Patent classifications
H03H7/427
Noise filter
A noise filter inserted between the power source side and the load side of a main circuit for which noise is reduced to attenuate noise of the main circuit using a filter circuit including the coil and the capacitor. In the noise filter, the board ground pattern is separated into a plurality of board ground patterns, the separated board ground patterns are connected to a common ground member present outside the board, the separated board ground patterns are formed as solid patterns, and adjacent board ground patterns of the separated board ground patterns are disposed so as to have a spacing equal to or less than a predetermined distance.
FILTER COMPONENT ASSEMBLY KIT, FILTER COMPONENT, AND METHOD FOR MANUFACTURING THE FILTER COMPONENT
A filter component assembly kit includes a bobbin that is configured with first and second members and a core that is in a quadrangular frame shape. When the first member is assembled with the second member, a through hole is formed in the bobbin. The through hole extends in a first direction. The core is configured with first and second extension bars. The first and second extension bars extend in parallel in the first direction. When the first extension bar is disposed in the through hole of the bobbin, rotation of the core around the first extension bar is prevented. First allowance of the first extension bar in a second direction, which is perpendicular to the first direction, in the through hole is larger than second allowance of the first extension bar in a third direction, which is perpendicular to the first and second directions, in the through hole.
COMMON MODE FILTER
A common mode filter includes: a body including a filter portion; first and second external electrodes each including an electrode layer including conductive particles, intermetallic compound (IMC) formation particles, and a resin, and disposed on an external surface of the body; and first and second coils disposed in the filter portion, the first and second coils being connected through lead portions to the electrode layers of the first and second external electrodes, respectively. The conductive particles include a first conductive particle and a second conductive particle having a diameter smaller than that of the first conductive particle.
MAGNETICALLY COUPLED CONTACTLESS DAMPER
According to an aspect, an inductor damper circuit includes a shared magnetic core, a primary winding, and a secondary winding. The primary winding includes an inductor winding of a first wire gauge wound about the shared magnetic core. The secondary winding includes a resistive damper winding of a second wire gauge that is less than the first wire gauge and wound about the shared magnetic core in contactless magnetic coupling with the primary winding.
COMMON MODE FILTER
A common mode filter includes a filter portion and an electrostatic protection portion disposed on the filter portion. The electrostatic protection portion includes first and second discharge electrodes spaced apart from each other, a discharge layer disposed between the first and second discharge electrodes, and a first insulating layer cover an upper surface of the discharge layer and including flat first insulating particles and spherical second insulating particles.
Common mode filter
A common mode filter suppressing a reflection of a common mode noise and sufficiently removing the common mode noise of 2 GHz or less includes: a signal coil spirally formed in a dielectric layer of a multilayer structure, and serially inserted and connected to one of the differential signal lines; a signal coil inserted and connected to the other differential signal line and formed in the dielectric layer so as to face the signal coil through the dielectric layer; a control coil formed in the dielectric layer so as to be sandwiched between the first and second signal coils interposing the dielectric layer and wound in the same direction as the signal coil; and an embedded resistor connected to at least one of an outer peripheral end or an inner peripheral end of the control coil, thus forming a feedback loop circuit by the control coil and the embedded resistor.
COMMON MODE CHOKE COIL AND ELECTRONIC APPARATUS
A common mode choke coil includes a differential transmission line including first and second signal lines, a main circuit including a first coil provided in the first signal line, and a second coil provided in the second signal line and connected to the first coil by magnetic field coupling, and a parallel resonance circuit including a third coil connected to both the first and second coils by magnetic field coupling, and a first capacitor electrically connected in parallel to the third coil. In the common mode choke coil, a first resonant frequency of the main circuit is equal or substantially equal to a second resonant frequency of the parallel resonance circuit.
CONDUCTIVE PATH WITH NOISE FILTER
A conductive path with noise filter that enables an effective reduction in a surge noise in a specific frequency band is provided. A conductive path with noise filter includes conductive path main bodies, insulating layers that respectively surround the conductive path main bodies, conductive layers that are respectively provided to correspond to the conductive path main bodies with the insulating layers being sandwiched between the conductive layers and the conductive path main bodies and that respectively form capacitors in combination with the conductive path main bodies, and inductors connected to the conductive layers.
EM AND RF MITIGATION SILICON STRUCTURES IN STACKED DIE MICROPROCESSORS FOR DIE TO PLATFORM AND DIE-DIE RF NOISE SUPPRESSION
Embodiments disclosed herein include electronic packages and their components. In an embodiment, an electronic package comprises a package substrate and a base die over the package substrate. In an embodiment, the electronic package further comprises a plurality of chiplets over the base die. In an embodiment, the base die comprises a substrate, a first metal layer and a second metal layer between the substrate and the plurality of chiplets, and a third metal layer and a fourth metal layer between the package substrate and the substrate. In an embodiment, a filter is integrated into one or more layers of the base die.
Common mode noise restrainer applicable to ethernet
The present invention discloses a common mode noise restrainer applicable to Ethernet, comprising: a circuit side configured to connect with an integrated circuit; a cable side configured to connect with a cable; a plurality of transformers set between the circuit side and the cable side; and a plurality of common mode chokes composed of a first part of the common mode chokes and a second part of the common mode chokes in which the first part of the common mode chokes is set between the circuit side and the plurality of transformers and the second part of the common mode chokes is set between the cable side and the plurality of transformers while the one or more transformer(s) connected with the first part of the common mode chokes are not identical to the one or more transformer(s) connected with the second part of the common mode chokes.