first capacitor, a first inductor, and one or more first acoustic wave resonators, and having a first passband; a second filter connected between the first and third terminals, including a second capacitor, a second inductor, and one or more second acoustic wave resonators, and having a second passband higher than the first passband; a substrate having a surface on which at least one first acoustic wave resonator of the one or more first acoustic wave resonators and at least one second acoustic wave resonator of the one or more second acoustic wave resonators are located; and a metal structure located on the surface and located between the at least one first acoustic wave resonator and the at least one second acoustic wave resonator.

Certain aspects of the present disclosure provide a directional coupler. In certain aspects, the directional coupler generally includes a first inductor and a second inductor wirelessly coupled to the first inductor. In certain aspects, the directional coupler generally includes an input port at a first terminal of the first inductor and a transmitted port at a second terminal of the first inductor. In certain aspects, the directional coupler generally includes a coupled port at a first terminal of the second inductor and an isolated port at a second terminal of the second inductor. In certain aspects, the directional coupler generally includes a first complex impedance component directly coupled to the isolated port and a second complex impedance component directly coupled to the coupled port.